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1. 发明申请

US20050051089A1 Plasma processing apparatus 审中-公开
公开(公告)号：US20050051089A1
公开(公告)日：2005-03-10
申请号：US10968249
申请日：2004-10-20
申请人： Susumu Tauchi , Masanori Kadotani , Muneo Furuse , Motohiko Yoshigai
发明人： Susumu Tauchi , Masanori Kadotani , Muneo Furuse , Motohiko Yoshigai
IPC分类号： C23C16/44 , H01J37/32 , C23C16/00
CPC分类号： H01J37/32458 , C23C16/4404 , H01J37/32477
摘要： It is required for the conventional plasma processing apparatus used for plasma processing in a reduced pressure atmosphere to replace the component parts such as earth member frequently as the expendable supplies because an insulation-processed layer and the substrate itself are thinned due to plasma and impurities contained in these thinned materials diffuse into plasma to result in adverse effect on a sample such as wafer, and thinning of the insulation-processed layer due to plasma and resultant electrical effect of the thinning of the insulation-processed layer cause the change of the state of plasma. The invention solves the problem by using electrically conductive ceramic that is formed of a baked material mainly composed of alumina for component parts of the apparatus in the plasma processing apparatus used for plasma processing of an sample to be processed such as wafer in a reduced pressure atmosphere.

2. 发明授权

US06837937B2 Plasma processing apparatus 失效
标题翻译：等离子体处理装置
公开(公告)号：US06837937B2
公开(公告)日：2005-01-04
申请号：US10228048
申请日：2002-08-27
申请人： Susumu Tauchi , Masanori Kadotani , Muneo Furuse , Motohiko Yoshigai
发明人： Susumu Tauchi , Masanori Kadotani , Muneo Furuse , Motohiko Yoshigai
IPC分类号： C23C16/44 , H01J37/32 , C23C16/00 , H05H1/00
CPC分类号： H01J37/32458 , C23C16/4404 , H01J37/32477
摘要： It is required for the conventional plasma processing apparatus used for plasma processing in a reduced pressure atmosphere to replace the component parts such as earth member frequently as the expendable supplies because an insulation-processed layer and the substrate itself are thinned due to plasma and impurities contained in these thinned materials diffuse into plasma to result in adverse effect on a sample such as wafer, and thinning of the insulation-processed layer due to plasma and resultant electrical effect of the thinning of the insulation-processed layer cause the change of the state of plasma. The invention solves the problem by using electrically conductive ceramic that is formed of a baked material mainly composed of alumina for component parts of the apparatus in the plasma processing apparatus used for plasma processing of an sample to be processed such as wafer in a reduced pressure atmosphere.
摘要翻译：在减压气氛中用于等离子体处理的常规等离子体处理装置需要作为消耗品频繁地代替诸如地球构件的部件，因为绝缘处理层和衬底本身由于等离子体和杂质而被减薄在这些变薄的材料中扩散到等离子体中，导致对诸如晶片的样品的不利影响，以及由于等离子体而导致的绝缘处理层的变薄，并且导致绝缘处理层的变薄的电致效应导致了等离子体。本发明通过使用由主要由氧化铝组成的焙烧材料形成的导电陶瓷，用于在等离子体处理装置中的等离子体处理装置中用于待处理样品例如晶片的减压气氛。

3. 发明申请

US20060168844A1 Vacuum processing apparatus and vacuum processing method 有权
标题翻译：真空加工设备和真空加工方法
公开(公告)号：US20060168844A1
公开(公告)日：2006-08-03
申请号：US11068804
申请日：2005-03-02
申请人： Manabu Edamura , Akitaka Makino , Motohiko Yoshigai , Takanori Nakatsuka , Susumu Tauchi
发明人： Manabu Edamura , Akitaka Makino , Motohiko Yoshigai , Takanori Nakatsuka , Susumu Tauchi
IPC分类号： F26B13/30 , G05D16/00 , F26B21/06
CPC分类号： G05D16/2066
摘要： The downtime of a vacuum processing apparatus due to wet cleaning is reduced. In a vacuum processing apparatus that requires aging for its chamber or process container after vacuum evacuation of the apparatus and before actual processing of a workpiece, when the chamber has been opened to atmosphere for the purpose of wet cleaning or component replacement, the apparatus comprises a high precision absolute pressure gauge for use in processing, a wide range gauge capable of measuring a wide range of pressures, and a controller, wherein the controller uses a pressure trend during vacuum evacuation to determine whether the vacuum evacuation is satisfactory, and starts aging upon determining that the vacuum evacuation is satisfactory even if the actual pressure is not below a prescribed value. The controller determines relationship between an apparent flow rate (leak rate) measured by the absolute pressure gauge when the chamber is vacuum sealed, and a chamber pressure measured by the wide range gauge, and then measures only the pressure to determine whether a baseline leak rate is reached.
摘要翻译：减少了由于湿清洗而造成的真空处理装置的停机时间。在真空处理装置中，在对设备进行真空抽真空之后并且在实际处理工件之前需要对其室或处理容器进行老化的情况下，当室已经被打开到大气中以进行湿式清洁或部件更换时，该装置包括：用于加工的高精度绝对压力表，可测量宽范围压力的宽范围计量器和控制器，其中控制器在真空抽真空中使用压力趋势，以确定真空抽气是否令人满意，并开始老化确定即使实际压力不低于规定值，真空排气也令人满意。控制器确定当室被真空密封时由绝对压力表测量的表观流量（泄漏率）与由宽范围量规测量的室压力之间的关系，然后仅测量压力以确定基线泄漏率到达了。

4. 发明授权

US07194821B2 Vacuum processing apparatus and vacuum processing method 有权
标题翻译：真空加工设备和真空加工方法
公开(公告)号：US07194821B2
公开(公告)日：2007-03-27
申请号：US11068804
申请日：2005-03-02
申请人： Manabu Edamura , Akitaka Makino , Motohiko Yoshigai , Takanori Nakatsuka , Susumu Tauchi
发明人： Manabu Edamura , Akitaka Makino , Motohiko Yoshigai , Takanori Nakatsuka , Susumu Tauchi
IPC分类号： F26B7/00
CPC分类号： G05D16/2066
摘要： The downtime of a vacuum processing apparatus due to wet cleaning is reduced. In a vacuum processing apparatus that requires aging for its chamber or process container after vacuum evacuation of the apparatus and before actual processing of a workpiece, when the chamber has been opened to atmosphere for the purpose of wet cleaning or component replacement, the apparatus comprises a high precision absolute pressure gauge for use in processing, a wide range gauge capable of measuring a wide range of pressures, and a controller, wherein the controller uses a pressure trend during vacuum evacuation to determine whether the vacuum evacuation is satisfactory, and starts aging upon determining that the vacuum evacuation is satisfactory even if the actual pressure is not below a prescribed value. The controller determines relationship between an apparent flow rate (leak rate) measured by the absolute pressure gauge when the chamber is vacuum sealed, and a chamber pressure measured by the wide range gauge, and then measures only the pressure to determine whether a baseline leak rate is reached.
摘要翻译：减少了由于湿清洗而造成的真空处理装置的停机时间。在真空处理装置中，在对设备进行真空抽真空之后并且在实际处理工件之前需要对其室或处理容器进行老化的情况下，当室已经被打开到大气中以进行湿式清洁或部件更换时，该装置包括：用于加工的高精度绝对压力表，可测量宽范围压力的宽范围计量器和控制器，其中控制器在真空抽真空中使用压力趋势，以确定真空抽气是否令人满意，并开始老化确定即使实际压力不低于规定值，真空排气也令人满意。控制器确定当室被真空密封时由绝对压力表测量的表观流量（泄漏率）与由宽范围量规测量的室压力之间的关系，然后仅测量压力以确定基线泄漏率到达了。

5. 发明授权

US09245780B2 Vacuum processing apparatus and operating method of the same 有权
标题翻译：真空处理装置及其操作方法
公开(公告)号：US09245780B2
公开(公告)日：2016-01-26
申请号：US13592408
申请日：2012-08-23
申请人： Takahiro Shimomura , Yoshifumi Ogawa , Susumu Tauchi
发明人： Takahiro Shimomura , Yoshifumi Ogawa , Susumu Tauchi
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67161 , H01L21/67184
摘要： A vacuum processing apparatus includes a row of containers of vacuum transfer chambers connected to each other behind a lock chamber, a wafer being transferred through depressurized inside of the row of the containers of the vacuum transfer containers, an intermediate chamber disposed between the containers of the vacuum transfer chambers, a plurality of processing units including processing containers respectively connected to left or right side walls of the containers of the vacuum transfer chambers and the wafer is processed therein, and a bypass chamber which constitutes a bypass path connecting the processing units, where only either the wafer which is being transferred from the lock chamber toward one of the processing units or the wafer which was processed in one of the processing units and is being transferred toward the lock chamber is transferred through the containers of the vacuum transfer chambers.
摘要翻译：真空处理装置包括一排在锁室后面彼此连接的真空传送室的容器，通过真空传送容器的容器排中的减压内部传送的晶片，设置在真空传送容器的容器之间的中间室在真空传送室中处理多个处理单元，包括分别连接到真空传送室的容器的左侧壁或右侧壁的处理容器和晶片，以及构成连接处理单元的旁路的旁路室，其中，只有从锁定室转移到处理单元之一的晶片或在一个处理单元中被处理并且被转移到锁定室的晶片被传送通过真空传送室的容器。

6. 发明授权

US09011065B2 Vacuum processing apparatus and operating method of vacuum processing apparatus 有权
标题翻译：真空处理装置和真空处理装置的操作方法
公开(公告)号：US09011065B2
公开(公告)日：2015-04-21
申请号：US12871333
申请日：2010-08-30
申请人： Susumu Tauchi , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
发明人： Susumu Tauchi , Hideaki Kondo , Teruo Nakata , Keita Nogi , Atsushi Shimoda , Takafumi Chida
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67745 , H01L21/67769 , Y10S414/139
摘要： A vacuum processing apparatus which includes an atmospheric transfer chamber having a plurality of cassette stands for transferring a wafer, a lock chamber for storing the wafer, a first vacuum transfer chamber to which the wafer from the lock chamber is transferred, a transfer intermediate chamber connected to the first vacuum transfer chamber, and a second vacuum transfer chamber connected to the transfer intermediate chamber. At least one vacuum processing chamber is connected to the first vacuum transfer chamber, and two or more vacuum processing chambers are connected to a rear side of the second vacuum transfer chamber. A plurality of gate valves are disposed between the first vacuum transfer chamber and each of the lock chamber, the transfer intermediate chamber, and the vacuum processing chamber coupled to the first vacuum transfer chamber. A control unit is also provided for controlling operation of the gate valves.
摘要翻译：一种真空处理装置，包括具有用于传送晶片的多个盒架的大气传送室，用于存储晶片的锁定室，来自锁定室的晶片被转移到的第一真空传送室，连接到传送中间室到第一真空传送室，以及连接到传送中间室的第二真空传送室。至少一个真空处理室连接到第一真空传送室，并且两个或更多个真空处理室连接到第二真空传送室的后侧。多个闸阀设置在第一真空传送室与联接到第一真空传送室的锁定室，传送中间室和真空处理室中的每一个之间。还设置有用于控制闸阀的操作的控制单元。

7. 发明授权

US08747046B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US08747046B2
公开(公告)日：2014-06-10
申请号：US13022313
申请日：2011-02-07
申请人： Ryoichi Isomura , Susumu Tauchi , Hideaki Kondo
发明人： Ryoichi Isomura , Susumu Tauchi , Hideaki Kondo
IPC分类号： B65G49/07 , H01L21/677
CPC分类号： H01L21/67184 , H01L21/67742
摘要： The vacuum processing apparatus is comprised of two vacuum transfer vessels in which a wafer is transferred through; two vacuum process vessels connected to these vacuum transfer vessels respectively; an intermediate chamber vessel capable of storing thereinto the wafer connected between the vacuum transfer vessels; a lock chamber connected to one of the vacuum transfer vessels; and a plurality of valves disposed among the vacuum transfer vessels, the vacuum process vessels, the intermediate chamber vessel, and the lock chamber respectively, for airtightly opening/closing communications among these vessels and the chamber; in which any one of the valves disposed on both sides of the intermediate chamber vessel is closed before the valves disposed between processing chambers of the vacuum process vessels and vacuum transfer chambers of the vacuum transfer vessels is opened.
摘要翻译：真空处理装置由两个真空转移容器组成，其中晶片被转移通过; 两个真空处理容器分别连接到这些真空转移容器上; 能够将连接在真空传送容器之间的晶片存储在其中的中间室容器; 连接到所述真空转移容器之一的锁定室; 以及分别设置在真空转移容器，真空处理容器，中间室容器和锁定室中的多个阀，用于气密地打开/关闭这些容器和腔室之间的通信; 其中在设置在真空处理容器的处理室和真空传送容器的真空传送室之间的阀打开之前，设置在中间室容器的两侧的任何一个阀关闭。

8. 发明授权

US08460467B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US08460467B2
公开(公告)日：2013-06-11
申请号：US13177076
申请日：2011-07-06
申请人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
发明人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
IPC分类号： C23F1/00 , C23C16/00 , H01L21/677
CPC分类号： H01L21/6719 , H01L21/67017 , Y10S414/135 , Y10S414/139
摘要： A vacuum processing apparatus includes a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas, and a mass flow controller unit interposed between two of the processing chambers for supplying gas to the chambers.
摘要翻译：一种真空处理装置，包括设置在其中心的转印单元，多个处理室，每个处理室具有用于支撑待处理物体的处理台，并使用气体进行处理;以及质量流量控制单元，用于向腔室供应气体的处理室。

9. 发明授权

US08286822B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US08286822B2
公开(公告)日：2012-10-16
申请号：US12651701
申请日：2010-01-04
申请人： Susumu Tauchi , Akitaka Makino
发明人： Susumu Tauchi , Akitaka Makino
IPC分类号： B65D6/40 , B65D53/02 , B65D43/04
CPC分类号： H01L21/67126 , H01L21/6719 , H01L21/67196 , H01L21/67201
摘要： The invention provides a highly reliable plasma processing apparatus having stable sealing performance. The vacuum processing apparatus comprises a vacuum vessel having its inside decompressed; an opening disposed in a wall of the vacuum vessel for communicating the inside with the outside thereof and through which a sample to be processed is taken in and out; a valve body 701 disposed outside the wall for airtightly sealing or opening the opening; and a drive unit for driving the valve body to carry out the sealing or opening operation, the drive unit comprising a first member 705 coupled to an actuator 702 that moves along a substantially linear first direction as a result of operation of the actuator, a second member 706 coupled to the first member 705 that moves along a substantially linear second direction that intersects with the first direction, and the valve body 701 coupled to the second member that seals the opening as a result of the movement of the second member.
摘要翻译：本发明提供了具有稳定的密封性能的高度可靠的等离子体处理装置。真空处理装置包括其内部减压的真空容器; 设置在真空容器的壁中的开口，用于将内部与其外部连通，并且待处理样品通过该开口被取出; 阀体701，其设置在所述壁的外侧，用于气密地密封或打开所述开口; 驱动单元，用于驱动阀体进行密封或打开操作，驱动单元包括第一构件705，第一构件705联接到作为致动器的操作的结果沿基本线性的第一方向移动的致动器702;第二构件构件706，其联接到第一构件705，其沿着与第一方向相交的基本上线性的第二方向移动;以及阀体701，其联接到由于第二构件的移动而密封开口的第二构件。

10. 发明申请

US20120163943A1 VACUUM PROCESSING APPARATUS 有权
标题翻译：真空加工设备
公开(公告)号：US20120163943A1
公开(公告)日：2012-06-28
申请号：US13022313
申请日：2011-02-07
申请人： Ryoichi ISOMURA , Susumu Tauchi , Hideaki Kondo
发明人： Ryoichi ISOMURA , Susumu Tauchi , Hideaki Kondo
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67742
摘要： The vacuum processing apparatus is comprised of two vacuum transfer vessels in which a wafer is transferred through; two vacuum process vessels connected to these vacuum transfer vessels respectively; an intermediate chamber vessel capable of storing thereinto the wafer connected between the vacuum transfer vessels; a lock chamber connected to one of the vacuum transfer vessels; and a plurality of valves disposed among the vacuum transfer vessels, the vacuum process vessels, the intermediate chamber vessel, and the lock chamber respectively, for airtightly opening/closing communications among these vessels and the chamber; in which any one of the valves disposed on both sides of the intermediate chamber vessel is closed before the valves disposed between processing chambers of the vacuum process vessels and vacuum transfer chambers of the vacuum transfer vessels is opened.
摘要翻译：真空处理装置由两个真空转移容器组成，其中晶片被转移通过; 两个真空处理容器分别连接到这些真空转移容器上; 能够将连接在真空传送容器之间的晶片存储在其中的中间室容器; 连接到所述真空转移容器之一的锁定室; 以及分别设置在真空传送容器，真空处理容器，中间室容器和锁定室之间的多个阀，用于气密地打开/关闭这些容器和腔室之间的通信; 其中在设置在真空处理容器的处理室和真空传送容器的真空传送室之间的阀打开之前，设置在中间室容器的两侧的任何一个阀关闭。

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