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1. 发明授权

US4664943A Method of forming external electrodes of chip parts and tool for practicing same 失效
标题翻译：形成芯片部件的外部电极的方法和用于实施的部件的工具
公开(公告)号：US4664943A
公开(公告)日：1987-05-12
申请号：US671585
申请日：1984-11-15
申请人： Koichi Nitta , Kazuma Kabuta , Masami Yamaguchi , Tadahiro Nakagawa , Katsuyuki Moriyasu
发明人： Koichi Nitta , Kazuma Kabuta , Masami Yamaguchi , Tadahiro Nakagawa , Katsuyuki Moriyasu
IPC分类号： B05D5/12 , H01C17/00 , H01C17/28 , H01G4/012 , H01G13/00 , B05C13/02
CPC分类号： H01C17/28 , H01C17/006 , H01G13/006
摘要： A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.
摘要翻译：一种弹性保持芯片部件的同时在芯片部件的两端形成外部电极的方法。该方法包括提供具有弹性材料的第一和第二保持板，该弹性材料设置有从前侧到后侧穿过的多个芯片接收孔，将芯片部件从其前侧推向第一保持板中的接收孔中距离仅足以将所述芯片部分的一端暴露在第一保持板的前表面处，用电极材料涂覆在第一保持板的前表面处露出的芯片部分的一端，第一保持板的前表面与第二保持板的前表面隔开相对的关系，其中相应的保持板中的接收孔对准，推动由第一保持板保持的芯片部分的另一端以转移芯片部分进入第二保持板的接收孔中，其一端被足够远的电极材料涂覆所述第二保持板的接收孔离开没有涂覆有在第二保持板的前表面露出的电极材料的芯片部件的另一端，涂覆在前表面露出的芯片部件的另一端的第二保持板，并且通过从第二保持板的接收孔的内侧推动芯片部件的一端，将芯片部件推出第二保持板。

2. 发明授权

US4788931A Tool for forming external electrodes of chip parts 失效
标题翻译：用于形成芯片部件外部电极的工具
公开(公告)号：US4788931A
公开(公告)日：1988-12-06
申请号：US16714
申请日：1987-02-19
申请人： Koichi Nitta , Kazuma Kabuta , Masami Yamaguchi , Tadahiro Nakagawa , Katsuyuki Moriyasu
发明人： Koichi Nitta , Kazuma Kabuta , Masami Yamaguchi , Tadahiro Nakagawa , Katsuyuki Moriyasu
IPC分类号： B05D5/12 , H01C17/00 , H01C17/28 , H01G4/012 , H01G13/00 , B05C13/02
CPC分类号： H01C17/28 , H01C17/006 , H01G13/006
摘要： A method of forming external electrodes at both ends of chip parts while elastically holding the chip parts. The method includes providing first and second holding plates having elastic material provided with a plurality of chip receiving holes passing therethrough from the front side to the reverse side thereof, pushing chip parts into the receiving holes in the first holding plate from the front side thereof a distance only sufficient to have the one ends of said chip parts exposed at the front surface of the first holding plate, coating the one ends of the chip parts which are exposed at the front surface of the first holding plate, with an electrode material, placing the front surface of the first holding plate in spaced opposed relationship to the front surface of the second holding plate with the receiving holes in the respective holding plates aligned, pushing the other ends of the chip parts held by the first holding plate to transfer the chip parts into the receiving holes in the second holding plate with the one ends which are coated with the electrode material sufficiently far into the receiving holes of the second holding plate to leave the other ends of the chip parts which are not coated with electrode material exposed at the front surface of the second holding plate, coating the other ends of the chip parts which are exposed at the front surface of the second holding plate with an electrode material, and pushing the chip parts out of the second holding plate by pushing on the one ends of the chip parts from inside the receiving holes of the second holding plate.
摘要翻译：一种弹性保持芯片部件的同时在芯片部件的两端形成外部电极的方法。该方法包括提供具有弹性材料的第一和第二保持板，该弹性材料设置有从前侧到后侧穿过的多个芯片接收孔，将芯片部件从其前侧推向第一保持板中的接收孔中距离仅足以使所述芯片部分的一端暴露在第一保持板的前表面处，用电极材料涂覆在第一保持板的前表面露出的芯片部分的一端，放置第一保持板的前表面与第二保持板的前表面隔开相对的关系，其中相应的保持板中的接收孔对齐，推动由第一保持板保持的芯片部分的另一端以转移芯片部分进入第二保持板中的接收孔中，其一端涂覆有足够远的电极材料所述第二保持板的接收孔离开没有涂覆有在第二保持板的前表面露出的电极材料的芯片部件的另一端，涂覆在前表面露出的芯片部件的另一端的第二保持板，并且通过从第二保持板的接收孔的内侧推动芯片部件的一端，将芯片部件推出第二保持板。

3. 发明授权

US5330574A Electrode forming apparatus 失效
标题翻译：电极成型装置
公开(公告)号：US5330574A
公开(公告)日：1994-07-19
申请号：US861129
申请日：1992-03-31
申请人： Tadahiro Nakagawa , Shizuma Tazuke , Mitsuro Hamuro , Hirokazu Higuchi , Katsuyuki Moriyasu , Akihiko Takahashi
发明人： Tadahiro Nakagawa , Shizuma Tazuke , Mitsuro Hamuro , Hirokazu Higuchi , Katsuyuki Moriyasu , Akihiko Takahashi
IPC分类号： H01G13/00 , H05K3/34 , H05K13/02 , B05C3/18 , B05C11/04
CPC分类号： H05K13/028 , H01G13/006
摘要： An electrode forming apparatus comprises a recovery blade for collecting electrode paste on the bottom surface of a dipping vessel toward a first end of the dipping vessel and a levelling blade for levelling the electrode paste, being collected toward the first end, toward a second end of the dipping vessel for adjusting the same to a constant film thickness. The recovery blade and the levelling blade are supported by a blade support frame, which is horizontally reciprocated with respect to the dipping vessel. The recovery blade is vertically moved by a cylinder, while the vertical position of the levelling blade is finely controlled by a levelling control motor. Thus, the film thickness of the electrode paste can be accurately adjusted with excellent repeatability, thereby carrying out homogeneous electrode application.
摘要翻译：电极形成装置包括：回收刀片，用于在浸渍容器的底表面上朝向浸渍容器的第一端收集电极浆料;以及调平刀片，用于使电极浆料平整，朝向第一端收集，用于将其调节到恒定膜厚度的浸渍容器。回收叶片和调平叶片由相对于浸渍容器水平往复运动的叶片支撑框架支撑。回收叶片由圆柱体垂直移动，而平整叶片的垂直位置由调平控制马达精细控制。因此，可以以优异的重复性精确地调节电极浆料的膜厚，从而进行均匀的电极应用。

4. 发明授权

US4760916A Wound unit of an electronic components series 失效
标题翻译：电子元件系列的伤口单元
公开(公告)号：US4760916A
公开(公告)日：1988-08-02
申请号：US860097
申请日：1986-05-06
申请人： Fumihiko Kaneko , Katsuyuki Moriyasu
发明人： Fumihiko Kaneko , Katsuyuki Moriyasu
IPC分类号： B65D73/02 , B65D85/672 , B65D85/86 , H05K13/00
CPC分类号： H05K13/003
摘要： A wound unit of an electronic components series comprises a cylindrical core and a tape-shaped electronic components series wound in layers on its circumferential surface. On the periphery of the core, there is formed a slit. The electronic components series include a carrier tape made of a cardboard or the like on which not only the feeding holes having a certain pitch are formed but also many through holes responding to the shape of electronic components to be contained therein are distributed in a longitudinal direction. In each of these through holes are contained electronic components and on both of the main surfaces of the carrier tape, cover tapes are adhered to seal off the through holes. The tip of the electronic components series is inserted into the slit of the core and the electronic components series is wound in layers on the circumferential surface of the core. Adhesion layers are formed on the upper surface of the side of the carrier tape provided with the feeding holes of the electronic component series, each layer of the electronic components series being bonded to the next layer by the adhesion agent.
摘要翻译：电子部件系列的卷绕单元包括圆筒形芯和在其圆周表面上以层缠绕的带状电子部件系列。在芯的周围形成狭缝。电子部件系列包括由纸板等构成的载带，不仅形成了具有一定间距的供给孔，而且还包括响应于要包含的电子部件的形状的许多通孔沿长度方向分布。在这些通孔的每一个都包含电子部件，并且在载带的两个主表面上，覆盖带被粘附以密封通孔。电子部件系列的前端插入到芯的狭缝中，并且电子部件系列被卷绕在芯的圆周表面上。在设置有电子部件系列的供给孔的载带的一侧的上表面上形成有粘接层，电子部件系列的各层通过粘合剂与下一层接合。

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