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    • 2. 发明公开
    • 공간 왜곡 유사도를 사용하는 툴 오류 분석
    • 使用空间扭曲相似度的工具误差分析
    • KR20180031698A
    • 2018-03-28
    • KR20187003759
    • 2016-07-15
    • TOKYO ELECTRON LTD
    • KAUSHAL SANJEEVPATEL SUKESHPOLAK WOLFGANGWOLFE ORION
    • G05B19/4065
    • G05B19/4065G05B2219/37242G05B2219/37245G05B2219/45031
    • 제작프로세스들과연관된툴 오류분석을용이하게하기위한시스템들및 기술들이제시된다. 모니터링컴포넌트는하나이상의제작툴과연관된한 세트의센서들에의해생성된센서데이터에기반하여하나이상의제작툴과연관된후보툴 오류를결정한다. 시그니처컴포넌트는하나이상의제작툴과연관된데이터에기반하여후보툴 오류에대한시그니처데이터세트를생성한다. 비교컴포넌트는시그니처데이터세트및 적어도하나의이전에결정된툴 오류와연관된적어도하나의다른시그니처데이터세트에기반하여후보툴 오류를적어도하나의이전에결정된툴 오류와비교한다.
    • 系统和技术被提出来促进与生产过程相关的工具错误分析。 监控组件基于由与一个或多个生产工具相关联的一组传感器生成的传感器数据来确定与一个或多个生产工具相关联的候选工具错误。 签名组件基于与一个或多个生产工具相关联的数据生成用于候选工具错误的一组签名数据。 比较部件基于签名数据集和与至少一个先前确定的工具误差相关联的至少一个其他签名数据集,将候选工具误差与至少一个先前确定的工具误差进行比较。
    • 4. 发明申请
    • SEMICONDUCTOR PROCESSING SYSTEM WITH WIRELESS SENSOR NETWORK MONITORING SYSTEM INCORPORATED THEREWITH
    • 具有无线传感器网络监控系统的半导体处理系统
    • WO2007112180A3
    • 2008-01-10
    • PCT/US2007063462
    • 2007-03-07
    • TOKYO ELECTRON LTDTOKYO ELECTRON AMERICA INCKAUSHAL SANJEEVSUGISHIMA KENJIRAO DONTHINENI RAMESH KUMAR
    • KAUSHAL SANJEEVSUGISHIMA KENJIRAO DONTHINENI RAMESH KUMAR
    • H01L21/00
    • H01L21/67253H01L21/67242H01L21/67248H01L21/67288H01L2924/0002H01L2924/00
    • A method and system for non-invasive sensing and monitoring of a processing system (100, 200) employed in semiconductor manufacturing. The method allows for detecting and diagnosing drift and failures in the processing system (100, 200) and taking the appropriate correcting measures. The method includes positioning at least one non-invasive sensor (247a-d, 248a-b, 249a-b, 250a-c, 906) on an outer surface of a system component of the processing system (200), where the at least one invasive sensor forms a wireless sensor network (902), acquiring a sensor signal from the at least one non-invasive sensor (247a-d, 248a-b, 249a-b, 250a-c, 906), where the sensor signal tracks a gradual or abrupt change in a processing state of the system component during flow of a process gas in contact with the system component, and extracting the sensor signal from the wireless sensor network (902) to store and process the sensor signal. In one embodiment, the non-invasive sensor (247a-d, 248a-b, 249a-b, 250a-c, 906) can be an accelerometer sensor and the wireless sensor network (902) can be motes-based.
    • 一种用于半导体制造中使用的处理系统(100,200)的非侵入式感测和监测的方法和系统。 该方法允许检测和诊断处理系统(100,200)中的漂移和故障并采取适当的校正措施。 该方法包括将至少一个非侵入式传感器(247a-d,248a-b,249a-b,250a-c,906)定位在处理系统(200)的系统部件的外表面上,其中至少 一个入侵传感器形成无线传感器网络(902),从至少一个非侵入式传感器(247a-d,248a-b,249a-b,250a-c,906)获取传感器信号,其中传感器信号跟踪 在与系统部件接触的处理气体的流动期间系统部件的处理状态的逐渐或突然的变化,以及从无线传感器网络(902)提取传感器信号以存储和处理传感器信号。 在一个实施例中,非侵入式传感器(247a-d,248a-b,249a-b,250a-c,906)可以是加速度计传感器,并且无线传感器网络(902)可以是基于空白的。
    • 5. 发明申请
    • METHOD OF MONITORING A SEMICONDUCTOR PROCESSING SYSTEM USING A WIRELESS SENSOR NETWORK
    • 使用无线传感器网络监测半导体处理系统的方法
    • WO2007112181A2
    • 2007-10-04
    • PCT/US2007063466
    • 2007-03-07
    • TOKYO ELECTRON LTDTOKYO ELECTRON AMERICA INCKAUSHAL SANJEEVSUGISHIMA KENJIRAO DONTHINENI RAMESH KUMAR
    • KAUSHAL SANJEEVSUGISHIMA KENJIRAO DONTHINENI RAMESH KUMAR
    • H01L21/00
    • H01L21/67253
    • A method and system for non-invasive sensing and monitoring of a processing system (100, 200) employed in semiconductor manufacturing. The method allows for detecting and diagnosing drift and failures in the processing system (100, 200) and taking the appropriate correcting measures. The method includes positioning at least one non-invasive sensor (247a-d, 248a-b, 249a-b, 250a-c, 906) on an outer surface of a system component of the processing system (200), where the at least one non- invasive sensor forms a wireless sensor network (902), acquiring a sensor signal from the at least one non-invasive sensor (247a-d, 248a-b, 249a-b, 250a-c, 906), where the sensor signal tracks a gradual or abrupt change in a processing state of the system component during flow of a process gas in contact with the system component, and extracting the sensor signal from the wireless sensor network (902) to store and process the sensor signal. In one embodiment, the non-invasive sensor (247a-d, 248a-b, 249a-b, 250a-c, 906) can be an accelerometer sensor and the wireless sensor network (902) can be motes-based.
    • 一种用于在半导体制造中使用的处理系统(100,200)的无创感测和监测的方法和系统。 该方法允许检测和诊断处理系统(100,200)中的漂移和故障并采取适当的校正措施。 该方法包括将至少一个非侵入式传感器(247a-d,248a-b,249a-b,250a-c,906)定位在处理系统(200)的系统部件的外表面上,其中至少 一个非侵入式传感器形成无线传感器网络(902),从所述至少一个非侵入式传感器(247a-d,248a-b,249a-b,250a-c,906)获取传感器信号,其中所述传感器 信号跟踪在与系统部件接触的过程气体流动期间系统部件的处理状态中的逐渐或突然的变化,并且从无线传感器网络(902)提取传感器信号以存储和处理传感器信号。 在一个实施例中,非侵入式传感器(247a-d,248a-b,249a-b,250a-c,906)可以是加速计传感器并且无线传感器网络(902)可以是基于微粒的。
    • 7. 发明申请
    • AUTONOMOUS TOOL PARAMETER IMPACT IDENTIFICATION FOR SEMICONDUCTOR MANUFACTURING
    • 自动化工具半导体制造的参数影响鉴定
    • WO2014074221A4
    • 2014-07-31
    • PCT/US2013059715
    • 2013-09-13
    • TOKYO ELECTRON LTDKAUSHAL SANJEEV
    • KAUSHAL SANJEEVPATEL SUKESH JANUBHAIPOLAK WOLFGANGWATERMAN AARON ARCHERWOLFE ORION
    • H01L21/02G06F19/00
    • G05B19/41875G05B2219/32187G05B2219/45031G06N99/005Y02P90/22Y02P90/86
    • A system and method for autonomously determining the impact of respective tool parameters on tool performance in a semiconductor manufacturing system is provided. A parameter impact identification system receives tool parameter and tool performance data for one or more process runs of the semiconductor fabrication system and generates a separate function for each tool parameter characterizing the behavior of a tool performance indicator in terms of a single one of the tool parameters. Each function is then scored according to how well the function predicts the actual behavior of the tool performance indicator, or based on a determined sensitivity of the tool performance indicator to changes in the single tool parameter. The tool parameters are then ranked based on these scores, and a reduced set of critical tool parameters is derived based on the ranking. The tool performance indicator can then be modeled based on this reduced set of tool parameters.
    • 提供了一种用于在半导体制造系统中自主确定各个刀具参数对刀具性能的影响的系统和方法。 参数冲击识别系统接收半导体制造系统的一个或多个过程运行的工具参数和工具性能数据,并且根据单个工具参数为每个刀具参数生成表征刀具性能指标行为的单独功能 。 然后根据功能预测刀具性能指标的实际行为,或者根据刀具性能指标对单刀具参数变化的确定灵敏度,对每个功能进行刻痕。 然后根据这些分数对工具参数进行排名,并根据排名得出一组关键工具参数。 然后,可以基于这组减少的刀具参数来建模刀具性能指标。