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1. 发明授权

US5330574A Electrode forming apparatus 失效
标题翻译：电极成型装置
公开(公告)号：US5330574A
公开(公告)日：1994-07-19
申请号：US861129
申请日：1992-03-31
申请人： Tadahiro Nakagawa , Shizuma Tazuke , Mitsuro Hamuro , Hirokazu Higuchi , Katsuyuki Moriyasu , Akihiko Takahashi
发明人： Tadahiro Nakagawa , Shizuma Tazuke , Mitsuro Hamuro , Hirokazu Higuchi , Katsuyuki Moriyasu , Akihiko Takahashi
IPC分类号： H01G13/00 , H05K3/34 , H05K13/02 , B05C3/18 , B05C11/04
CPC分类号： H05K13/028 , H01G13/006
摘要： An electrode forming apparatus comprises a recovery blade for collecting electrode paste on the bottom surface of a dipping vessel toward a first end of the dipping vessel and a levelling blade for levelling the electrode paste, being collected toward the first end, toward a second end of the dipping vessel for adjusting the same to a constant film thickness. The recovery blade and the levelling blade are supported by a blade support frame, which is horizontally reciprocated with respect to the dipping vessel. The recovery blade is vertically moved by a cylinder, while the vertical position of the levelling blade is finely controlled by a levelling control motor. Thus, the film thickness of the electrode paste can be accurately adjusted with excellent repeatability, thereby carrying out homogeneous electrode application.
摘要翻译：电极形成装置包括：回收刀片，用于在浸渍容器的底表面上朝向浸渍容器的第一端收集电极浆料;以及调平刀片，用于使电极浆料平整，朝向第一端收集，用于将其调节到恒定膜厚度的浸渍容器。回收叶片和调平叶片由相对于浸渍容器水平往复运动的叶片支撑框架支撑。回收叶片由圆柱体垂直移动，而平整叶片的垂直位置由调平控制马达精细控制。因此，可以以优异的重复性精确地调节电极浆料的膜厚，从而进行均匀的电极应用。

2. 发明授权

US5547511A Electrode forming system for chip components 失效
标题翻译：芯片组件电极成型系统
公开(公告)号：US5547511A
公开(公告)日：1996-08-20
申请号：US162680
申请日：1993-12-06
申请人： Mitsuro Hamuro , Hirokazu Higuchi , Tadahiro Nakagawa , Akihiko Takahashi
发明人： Mitsuro Hamuro , Hirokazu Higuchi , Tadahiro Nakagawa , Akihiko Takahashi
IPC分类号： H01C17/06 , H01C17/28 , H01G13/00 , H01L21/00 , B05C3/00
CPC分类号： H01L21/67138 , H01C17/28 , H01G13/006 , Y10S414/135 , Y10S414/14
摘要： An electrode forming system automatically carries out overall steps of charging chip components, coating electrode material on both ends of the components and discharging the components using a holding plate, a guide plate and a spacer. This system comprises a charger, a transferer, an electrode coater, a drying furnace, a holding plate standby means, a spacer storage means, a holding plate storage means, a discharger, a transport robot, conveyor means and a control unit. Movements of these apparatus are integratedly controlled by the control unit. The robot transports the holding plate, the guide plate or the spacer among these apparatus arranged within its working area.
摘要翻译：电极形成系统自动地执行芯片部件的充电的整个步骤，在部件的两端涂覆电极材料并使用保持板，引导板和间隔件排出部件。该系统包括充电器，转移器，电极涂布机，干燥炉，保持板备用装置，间隔件存储装置，保持板存储装置，放电器，输送机器人，输送装置和控制单元。这些装置的运动由控制单元综合控制。这些装置中的机器人在其工作区域内传送保持板，引导板或间隔件。

3. 发明授权

US5275661A Dipping apparatus 失效
标题翻译：浸渍装置
公开(公告)号：US5275661A
公开(公告)日：1994-01-04
申请号：US848258
申请日：1992-03-09
申请人： Tadahiro Nakagawa , Shizuma Tazuke , Satoshi Omuro , Kiyoshi Yoshida , Nobuaki Kashiwagi , Takashi Kimoto
发明人： Tadahiro Nakagawa , Shizuma Tazuke , Satoshi Omuro , Kiyoshi Yoshida , Nobuaki Kashiwagi , Takashi Kimoto
IPC分类号： H01G13/00 , H05K13/02 , B05C3/00
CPC分类号： H01G13/006 , H05K13/028
摘要： A chucking portion (10) is supported at the lower part of a dip head portion (2) to be vertically movable in a horizontal state through four shafts. Two diagonally positioned two shafts 11a, 11b are formed by ball screws, and the other two (11c, 11d) serve as guide shafts. The dip head portion (2) contains a motor (12) for synchronously driving the two ball screws, and the chucking portion (10) horizontally engages a holding plate (A) holding a number of chip type electronic components (B) to downwardly direct the same. A dipping vessel (7) having a bottom surface which is coated with a thin film of paste is horizontally arranged under the dip head portion (2). Thus, it is possible to maintain the holding plate in parallel with the paste, for applying electrodes to the chip type electronic components with high accuracy.
摘要翻译：夹头部分（10）支撑在浸渍头部分（2）的下部，以水平状态通过四个轴垂直移动。两个对角定位的两个轴11a，11b由滚珠丝杠形成，另外两个（11c，11d）用作导向轴。浸渍头部分（2）包括用于同步驱动两个滚珠丝杠的马达（12），并且夹持部分（10）水平地接合保持多个芯片型电子部件（B）的保持板（A），以向下直接一样。在浸渍头部分（2）下方水平地设置具有涂覆有糊状物薄膜的底表面的浸渍容器（7）。因此，可以将保持板与糊料平行地保持，用于以高精度将电极施加到芯片型电子部件。

4. 发明授权

US5249906A Press machine for chip type electronic components 失效
标题翻译：压片机用于芯片型电子元器件
公开(公告)号：US5249906A
公开(公告)日：1993-10-05
申请号：US848244
申请日：1992-03-09
申请人： Tadahiro Nakagawa , Shizuma Tazuke , Satoshi Omuro , Kiyoshi Yoshida , Nobuaki Kashiwagi , Takashi Kimoto , Naoyuki Mori , Hidemasa Iwami , Shigeo Hayashi , Nobuyuki Hayashi , Toru Matsumura
发明人： Tadahiro Nakagawa , Shizuma Tazuke , Satoshi Omuro , Kiyoshi Yoshida , Nobuaki Kashiwagi , Takashi Kimoto , Naoyuki Mori , Hidemasa Iwami , Shigeo Hayashi , Nobuyuki Hayashi , Toru Matsumura
IPC分类号： H05K13/02 , B65G65/00
CPC分类号： H05K13/028
摘要： Pin head mounting members are rotatably mounted on a horizontal spindle above a table which horizontally supports a holding, plate holding chip type electronic components. The spindle is vertically movable by a vertical cylinder. Each pin head mounting member is shaped as a rectangular sleeve. A mounting surface is formed on each side portion of the pin head mounting member. A pin head each having a number of press pin is detachably mounted on each of the mounting surfaces A locking pin is provided on an upper end portion of the spindle for locking the pin head mounting members every 90.degree.. Thus, it is possible to efficiently replace press pins in response to a type change of chip type electronic components, as well as to quickly exchange a broken press pin.
摘要翻译：针头安装构件可旋转地安装在水平支架上的水平主轴上，水平支撑保持板保持芯片型电子部件。主轴可垂直移动。每个针头安装构件被成形为矩形套筒。安装表面形成在销头安装部件的每个侧部上。每个具有多个压销的销头可拆卸地安装在每个安装表面上。锁定销设置在主轴的上端部，每90度锁定销头安装构件。因此，可以根据芯片型电子部件的类型变化有效地更换压针，并且可以快速更换破损的压针。

5. 发明授权

US5632813A Electrode forming apparatus for chip type electronic components 失效
标题翻译：芯片式电子部件用电极形成装置
公开(公告)号：US5632813A
公开(公告)日：1997-05-27
申请号：US840838
申请日：1992-02-25
申请人： Tadahiro Nakagawa , Shizuma Tazuke , Satoshi Omuro , Kiyoshi Yoshida , Nobuaki Kashiwagi , Takashi Kimoto
发明人： Tadahiro Nakagawa , Shizuma Tazuke , Satoshi Omuro , Kiyoshi Yoshida , Nobuaki Kashiwagi , Takashi Kimoto
IPC分类号： H01C17/28 , H01G13/00 , H05K13/02 , B05C13/00
CPC分类号： H05K13/028
摘要： A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360.degree. for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.
摘要翻译：浸渍机具有夹持部，用于将保持板向下直接夹持由保持板保持的芯片部件和设置在夹持部下方的浸渍容器，该浸渍容器涂覆有电极浆料的薄膜。输送机水平地将保持板保持下来的芯片组件，涂覆有电极浆料到干燥炉。干燥炉接收保持芯片部件的保持板，并将其旋转360度，以干燥电极浆料。因此，成形电极在芯片部件的侧面具有均匀的宽度，并且保护电极浆料免于灰尘等异物粘附，从而可以制造质量稳定的芯片部件。

6. 发明授权

US5080380A Magnetic chuck 失效
标题翻译：磁性卡盘
公开(公告)号：US5080380A
公开(公告)日：1992-01-14
申请号：US538536
申请日：1990-06-15
申请人： Tadahiro Nakagawa , Shizuma Tazuke , Masatoshi Arishiro
发明人： Tadahiro Nakagawa , Shizuma Tazuke , Masatoshi Arishiro
IPC分类号： B25J15/06 , B23Q3/154 , B65G47/91 , H01F7/02 , H05K13/02
CPC分类号： B23Q3/1546 , B65G47/91 , Y10T279/23
摘要： A plurality of vertically extending cylinders are formed in the interior of a chuck body providing a chucking face on its lower surface. Pistons, in which permanent magnets are embedded, are vertically movably provided in respective ones of the cylinders. When compressed air is introduced into upper portions of the cylinders, the pistons are downwardly displaced so that the permanent magnets are relatively approached to the lower surface of the chuck body. Thus, the chucking face is supplied with magnetic force exceeding a prescribed level, to attract a holder holding electronic component chips, for example. When compressed air is introduced into lower portions of the cylinders, on the other hand, the pistons are upwardly displaced so that the permanent magnets are relatively separated from the lower surface of the chuck body. Thus, the chucking face is supplied with no magnetic force exceeding the prescribed level, so that the holder is separated from the chuck body.
摘要翻译：多个垂直延伸的气缸形成在卡盘体的内部，其在其下表面上提供卡盘面。其中嵌有永磁体的活塞可垂直地可移动地设置在相应的气缸中。当压缩空气被引入气缸的上部时，活塞向下移位，使得永磁体相对靠近卡盘体的下表面。因此，卡盘面被提供超过规定水平的磁力，以吸引例如保持电子部件芯片的保持架。另一方面，当将压缩空气引入气缸的下部时，活塞向上移位，使得永磁体与卡盘体的下表面相对分离。因此，夹持面的供给没有超过规定水平的磁力，使得保持器与卡盘体分离。

7. 发明授权

US5248340A Dipping apparatus 失效
标题翻译： DIPPING APPARATUS
公开(公告)号：US5248340A
公开(公告)日：1993-09-28
申请号：US840868
申请日：1992-02-25
申请人： Tadahiro Nakagawa , Shizuma Tazuke
发明人： Tadahiro Nakagawa , Shizuma Tazuke
IPC分类号： H01C17/28 , H01G13/00 , H05K13/02
CPC分类号： H05K13/028
摘要： Take-in and take-out conveyors are provided on horizontal sides of a chucking mechanism, which is adapted to engage a workpiece and vertically move the same, and disposed flush with each other for supplying and discharging the workpiece to and from a position of the chucking mechanism. A dipping vessel is provided immediately under the chucking mechanism at a position lower than the level at which the workpiece is carried by the take-in and take-out conveyors. The take-in and take-out conveyors, which are adapted to carry the workpiece in the same direction and at the same speed, are slid/driven in approaching and separating directions between standby positions, which are opposite to each other across a vertical space of the chucking mechanism, and working positions which are located near each other immediately under the chucking mechanism. Thus, it is possible to perform dipping with high accuracy without sliding the chucking portion while protecting the workpiece against vibration and deviation.
摘要翻译：在夹紧机构的水平侧上设置有吸入和取出输送机，该夹紧机构适于与工件接合并垂直移动，并相互平齐地设置，用于将工件供给和排出工件夹紧机构浸渍容器位于夹紧机构正下方的位置，该位置比工件被引入和取出输送机承载的水平低。适合于以相同的方向和相同的速度运送工件的入口和取出输送机在待机位置之间的接近和分离方向上滑动/驱动，该待机位置在垂直空间的夹紧机构，以及位于夹紧机构的正下方相邻的工作位置。因此，可以在不使夹持部滑动的同时高精度地进行浸渍，同时保护工件免受振动和偏差。

8. 发明授权

US4664943A Method of forming external electrodes of chip parts and tool for practicing same 失效
标题翻译：形成芯片部件的外部电极的方法和用于实施的部件的工具
公开(公告)号：US4664943A
公开(公告)日：1987-05-12
申请号：US671585
申请日：1984-11-15
申请人： Koichi Nitta , Kazuma Kabuta , Masami Yamaguchi , Tadahiro Nakagawa , Katsuyuki Moriyasu
发明人： Koichi Nitta , Kazuma Kabuta , Masami Yamaguchi , Tadahiro Nakagawa , Katsuyuki Moriyasu
IPC分类号： B05D5/12 , H01C17/00 , H01C17/28 , H01G4/012 , H01G13/00 , B05C13/02
CPC分类号： H01C17/28 , H01C17/006 , H01G13/006
摘要： A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.
摘要翻译：一种弹性保持芯片部件的同时在芯片部件的两端形成外部电极的方法。该方法包括提供具有弹性材料的第一和第二保持板，该弹性材料设置有从前侧到后侧穿过的多个芯片接收孔，将芯片部件从其前侧推向第一保持板中的接收孔中距离仅足以将所述芯片部分的一端暴露在第一保持板的前表面处，用电极材料涂覆在第一保持板的前表面处露出的芯片部分的一端，第一保持板的前表面与第二保持板的前表面隔开相对的关系，其中相应的保持板中的接收孔对准，推动由第一保持板保持的芯片部分的另一端以转移芯片部分进入第二保持板的接收孔中，其一端被足够远的电极材料涂覆所述第二保持板的接收孔离开没有涂覆有在第二保持板的前表面露出的电极材料的芯片部件的另一端，涂覆在前表面露出的芯片部件的另一端的第二保持板，并且通过从第二保持板的接收孔的内侧推动芯片部件的一端，将芯片部件推出第二保持板。

9. 发明授权

US4788931A Tool for forming external electrodes of chip parts 失效
标题翻译：用于形成芯片部件外部电极的工具
公开(公告)号：US4788931A
公开(公告)日：1988-12-06
申请号：US16714
申请日：1987-02-19
申请人： Koichi Nitta , Kazuma Kabuta , Masami Yamaguchi , Tadahiro Nakagawa , Katsuyuki Moriyasu
发明人： Koichi Nitta , Kazuma Kabuta , Masami Yamaguchi , Tadahiro Nakagawa , Katsuyuki Moriyasu
IPC分类号： B05D5/12 , H01C17/00 , H01C17/28 , H01G4/012 , H01G13/00 , B05C13/02
CPC分类号： H01C17/28 , H01C17/006 , H01G13/006
摘要： A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate, with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.
摘要翻译：一种弹性保持芯片部件的同时在芯片部件的两端形成外部电极的方法。该方法包括提供具有弹性材料的第一和第二保持板，该弹性材料设置有从前侧到后侧穿过的多个芯片接收孔，将芯片部件从其前侧推向第一保持板中的接收孔中距离仅足以使所述芯片部分的一端暴露在第一保持板的前表面处，用电极材料涂覆在第一保持板的前表面露出的芯片部分的一端，放置第一保持板的前表面与第二保持板的前表面隔开相对的关系，其中相应的保持板中的接收孔对齐，推动由第一保持板保持的芯片部分的另一端以转移芯片部分进入第二保持板中的接收孔中，其一端涂覆有足够远的电极材料所述第二保持板的接收孔离开没有涂覆有在第二保持板的前表面露出的电极材料的芯片部件的另一端，涂覆在前表面露出的芯片部件的另一端的第二保持板，并且通过从第二保持板的接收孔的内侧推动芯片部件的一端，将芯片部件推出第二保持板。

10. 发明授权

US06715197B2 Laminated ceramic electronic component and method for manufacturing same 有权
标题翻译：层压陶瓷电子部件及其制造方法
公开(公告)号：US06715197B2
公开(公告)日：2004-04-06
申请号：US09862205
申请日：2001-05-22
申请人： Shingo Okuyama , Tadahiro Nakagawa
发明人： Shingo Okuyama , Tadahiro Nakagawa
IPC分类号： H01S400
CPC分类号： H01F17/0013 , H01F41/043 , H01F2017/0026 , H01G4/30 , H03H3/00 , H03H7/0115 , H03H2001/0085 , H05K3/4629 , Y10T29/49002 , Y10T29/4902 , Y10T29/49126 , Y10T29/49155 , Y10T29/5317 , Y10T29/532 , Y10T29/53204
摘要： A laminated ceramic electronic component significantly simplifies a step of forming external electrodes and has reliable electrical connection between an internal electrode and the external electrodes. A method for manufacturing the laminated ceramic electronic component includes the steps of forming composite sheets each having a conductor and a ceramic layer provided at the sides of the conductor on a carrier film, laminating the composite sheets with each other for forming a mother laminate, cutting the mother laminate in the thickness direction thereof so as to divide the conductor for forming laminates each forming one laminated ceramic electronic component, in which the conductor is exposed on the cut surface of the laminate, and firing the laminate so as to simultaneously form external electrodes from the exposed conductors and a sintered ceramic body.
摘要翻译：层叠陶瓷电子部件显着简化了形成外部电极的步骤，并且在内部电极和外部电极之间具有可靠的电连接。层叠陶瓷电子部件的制造方法包括以下步骤：在载体膜上形成导体和设置在导体侧的陶瓷层的复合片，将复合片彼此层叠以形成母层压体，切割母层叠体在其厚度方向上分割用于形成层压体的导体，每个层叠体形成一个层压陶瓷电子部件，其中导体暴露在层压体的切割表面上，并且对该层压体进行烧制以同时形成外部电极从暴露的导体和烧结陶瓷体。

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