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1. 发明申请

US20120163943A1 VACUUM PROCESSING APPARATUS 有权
标题翻译：真空加工设备
公开(公告)号：US20120163943A1
公开(公告)日：2012-06-28
申请号：US13022313
申请日：2011-02-07
申请人： Ryoichi ISOMURA , Susumu Tauchi , Hideaki Kondo
发明人： Ryoichi ISOMURA , Susumu Tauchi , Hideaki Kondo
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67742
摘要： The vacuum processing apparatus is comprised of two vacuum transfer vessels in which a wafer is transferred through; two vacuum process vessels connected to these vacuum transfer vessels respectively; an intermediate chamber vessel capable of storing thereinto the wafer connected between the vacuum transfer vessels; a lock chamber connected to one of the vacuum transfer vessels; and a plurality of valves disposed among the vacuum transfer vessels, the vacuum process vessels, the intermediate chamber vessel, and the lock chamber respectively, for airtightly opening/closing communications among these vessels and the chamber; in which any one of the valves disposed on both sides of the intermediate chamber vessel is closed before the valves disposed between processing chambers of the vacuum process vessels and vacuum transfer chambers of the vacuum transfer vessels is opened.
摘要翻译：真空处理装置由两个真空转移容器组成，其中晶片被转移通过; 两个真空处理容器分别连接到这些真空转移容器上; 能够将连接在真空传送容器之间的晶片存储在其中的中间室容器; 连接到所述真空转移容器之一的锁定室; 以及分别设置在真空传送容器，真空处理容器，中间室容器和锁定室之间的多个阀，用于气密地打开/关闭这些容器和腔室之间的通信; 其中在设置在真空处理容器的处理室和真空传送容器的真空传送室之间的阀打开之前，设置在中间室容器的两侧的任何一个阀关闭。

2. 发明申请

US20110318143A1 VACUUM PROCESSING APPARATUS 审中-公开
标题翻译：真空加工设备
公开(公告)号：US20110318143A1
公开(公告)日：2011-12-29
申请号：US12854255
申请日：2010-08-11
申请人： Ryoichi ISOMURA , Susumu Tauchi , Hideaki Kondo
发明人： Ryoichi ISOMURA , Susumu Tauchi , Hideaki Kondo
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67161
摘要： A vacuum processing apparatus includes a first lock chamber and a second lock chamber coupled to a back face side of the atmospheric transfer chamber in parallel, a first transfer chamber coupled to a rear side of the first lock chamber, a second transfer chamber coupled, on the rear side of the first transfer chamber, a third transfer chamber coupled to the rear side of the second lock chamber, a first and a second relay chamber disposed between the first transfer chamber/the second transfer chamber and the first transfer chamber/the third transfer chamber to transfer a wafer between these chambers, and a plurality of processing chambers coupled to either the first, the second or the third transfer chamber, in addition, the number of the processing chambers coupled to the second transfer chamber is greater than that of the processing chambers coupled to either the first or the third transfer chamber, and the wafer alone processed in the processing chamber coupled to either the first or the second transfer chamber is transferred to the third robot in the second relay chamber.
摘要翻译：真空处理装置包括并联连接到大气传送室的背面侧的第一锁定室和第二锁定室，耦合到第一锁定室的后侧的第一传送室，耦合到第二锁定室第一传送室的后侧，耦合到第二锁定室的后侧的第三传送室，设置在第一传送室/第二传送室和第一传送室/第三传送室之间的第一和第二中继室传送室以在这些室之间传送晶片，以及耦合到第一，第二或第三传送室的多个处理室，另外，耦合到第二传送室的处理室的数量大于耦合到第一或第三传送室的处理室，以及在处理室中单独处理的晶片，其耦合到第一或第二传输室第二传送室被传送到第二中继室中的第三机器人。

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