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    • 3. 发明公开
    • AUTOMATED SUBSTRATE PROCESSING SYSTEMS AND METHODS
    • VERFAHREN UND VORRICHTUNGEN ZUR自动化BEHANDLUNG VON底座
    • EP1023645A4
    • 2004-12-22
    • EP98949782
    • 1998-10-06
    • APPLIED KOMATSU TECHNOLOGY INCHOSOKAWA AKIHIRO
    • HOSOKAWA AKIHIRODEMARAY RICHARD ERNESTINAGAWA MAKOTOMULLAPUDI RAVIHALSEY HARLAN LSTARR MICHAEL T
    • H01L21/68G05B19/401G05B19/402G05B19/418G05B11/01H01L21/00
    • G05B19/41815G05B19/401G05B19/402Y02P90/08
    • Automated systems and methods for processing substrates (11) are described. An automated processing system includes: a vacuum chamber (18); a substrate support located inside the vacuum chamber and constructed and arranged to support a substrate during processing; and a substrate alignment detector constructed and arranged to detect if the substrate is misaligned as the substrate is transferred into the vacuum chamber based upon a change in a physical condition inside the system. The substrate alignment detector may include a vibration detector coupled to the substrate support. A substrate may be transferred into the vacuum chamber. The position of the substrate may be recorded as it is being transferred into the vacuum chamber. Misalignment of the substrate with respect to the substrate support may be detected. The substrate may be processed. The processed substrate may be unloaded from the vacuum chamber. The position of the processed substrate may be recorded as it is being unloaded from the vacuum chamber. Any substrate misalignment may be compensated for based upon the difference in the recorded substrate positions.
    • 描述了用于处理衬底的自动化系统和方法。 一种自动化处理系统包括:真空室; 位于真空室内的衬底支撑件,并被构造和布置成在加工过程中支撑衬底; 以及基板对准检测器,其被构造和布置成基于系统内的物理状态的变化来检测基板是否不对准,因为基板被转移到真空室中。 衬底对准检测器可以包括耦合到衬底支撑件的振动检测器。 衬底可以被转移到真空室中。 衬底的位置可以在被转移到真空室中时记录。 可以检测衬底相对于衬底支撑件的不对准。 可以处理衬底。 经处理的基板可以从真空室中卸载。 被处理基板的位置可以从真空室中卸载来记录。 可以基于记录的基板位置的差异补偿任何基板未对准。
    • 4. 发明申请
    • METHOD AND APPARATUS FOR SPUTTERING ONTO LARGE FLAT PANELS
    • 用于在大平面板上溅射的方法和装置
    • WO2007015933A3
    • 2009-06-11
    • PCT/US2006028178
    • 2006-07-20
    • APPLIED MATERIAL INCLE HIEN-MING HUUHOSOKAWA AKIHIROTEPMAN AVI
    • LE HIEN-MING HUUHOSOKAWA AKIHIROTEPMAN AVI
    • C23C16/00
    • C23C14/35H01J37/3408H01J37/3455
    • A rectangular magnetron (160) placed at the back of a rectangular sputter target (16) and having magnets (164) of opposed polarities arranged to form a gap therebetween. corresponding to a plasma track adjacent the target to intensify the plasma causing material sputtered from the target to coat a rectangular panel (14). The gap extends in a closed loop having a serpentine or spiral shape. The magnetron has a size only somewhat less than that of the target and is scanned in the two perpendicular directions of the target with a scan length of, for example, about 100mm for a 2m target. The scan may follow a double-Z pattern along two links parallel to a target side and the two connecting diagonals. External actuators (416) move the magnetron along a two-dimensional path as it is slidably suspended from a gantry (364) sliding perpendicularly on the chamber walls (276).
    • 放置在矩形溅射靶(16)的背面并且具有布置成在其间形成间隙的相对极性的磁体(164)的矩形磁控管(160)。 对应于邻近靶的等离子体轨道,以加强等离子体,从而使从靶材溅射的材料涂覆矩形面板(14)。 间隙在具有蛇形或螺旋形状的闭环中延伸。 磁控管的尺寸仅比目标的尺寸略小,并且在目标的两个垂直方向上扫描,对于2m的目标,扫描长度例如为约100mm。 扫描可以沿着平行于目标侧的两个链接和两个连接对角线沿着双Z图案。 外部致动器(416)沿着可从垂直于室壁(276)上滑动的台架(364)可滑动地悬挂的二维路径移动磁控管。
    • 9. 发明申请
    • SPUTTERING TARGET TILES HAVING STRUCTURED EDGES SEPARATED BY A GAP
    • 具有由GAP分离的结构化边缘的溅射目标台
    • WO2006127221A3
    • 2007-02-01
    • PCT/US2006016939
    • 2006-05-02
    • APPLIED MATERIALS INCLE HIEN-MINHSTIMSON BRADLEYHOSOKAWA AKIHIRO
    • LE HIEN-MINHSTIMSON BRADLEYHOSOKAWA AKIHIRO
    • C23C14/35
    • C23C14/3407H01J37/3423H01J37/3435H01J37/3491
    • A target assembly composed of multiple target tiles (30) bonded in an array to a backing plate (24) of another material. The edges of the tile within the interior of the array are formed with complementary structure edges to form a gap (36) between the tiles having at least a portion that is inclined to the target normal. The gap may be simply beveled and slant at an angle of between 10° and 55°, preferably 15° and 50°, with respect to the target normal or they may be convolute with one portion horizontal (74) or otherwise inclined to prevent a line of sight from the bottom to top. The facing sides (30, 32) of tiles may be roughened by bead blasting, for both perpendicular and sloping gaps. The area of the backing plate underlying the gap may be roughened or may be coated or overlain with a foil (54) of the material of the target, for both perpendicular and sloping gaps and have a polymeric foil (52) preventing entry of bonding material into the gap.
    • 由多个目标瓦片(30)组成的目标组件,所述目标瓦片(30)以阵列的形式结合到另一材料的背板(24)上。 在阵列内部的瓦片的边缘形成有互补的结构边缘,以在具有至少一部分倾斜于目标法线的瓦片之间形成间隙(36)。 间隙可以简单地倾斜并相对于目标法线倾斜10°至55°,优选15°和50°之间的角度,或者它们可以与一部分水平(74)卷曲或以其他方式倾斜以防止 从底部到顶部的视线。 对于垂直和倾斜的间隙,瓷砖的面对侧(30,32)可以通过珠粒喷砂而粗糙化。 在间隙下面的背板的区域可以被粗糙化,或者可以对于垂直和倾斜的间隙而用靶材料的箔(54)涂覆或覆盖,并且具有防止粘合材料进入的聚合物箔(52) 进入差距。