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1. 发明授权

US5249906A Press machine for chip type electronic components 失效
标题翻译：压片机用于芯片型电子元器件
公开(公告)号：US5249906A
公开(公告)日：1993-10-05
申请号：US848244
申请日：1992-03-09
申请人： Tadahiro Nakagawa , Shizuma Tazuke , Satoshi Omuro , Kiyoshi Yoshida , Nobuaki Kashiwagi , Takashi Kimoto , Naoyuki Mori , Hidemasa Iwami , Shigeo Hayashi , Nobuyuki Hayashi , Toru Matsumura
发明人： Tadahiro Nakagawa , Shizuma Tazuke , Satoshi Omuro , Kiyoshi Yoshida , Nobuaki Kashiwagi , Takashi Kimoto , Naoyuki Mori , Hidemasa Iwami , Shigeo Hayashi , Nobuyuki Hayashi , Toru Matsumura
IPC分类号： H05K13/02 , B65G65/00
CPC分类号： H05K13/028
摘要： Pin head mounting members are rotatably mounted on a horizontal spindle above a table which horizontally supports a holding, plate holding chip type electronic components. The spindle is vertically movable by a vertical cylinder. Each pin head mounting member is shaped as a rectangular sleeve. A mounting surface is formed on each side portion of the pin head mounting member. A pin head each having a number of press pin is detachably mounted on each of the mounting surfaces A locking pin is provided on an upper end portion of the spindle for locking the pin head mounting members every 90.degree.. Thus, it is possible to efficiently replace press pins in response to a type change of chip type electronic components, as well as to quickly exchange a broken press pin.
摘要翻译：针头安装构件可旋转地安装在水平支架上的水平主轴上，水平支撑保持板保持芯片型电子部件。主轴可垂直移动。每个针头安装构件被成形为矩形套筒。安装表面形成在销头安装部件的每个侧部上。每个具有多个压销的销头可拆卸地安装在每个安装表面上。锁定销设置在主轴的上端部，每90度锁定销头安装构件。因此，可以根据芯片型电子部件的类型变化有效地更换压针，并且可以快速更换破损的压针。

2. 发明授权

US5244073A Method of pressing chip type electronic components 失效
标题翻译：压片式电子元件的方法
公开(公告)号：US5244073A
公开(公告)日：1993-09-14
申请号：US861308
申请日：1992-03-31
申请人： Naoyuki Mori , Hidemasa Iwami , Shigeo Hayashi , Nobuyuki Hayashi , Toru Matsumura , Mitsuro Hamuro , Hirokazu Higuchi , Akihiko Takahashi
发明人： Naoyuki Mori , Hidemasa Iwami , Shigeo Hayashi , Nobuyuki Hayashi , Toru Matsumura , Mitsuro Hamuro , Hirokazu Higuchi , Akihiko Takahashi
IPC分类号： H05K13/02
CPC分类号： H05K13/028 , Y10T29/53261
摘要： A press machine comprises a holding plate provided with a number of receiving holes at constant arrangement pitches and a pin head having a number of press pins at the same arrangement pitches as the receiving holes. A portion provided with the receiving holes is in the form of a square, while a portion provided with the press pins is also in the form of a square, which has a width identical to that of the portion provided with the receiving holes and a depth half that of the portion provided with the receiving holes. The holding plate is placed on a movable table, which in turn is moved to a first working position to insert a first group of chip type electronic components into the receiving holes provided in a first half region of the holding plate by the press pins, and then moved to a second working position to press a second group of chip type electronic components into the receiving holes provided in a second half region of the holding plate by the press pins. Thus, it is possible to reduce a load applied to the holding plate as well as reactive force applied to the pin head in each pressing operation, while the pin head can be applied to various sizes of holding plates in common.
摘要翻译：一种压机包括：设置有多个以恒定布置间距的接收孔的保持板和具有与接收孔相同的布置间距的多个按压销的销头。设置有接收孔的部分是正方形的，而设置有压销的部分也是方形的形状，其宽度与设置有接收孔的部分的宽度相同，并且深度设置有接收孔的部分的一半。保持板被放置在可动台上，该移动台又移动到第一工作位置，以将第一组芯片型电子部件插入通过压销设置在保持板的第一半区域中的接收孔中，以及然后移动到第二工作位置，以通过压脚将第二组芯片型电子元件压入设置在保持板的第二半区域的接收孔中。因此，可以在每个按压操作中减小施加到保持板的负载以及施加到销头的反作用力，同时可以将销头应用于各种尺寸的保持板。

3. 发明授权

US06803841B2 Dielectric line, having a dielectric strip fitted in a groove between two contacting conductors 失效
标题翻译：电介质线，具有安装在两个接触导体之间的凹槽中的介质条
公开(公告)号：US06803841B2
公开(公告)日：2004-10-12
申请号：US10294758
申请日：2002-11-15
申请人： Atsushi Saitoh , Hidemasa Iwami , Shinichi Tamura , Hideki Imura
发明人： Atsushi Saitoh , Hidemasa Iwami , Shinichi Tamura , Hideki Imura
IPC分类号： H01P316
CPC分类号： H01P3/122 , H01P3/16
摘要： A dielectric strip is located in a space formed by facing grooves in two conductors. A corner of the groove bottom surface Gb has a sectionally substantial arc form. A groove side surface Gs is tapered such that a gap can be provided between the groove side surface Gs and the side surface of the dielectric strip.
摘要翻译：介质条位于由两个导体中的相对凹槽形成的空间中。凹槽底面Gb的一角具有截面实质的弧形。槽侧表面Gs是锥形的，使得可以在槽侧表面Gs和介质条的侧表面之间设置间隙。

4. 发明授权

US5880553A Electronic component and method of producing same 失效
标题翻译：电子元件及其制造方法
公开(公告)号：US5880553A
公开(公告)日：1999-03-09
申请号：US856925
申请日：1997-05-15
申请人： Motoyuki Okeshi , Ken Taniguchi , Takashi Hashimoto , Makoto Irie , Hiroyuki Kawakami , Choichiro Fujii , Michinobu Maesaka , Hidemasa Iwami , Takashi Iwamoto
发明人： Motoyuki Okeshi , Ken Taniguchi , Takashi Hashimoto , Makoto Irie , Hiroyuki Kawakami , Choichiro Fujii , Michinobu Maesaka , Hidemasa Iwami , Takashi Iwamoto
IPC分类号： H01L41/047 , H03H9/05 , H03H9/10 , H03H9/13 , H03H9/17 , H03H9/56 , H03H9/58 , H01L41/08
CPC分类号： H03H9/58 , H01L41/0475 , H03H9/0514 , H03H9/1014 , H03H9/176 , H03H9/56 , H03H9/562 , H03H9/581 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/4848 , Y10T29/42 , Y10T29/4921
摘要： An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element. Input and output lead terminals are connected to the electrodes on the substrate, while a grounding lead terminal is connected to the cap.
摘要翻译：电子部件具有基本上减小的尺寸，并且适于以低成本生产，而不会由于在支撑压电元件的基板上实现压电元件和电极图案之间的电连接而容易地实现元件的优良品质。压电元件具有形成在其下表面上的下电极和形成在其上表面上的上电极。压电元件固定到基板上，使得下电极通过导电粘合剂结合到设置在基板上的电极。导电线固定在压电元件的上电极上。将金属盖结合到基板上，以覆盖并密封基板上的压电元件。盖通过导线在其内表面处接触，从而在盖和压电元件的上电极之间实现电连接。输入和输出引线端子连接到基板上的电极，而接地引线端子连接到盖子。

5. 发明授权

US06571442B1 Method of making an electronic component 有权
标题翻译：制作电子元件的方法
公开(公告)号：US06571442B1
公开(公告)日：2003-06-03
申请号：US09593372
申请日：2000-06-15
申请人： Motoyuki Okeshi , Ken Taniguchi , Takashi Hashimoto , Makoto Irie , Hiroyuki Kawakami , Choichiro Fujii , Michinobu Maesaka , Hidemasa Iwami , Takashi Iwamoto
发明人： Motoyuki Okeshi , Ken Taniguchi , Takashi Hashimoto , Makoto Irie , Hiroyuki Kawakami , Choichiro Fujii , Michinobu Maesaka , Hidemasa Iwami , Takashi Iwamoto
IPC分类号： H04R1700
CPC分类号： H03H9/58 , H01L41/0475 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/4848 , H03H9/0514 , H03H9/1014 , H03H9/176 , H03H9/56 , H03H9/562 , H03H9/581 , Y10T29/42 , Y10T29/4921 , H01L2924/00014 , H01L2924/00
摘要： An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element. Input and output lead terminals are connected to the electrodes on the substrate, while a grounding lead terminal is connected to the cap.
摘要翻译：电子部件具有基本上减小的尺寸，并且适于以低成本生产，而不会由于在支撑压电元件的基板上实现压电元件和电极图案之间的电连接而容易地实现元件的优良品质。压电元件具有形成在其下表面上的下电极和形成在其上表面上的上电极。压电元件固定到基板上，使得下电极通过导电粘合剂结合到设置在基板上的电极。导电线固定在压电元件的上电极上。将金属盖结合到基板上，以覆盖并密封基板上的压电元件。盖通过导线在其内表面处接触，从而在盖和压电元件的上电极之间实现电连接。输入和输出引线端子连接到基板上的电极，而接地引线端子连接到盖子。

6. 发明授权

US6141845A Method of producing electronic component 有权
标题翻译：电子元器件生产方法
公开(公告)号：US6141845A
公开(公告)日：2000-11-07
申请号：US132424
申请日：1998-08-11
申请人： Motoyuki Okeshi , Ken Taniguchi , Takashi Hashimoto , Makoto Irie , Hiroyuki Kawakami , Choichiro Fujii , Michinobu Maesaka , Hidemasa Iwami , Takashi Iwamoto
发明人： Motoyuki Okeshi , Ken Taniguchi , Takashi Hashimoto , Makoto Irie , Hiroyuki Kawakami , Choichiro Fujii , Michinobu Maesaka , Hidemasa Iwami , Takashi Iwamoto
IPC分类号： H01L41/047 , H03H9/05 , H03H9/10 , H03H9/13 , H03H9/17 , H03H9/56 , H03H9/58 , H04R17/00
CPC分类号： H03H9/58 , H01L41/0475 , H03H9/0514 , H03H9/1014 , H03H9/176 , H03H9/56 , H03H9/562 , H03H9/581 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/4848 , Y10T29/42 , Y10T29/4921
摘要： An electronic component has a substantially reduced size and is adapted to be produced at low costs without variation in superior quality of the component because of the ease of achieving electrical connection between a piezoelectric element and a electrode pattern on a substrate supporting the piezoelectric element. The piezoelectric element has a lower electrode formed on the lower surface thereof and an upper electrode formed on the upper surface thereof. The piezoelectric element is fixed to the substrate such that the lower electrode is bonded to an electrode provided on the substrate by a conductive adhesive. A conductive wire is fixed to the upper electrode of the piezoelectric element. A metallic cap is bonded to the substrate so as to cover and seal the piezoelectric element on the substrate. The cap is contacted at its inner surface by the wire, whereby an electrical connection is achieved between the cap and the upper electrode of the piezoelectric element. Input and output lead terminals are connected to the electrodes on the substrate, while a grounding lead terminal is connected to the cap.
摘要翻译：电子部件具有基本上减小的尺寸，并且适于以低成本生产，而不会由于在支撑压电元件的基板上实现压电元件和电极图案之间的电连接而容易地实现元件的优良品质。压电元件具有形成在其下表面上的下电极和形成在其上表面上的上电极。压电元件固定到基板上，使得下电极通过导电粘合剂结合到设置在基板上的电极。导电线固定在压电元件的上电极上。将金属盖结合到基板上，以覆盖并密封基板上的压电元件。盖通过导线在其内表面处接触，从而在盖和压电元件的上电极之间实现电连接。输入和输出引线端子连接到基板上的电极，而接地引线端子连接到盖子。

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