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1. 发明申请

WO2013154536A1 INTERCHAMBER ADAPTER FOR CLUSTER TOOL 审中-公开
标题翻译：用于集群工具的INTERCHAMBER ADAPTER
公开(公告)号：WO2013154536A1
公开(公告)日：2013-10-17
申请号：PCT/US2012/032879
申请日：2012-04-10
申请人： APPLIED MATERIALS, INC. , KURITA, Shinichi , INAGAWA, Makoto , KHO, Jeffrey A. , TINER, Robin L. , ANWAR, Suhail
发明人： KURITA, Shinichi , INAGAWA, Makoto , KHO, Jeffrey A. , TINER, Robin L. , ANWAR, Suhail
IPC分类号： H01L21/67 , H01L21/677 , H01L21/02
CPC分类号： H01L21/67196
摘要： A serial cluster tool system is provided. The system includes a first cluster tool having a first plurality of processing chambers and at least one first peripheral chamber, a second cluster tool having a second plurality of processing chambers and at least one second peripheral chamber, and an interchamber adapter device coupling the at least one first peripheral chamber to the at least one second peripheral chamber, the interchamber adapter device comprising a vacuum-proof flexible section coupled between sealing faces of the first chamber and the second chamber.
摘要翻译：提供串行集群工具系统。该系统包括具有第一多个处理室和至少一个第一周边室的第一集群工具，具有第二多个处理室和至少一个第二周边室的第二集群工具以及至少联接至少一个至少一个第二周边室的第一周边室，所述车间适配器装置包括联接在所述第一室和第二室的密封面之间的防真空柔性部分。

2. 发明申请

WO2011137373A3 VERTICAL INLINE CVD SYSTEM 审中-公开
公开(公告)号：WO2011137373A3
公开(公告)日：2012-02-09
申请号：PCT/US2011034623
申请日：2011-04-29
申请人： APPLIED MATERIALS INC , KURITA SHINICHI , KUDELA JOZEF , ANWAR SUHAIL , WHITE JOHN M , YIM DONG-KIL , WOLF HANS , ZVALO DENNIS , INAGAWA MAKOTO , MORI IKUO
发明人： KURITA SHINICHI , KUDELA JOZEF , ANWAR SUHAIL , WHITE JOHN M , YIM DONG-KIL , WOLF HANS , ZVALO DENNIS , INAGAWA MAKOTO , MORI IKUO
IPC分类号： C23C16/50 , C23C16/44 , H01L21/205
CPC分类号： H01L21/67712 , C23C16/4587 , C23C16/46 , C23C16/463 , C23C16/511 , C23C16/54 , H01J37/32192 , H01J37/3222 , H01J37/32513 , H01J37/32522 , H01J37/32889 , H01J37/32899 , H01L21/67098 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67201
摘要： The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.

3. 发明申请

WO2010056615A2 ELECTRON BEAM WELDING OF LARGE VACUUM CHAMBER BODY HAVING A HIGH EMISSIVITY COATING 审中-公开
标题翻译：具有高发射率涂层的大型真空室主体的电子束焊接
公开(公告)号：WO2010056615A2
公开(公告)日：2010-05-20
申请号：PCT/US2009/063671
申请日：2009-11-09
申请人： APPLIED MATERIALS, INC. , KURITA, Shinichi , BEHDJAT, Mehran , INAGAWA, Makoto
发明人： KURITA, Shinichi , BEHDJAT, Mehran , INAGAWA, Makoto
IPC分类号： H01L21/00 , H01L21/02
CPC分类号： B65D7/06 , B23K15/0006 , B65D7/38 , H01L21/67379
摘要： Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
摘要翻译：这里公开的实施例涉及已经焊接在一起的大型真空腔体。腔室主体可以在其中的至少一个表面上具有高发射率涂层。由于腔体的大尺寸，腔体可以通过将多个零件焊接在一起而不是由单件金属锻造主体来形成。这些部件可以在离开主体角部的位置处被焊接在一起，该位置可能在抽空期间处于最大应力下，以确保可能是身体中最弱点的焊接不会失效。腔室主体的至少一个表面可以涂覆有高发射率涂层以帮助来自进入的，加热的基板的热传递。高发射率涂层可以通过降低降低衬底温度所需的时间来增加衬底的生产量。

4. 发明申请

WO1990012970A1 HYDRAULIC MOTOR EQUIPPED WITH REDUCTION GEAR 审中-公开
标题翻译：液压马达配备减速齿轮
公开(公告)号：WO1990012970A1
公开(公告)日：1990-11-01
申请号：PCT/JP1990000530
申请日：1990-04-24
申请人： KABUSHIKI KAISHA KOMATSU SEISAKUSHO , INAGAWA, Makoto
发明人： KABUSHIKI KAISHA KOMATSU SEISAKUSHO
IPC分类号： F16H57/04
CPC分类号： F16H57/0412 , B60K17/046 , F03C1/0607 , F03C1/26 , F16H57/0421 , F16H57/0456 , F16H57/0486 , Y10T74/19991 , Y10T74/2189
摘要： A hydraulic motor equipped with a reduction gear wherein the lubricating oil in the gear case is cooled to improving the lives of the sealant and the bearing. Said motor is provided with a pair of supply/discharge ports (18, 17) for circulating the lubricating oil that extend from two opposite spots in the radial direction on the edge surface of one side of the circumferential wall of a motor case (1) in the circumferential wall in parallel with the axial direction of the motor case (1), and open their tips inside a reduction gear case (6). Thus, at the same time when the cooled lubricating oil is supplied to the inside of the gear case from the outside, the lubricating oil at a high temperature is discharged outside, thus maintaining the lubricating oil in the gear case at a low temperature.

5. 发明申请

WO2011137373A2 VERTICAL INLINE CVD SYSTEM 审中-公开
标题翻译：立式CVD系统
公开(公告)号：WO2011137373A2
公开(公告)日：2011-11-03
申请号：PCT/US2011/034623
申请日：2011-04-29
申请人： APPLIED MATERIALS, INC. , KURITA, Shinichi , KUDELA, Jozef , ANWAR, Suhail , WHITE, John M. , YIM, Dong-Kil , WOLF, Hans , ZVALO, Dennis , INAGAWA, Makoto , MORI, Ikuo
发明人： KURITA, Shinichi , KUDELA, Jozef , ANWAR, Suhail , WHITE, John M. , YIM, Dong-Kil , WOLF, Hans , ZVALO, Dennis , INAGAWA, Makoto , MORI, Ikuo
IPC分类号： C23C16/50 , C23C16/44 , H01L21/205
CPC分类号： H01L21/67712 , C23C16/4587 , C23C16/46 , C23C16/463 , C23C16/511 , C23C16/54 , H01J37/32192 , H01J37/3222 , H01J37/32513 , H01J37/32522 , H01J37/32889 , H01J37/32899 , H01L21/67098 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67201
摘要： The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.
摘要翻译：本发明一般涉及具有能够处理多个基板的处理室的垂直CVD系统。多个基板设置在处理室内的处理源的相对侧上，但处理环境彼此不隔离。处理源是水平居中的垂直等离子体发生器，其允许在等离子体发生器的任一侧上同时处理多个基板，但彼此独立。该系统被布置为双系统，由此两个相同的处理线各自具有它们自己的处理室，彼此相邻布置。多个机器人用于从处理系统装载和卸载基板。每个机器人可以访问系统内的两条处理线。

6. 发明申请

WO2010056615A4 ELECTRON BEAM WELDING OF LARGE VACUUM CHAMBER BODY HAVING A HIGH EMISSIVITY COATING 审中-公开
标题翻译：具有高电感涂层的大型真空室体的电子束焊接
公开(公告)号：WO2010056615A4
公开(公告)日：2010-09-10
申请号：PCT/US2009063671
申请日：2009-11-09
申请人： APPLIED MATERIALS INC , KURITA SHINICHI , BEHDJAT MEHRAN , INAGAWA MAKOTO
发明人： KURITA SHINICHI , BEHDJAT MEHRAN , INAGAWA MAKOTO
IPC分类号： H01L21/00 , H01L21/02
CPC分类号： B65D7/06 , B23K15/0006 , B65D7/38 , H01L21/67379
摘要： Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
摘要翻译：本文公开的实施例涉及已经焊接在一起的大型真空室主体。腔体可以在其中的至少一个表面上具有高发射率涂层。由于腔室主体的尺寸较大，可以通过将多个部件焊接在一起而不是从单个金属件锻造主体而形成腔体。这些部件可以在与身体的角部间隔开的位置处被焊接在一起，该位置在排空期间可能处于最大的应力下，以确保可能是身体中最弱点的焊缝不会失效。室主体的至少一个表面可以涂覆有高发射率涂层，以帮助来自加热的基底的热传递。高发射率涂层可以通过降低降低衬底温度所需的时间来增加衬底通量。

7. 发明申请

WO2010025253A4 LOAD LOCK CHAMBER FOR LARGE AREA SUBSTRATE PROCESSING SYSTEM 审中-公开
标题翻译：用于大面积基板处理系统的负载锁室
公开(公告)号：WO2010025253A4
公开(公告)日：2010-07-22
申请号：PCT/US2009055200
申请日：2009-08-27
申请人： APPLIED MATERIALS INC , BEHDJAT MEHRAN , KURITA SHINICHI , INAGAWA MAKOTO , ANWAR SUHAIL
发明人： BEHDJAT MEHRAN , KURITA SHINICHI , INAGAWA MAKOTO , ANWAR SUHAIL
IPC分类号： H01L21/00 , H01L21/02
CPC分类号： H01L21/67201 , H01L21/67236
摘要： The present invention generally includes a load lock chamber for transferring large area substrates into a vacuum processing chamber. The load lock chamber may have one or more separate, environmentally isolated environments. Each processing environment may have a plurality exhaust ports for drawing a vacuum. The exhaust ports may be located at the corners of the processing environment. When a substrate is inserted into the load lock chamber from the factory interface, the environment may need to be evacuated. Due to the exhaust ports located at the corners of the environment, any particles or contaminants that may be present may be pulled to the closest corner and out of the load lock chamber without being pulled across the substrate. Thus, substrate contamination may be reduced.
摘要翻译：本发明通常包括用于将大面积基板传送到真空处理室中的负载锁定室。负载锁定室可能有一个或多个独立的，环境隔离的环境。每个处理环境可以具有用于抽真空的多个排气口。排气口可以位于处理环境的角落处。当基板从工厂接口插入负载锁定室时，环境可能需要撤离。由于排气口位于环境的角落处，可能存在的任何微粒或污染物可能会被拉到最近的拐角并从负载锁定室流出，而不会被拉过基板。因此，基板污染可能会减少。

8. 发明申请

WO2010025253A3 LOAD LOCK CHAMBER FOR LARGE AREA SUBSTRATE PROCESSING SYSTEM 审中-公开
标题翻译：大面积底板加工系统的负载锁仓
公开(公告)号：WO2010025253A3
公开(公告)日：2010-06-03
申请号：PCT/US2009055200
申请日：2009-08-27
申请人： APPLIED MATERIALS INC , BEHDJAT MEHRAN , KURITA SHINICHI , INAGAWA MAKOTO , ANWAR SUHAIL
发明人： BEHDJAT MEHRAN , KURITA SHINICHI , INAGAWA MAKOTO , ANWAR SUHAIL
IPC分类号： H01L21/00 , H01L21/02
CPC分类号： H01L21/67201 , H01L21/67236
摘要： The present invention generally includes a load lock chamber for transferring large area substrates into a vacuum processing chamber. The load lock chamber may have one or more separate, environmentally isolated environments. Each processing environment may have a plurality exhaust ports for drawing a vacuum. The exhaust ports may be located at the corners of the processing environment. When a substrate is inserted into the load lock chamber from the factory interface, the environment may need to be evacuated. Due to the exhaust ports located at the corners of the environment, any particles or contaminants that may be present may be pulled to the closest corner and out of the load lock chamber without being pulled across the substrate. Thus, substrate contamination may be reduced.
摘要翻译：本发明通常包括用于将大面积基板输送到真空处理室中的负载锁定室。负载锁定室可以具有一个或多个单独的环境隔离环境。每个处理环境可以具有用于抽真空的多个排气口。排气口可以位于处理环境的拐角处。当基板从出厂界面插入加载锁定室时，环境可能需要抽真空。由于位于环境角落处的排气口，可能存在的任何颗粒或污染物可被拉到最靠近的角落并且不被拉过载体锁定室。因此，可能降低衬底污染。

9. 发明申请

WO2010025253A2 LOAD LOCK CHAMBER FOR LARGE AREA SUBSTRATE PROCESSING SYSTEM 审中-公开
标题翻译：用于大面积基板处理系统的负载锁室
公开(公告)号：WO2010025253A2
公开(公告)日：2010-03-04
申请号：PCT/US2009/055200
申请日：2009-08-27
申请人： APPLIED MATERIALS, INC. , BEHDJAT, Mehran , KURITA, Shinichi , INAGAWA, Makoto , ANWAR, Suhail
发明人： BEHDJAT, Mehran , KURITA, Shinichi , INAGAWA, Makoto , ANWAR, Suhail
IPC分类号： H01L21/00 , H01L21/02
CPC分类号： H01L21/67201 , H01L21/67236
摘要： The present invention generally includes a load lock chamber for transferring large area substrates into a vacuum processing chamber. The load lock chamber may have one or more separate, environmentally isolated environments. Each processing environment may have a plurality exhaust ports for drawing a vacuum. The exhaust ports may be located at the corners of the processing environment. When a substrate is inserted into the load lock chamber from the factory interface, the environment may need to be evacuated. Due to the exhaust ports located at the corners of the environment, any particles or contaminants that may be present may be pulled to the closest corner and out of the load lock chamber without being pulled across the substrate. Thus, substrate contamination may be reduced.
摘要翻译：本发明一般包括用于将大面积基板传送到真空处理室中的负载锁定室。负载锁定室可能有一个或多个独立的，环境隔离的环境。每个处理环境可以具有用于抽真空的多个排气口。排气口可以位于处理环境的角落处。当基板从工厂接口插入负载锁定室时，环境可能需要撤离。由于排气口位于环境的角落处，可能存在的任何微粒或污染物可能会被拉到最近的拐角并从负载锁定室流出，而不会被拉过基板。因此，基材污染可能会减少。

10. 发明申请

WO2011137373A4 VERTICAL INLINE CVD SYSTEM 审中-公开
标题翻译：垂直在线CVD系统
公开(公告)号：WO2011137373A4
公开(公告)日：2012-03-15
申请号：PCT/US2011034623
申请日：2011-04-29
申请人： APPLIED MATERIALS INC , KURITA SHINICHI , KUDELA JOZEF , ANWAR SUHAIL , WHITE JOHN M , YIM DONG-KIL , WOLF HANS , ZVALO DENNIS , INAGAWA MAKOTO , MORI IKUO
发明人： KURITA SHINICHI , KUDELA JOZEF , ANWAR SUHAIL , WHITE JOHN M , YIM DONG-KIL , WOLF HANS , ZVALO DENNIS , INAGAWA MAKOTO , MORI IKUO
IPC分类号： C23C16/50 , C23C16/44 , H01L21/205
CPC分类号： H01L21/67712 , C23C16/4587 , C23C16/46 , C23C16/463 , C23C16/511 , C23C16/54 , H01J37/32192 , H01J37/3222 , H01J37/32513 , H01J37/32522 , H01J37/32889 , H01J37/32899 , H01L21/67098 , H01L21/67126 , H01L21/67173 , H01L21/6719 , H01L21/67201
摘要： The present invention generally relates to a vertical CVD system having a processing chamber that is capable of processing multiple substrates. The multiple substrates are disposed on opposite sides of the processing source within the processing chamber, yet the processing environments are not isolated from each other. The processing source is a horizontally centered vertical plasma generator that permits multiple substrates to be processed simultaneously on either side of the plasma generator, yet independent of each other. The system is arranged as a twin system whereby two identical processing lines, each with their own processing chamber, are arranged adjacent to each other. Multiple robots are used to load and unload the substrates from the processing system. Each robot can access both processing lines within the system.
摘要翻译：本发明总体上涉及一种具有能够处理多个基板的处理室的垂直CVD系统。多个衬底设置在处理室内的处理源的相对侧上，但处理环境彼此不隔离。处理源是一个水平居中的垂直等离子体发生器，它允许在等离子体发生器的两侧同时处理多个基板，但彼此独立。该系统被布置为双系统，由此两条相同的处理线，各自具有其自己的处理室，彼此相邻地布置。多个机器人用于加载和卸载处理系统中的基板。每个机器人都可以访问系统内的两条生产线。

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