会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明申请
    • VACUUM PROCESSING APPARATUS AND OPERATING METHOD OF THE SAME
    • 真空加工装置及其操作方法
    • US20130142595A1
    • 2013-06-06
    • US13592408
    • 2012-08-23
    • Takahiro SHIMOMURAYoshifumi OGAWASusumu TAUCHI
    • Takahiro SHIMOMURAYoshifumi OGAWASusumu TAUCHI
    • H01L21/677
    • H01L21/67161H01L21/67184
    • A vacuum processing apparatus includes a row of containers of vacuum transfer chambers connected to each other behind a lock chamber, a wafer being transferred through depressurized inside of the row of the containers of the vacuum transfer containers, an intermediate chamber disposed between the containers of the vacuum transfer chambers, a plurality of processing units including processing containers respectively connected to left or right side walls of the containers of the vacuum transfer chambers and the wafer is processed therein, and a bypass chamber which constitutes a bypass path connecting the processing units, where only either the wafer which is being transferred from the lock chamber toward one of the processing units or the wafer which was processed in one of the processing units and is being transferred toward the lock chamber is transferred through the containers of the vacuum transfer chambers.
    • 真空处理装置包括一排在锁室后面彼此连接的真空传送室的容器,通过减压的真空传送容器的排的内部被转移的晶片,设置在真空传送容器的容器之间的中间室 在真空传送室中处理多个处理单元,包括分别连接到真空传送室的容器的左侧壁或右侧壁的处理容器和晶片,以及构成连接处理单元的旁路的旁路室,其中, 只有从锁定室转移到处理单元之一的晶片或在一个处理单元中被处理并且被转移到锁定室的晶片被传送通过真空传送室的容器。
    • 6. 发明申请
    • VACUUM PROCESSING APPARATUS
    • 真空加工设备
    • US20120067522A1
    • 2012-03-22
    • US13022232
    • 2011-02-07
    • Takahiro ShimomuraYutaka KudouMasakazu IsozakiTakashi Uemura
    • Takahiro ShimomuraYutaka KudouMasakazu IsozakiTakashi Uemura
    • C23F1/08B05C13/00B05C11/00
    • H01L21/67167H01L21/67109
    • A vacuum processing apparatus having an atmospheric-pressure transport chamber for conveying samples, lock chambers that accommodate the samples conveyed in and have an ambient capable of being switched between an atmospheric ambient and a vacuum ambient, a vacuum transport chamber coupled to the lock chambers, and at least one vacuum chamber for processing the samples. The apparatus further includes cooling portions operable to cool the high-temperature samples processed by the vacuum chamber. Each cooling portion has: a sample stage over which the high-temperature samples are placed and which has a coolant channel; gas-blowing tubes disposed closer to the inlet/exit port and acting to blow gas toward the sample stage; and an exhaust port disposed on the opposite side of the sample stage with regard to the inlet/exit port and acting to discharge the gas blown from the gas-blowing tubes.
    • 一种真空处理装置,具有用于输送样品的大气压输送室,容纳输送的样品的锁定室,以及能够在大气环境和真空环境之间切换的环境,耦合到锁定室的真空输送室, 以及用于处理样品的至少一个真空室。 该装置还包括可操作以冷却由真空室处理的高温样品的冷却部分。 每个冷却部分具有:样品台,高温样品放置在该样品台上,并具有冷却剂通道; 设置在入口/出口附近并用于向样品台吹气的气体吹送管; 以及排气口,其相对于入口/出口设置在样品台的相对侧上,并用于排出从气体吹送管吹出的气体。
    • 9. 发明授权
    • Vacuum processing apparatus and operating method of the same
    • 真空处理装置及其操作方法
    • US09245780B2
    • 2016-01-26
    • US13592408
    • 2012-08-23
    • Takahiro ShimomuraYoshifumi OgawaSusumu Tauchi
    • Takahiro ShimomuraYoshifumi OgawaSusumu Tauchi
    • H01L21/677H01L21/67
    • H01L21/67161H01L21/67184
    • A vacuum processing apparatus includes a row of containers of vacuum transfer chambers connected to each other behind a lock chamber, a wafer being transferred through depressurized inside of the row of the containers of the vacuum transfer containers, an intermediate chamber disposed between the containers of the vacuum transfer chambers, a plurality of processing units including processing containers respectively connected to left or right side walls of the containers of the vacuum transfer chambers and the wafer is processed therein, and a bypass chamber which constitutes a bypass path connecting the processing units, where only either the wafer which is being transferred from the lock chamber toward one of the processing units or the wafer which was processed in one of the processing units and is being transferred toward the lock chamber is transferred through the containers of the vacuum transfer chambers.
    • 真空处理装置包括一排在锁室后面彼此连接的真空传送室的容器,通过真空传送容器的容器排中的减压内部传送的晶片,设置在真空传送容器的容器之间的中间室 在真空传送室中处理多个处理单元,包括分别连接到真空传送室的容器的左侧壁或右侧壁的处理容器和晶片,以及构成连接处理单元的旁路的旁路室,其中, 只有从锁定室转移到处理单元之一的晶片或在一个处理单元中被处理并且被转移到锁定室的晶片被传送通过真空传送室的容器。
    • 10. 发明申请
    • VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD
    • 真空加工设备和真空加工方法
    • US20120093617A1
    • 2012-04-19
    • US13011041
    • 2011-01-21
    • Yutaka KudouHiroaki TakikawaTakahiro ShimomuraMasakazu IsozakiTakashi Uemura
    • Yutaka KudouHiroaki TakikawaTakahiro ShimomuraMasakazu IsozakiTakashi Uemura
    • H01L21/67
    • H01L21/67745H01L21/67748
    • A vacuum processing apparatus including a processing chamber for processing a sample to be processed, a cooling chamber for cooling the high-temperature sample processed in the processing chamber, and a vacuum transfer chamber for establishing a connection between the processing chamber and the cooling chamber, a vacuum transfer robot equipped inside the vacuum transfer chamber, wherein the cooling chamber includes a gas-exhausting unit for reducing pressure inside the cooling chamber, a gas-supplying unit for supplying a gas into the cooling chamber, a pressure-controlling unit for controlling the pressure inside the cooling chamber, a supporting unit for supporting the high-temperature sample, and a mounting stage for proximity-holding the sample supported by the supporting unit, the mounting stage having a temperature-adjusting unit for adjusting the temperature of surface of the mounting stage into a temperature which is capable of cooling the high-temperature sample, the supporting unit having an ascending/descending-speed varying unit.
    • 一种真空处理设备,包括处理待处理样品的处理室,用于冷却在处理室中处理的高温样品的冷却室和用于建立处理室和冷却室之间的连接的真空传送室, 设置在真空传送室内部的真空传送机器人,其中冷却室包括用于减小冷却室内的压力的排气单元,用于将气体供应到冷却室中的气体供应单元,用于控制 冷却室内的压力,用于支撑高温试样的支撑单元和用于接近保持由支撑单元支撑的样品的安装台,安装台具有用于调节表面温度的温度调节单元 将安装阶段转换成能够冷却高温样品的载体 g单元具有上升/下降速度变化单元。