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    • 1. 发明授权
    • Method of forming external electrodes of chip parts and tool for
practicing same
    • 形成芯片部件的外部电极的方法和用于实施的部件的工具
    • US4664943A
    • 1987-05-12
    • US671585
    • 1984-11-15
    • Koichi NittaKazuma KabutaMasami YamaguchiTadahiro NakagawaKatsuyuki Moriyasu
    • Koichi NittaKazuma KabutaMasami YamaguchiTadahiro NakagawaKatsuyuki Moriyasu
    • B05D5/12H01C17/00H01C17/28H01G4/012H01G13/00B05C13/02
    • H01C17/28H01C17/006H01G13/006
    • A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.
    • 一种弹性保持芯片部件的同时在芯片部件的两端形成外部电极的方法。 该方法包括提供具有弹性材料的第一和第二保持板,该弹性材料设置有从前侧到后侧穿过的多个芯片接收孔,将芯片部件从其前侧推向第一保持板中的接收孔中 距离仅足以将所述芯片部分的一端暴露在第一保持板的前表面处,用电极材料涂覆在第一保持板的前表面处露出的芯片部分的一端, 第一保持板的前表面与第二保持板的前表面隔开相对的关系,其中相应的保持板中的接收孔对准,推动由第一保持板保持的芯片部分的另一端以转移芯片部分 进入第二保持板的接收孔中,其一端被足够远的电极材料涂覆 所述第二保持板的接收孔离开没有涂覆有在第二保持板的前表面露出的电极材料的芯片部件的另一端,涂覆在前表面露出的芯片部件的另一端 的第二保持板,并且通过从第二保持板的接收孔的内侧推动芯片部件的一端,将芯片部件推出第二保持板。
    • 2. 发明授权
    • Tool for forming external electrodes of chip parts
    • 用于形成芯片部件外部电极的工具
    • US4788931A
    • 1988-12-06
    • US16714
    • 1987-02-19
    • Koichi NittaKazuma KabutaMasami YamaguchiTadahiro NakagawaKatsuyuki Moriyasu
    • Koichi NittaKazuma KabutaMasami YamaguchiTadahiro NakagawaKatsuyuki Moriyasu
    • B05D5/12H01C17/00H01C17/28H01G4/012H01G13/00B05C13/02
    • H01C17/28H01C17/006H01G13/006
    • A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate, with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.
    • 一种弹性保持芯片部件的同时在芯片部件的两端形成外部电极的方法。 该方法包括提供具有弹性材料的第一和第二保持板,该弹性材料设置有从前侧到后侧穿过的多个芯片接收孔,将芯片部件从其前侧推向第一保持板中的接收孔中 距离仅足以使所述芯片部分的一端暴露在第一保持板的前表面处,用电极材料涂覆在第一保持板的前表面露出的芯片部分的一端,放置 第一保持板的前表面与第二保持板的前表面隔开相对的关系,其中相应的保持板中的接收孔对齐,推动由第一保持板保持的芯片部分的另一端以转移芯片 部分进入第二保持板中的接收孔中,其一端涂覆有足够远的电极材料 所述第二保持板的接收孔离开没有涂覆有在第二保持板的前表面露出的电极材料的芯片部件的另一端,涂覆在前表面露出的芯片部件的另一端 的第二保持板,并且通过从第二保持板的接收孔的内侧推动芯片部件的一端,将芯片部件推出第二保持板。
    • 10. 发明授权
    • Magnetic chuck
    • 磁性卡盘
    • US5080380A
    • 1992-01-14
    • US538536
    • 1990-06-15
    • Tadahiro NakagawaShizuma TazukeMasatoshi Arishiro
    • Tadahiro NakagawaShizuma TazukeMasatoshi Arishiro
    • B25J15/06B23Q3/154B65G47/91H01F7/02H05K13/02
    • B23Q3/1546B65G47/91Y10T279/23
    • A plurality of vertically extending cylinders are formed in the interior of a chuck body providing a chucking face on its lower surface. Pistons, in which permanent magnets are embedded, are vertically movably provided in respective ones of the cylinders. When compressed air is introduced into upper portions of the cylinders, the pistons are downwardly displaced so that the permanent magnets are relatively approached to the lower surface of the chuck body. Thus, the chucking face is supplied with magnetic force exceeding a prescribed level, to attract a holder holding electronic component chips, for example. When compressed air is introduced into lower portions of the cylinders, on the other hand, the pistons are upwardly displaced so that the permanent magnets are relatively separated from the lower surface of the chuck body. Thus, the chucking face is supplied with no magnetic force exceeding the prescribed level, so that the holder is separated from the chuck body.
    • 多个垂直延伸的气缸形成在卡盘体的内部,其在其下表面上提供卡盘面。 其中嵌有永磁体的活塞可垂直地可移动地设置在相应的气缸中。 当压缩空气被引入气缸的上部时,活塞向下移位,使得永磁体相对靠近卡盘体的下表面。 因此,卡盘面被提供超过规定水平的磁力,以吸引例如保持电子部件芯片的保持架。 另一方面,当将压缩空气引入气缸的下部时,活塞向上移位,使得永磁体与卡盘体的下表面相对分离。 因此,夹持面的供给没有超过规定水平的磁力,使得保持器与卡盘体分离。