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    • 1. 发明申请
    • WATER-SOLUBLE RESIN COMPOSITION FOR THE FORMATION OF MICROPATTERNS AND METHOD FOR THE FORMATION OF MICROPATTERNS WITH THE SAME
    • 用于形成微波炉的水溶性树脂组合物及其形成微波炉的方法
    • US20100119717A1
    • 2010-05-13
    • US12451150
    • 2008-05-01
    • Sung-Eun HongYusuke TakanoWen-Bing Kang
    • Sung-Eun HongYusuke TakanoWen-Bing Kang
    • B05D3/00C08K5/17
    • H01L21/0271G03F7/40H01L21/3085H01L21/3086H01L21/3088
    • A process which comprises applying a water-soluble resin composition comprising a water-soluble vinyl resin, a compound having at least two amino groups in the molecule, a solvent, and, if necessary, an additive such as a surfactant on a resist pattern (2) formed on a substrate (1) to form a water-soluble resin film (3) , modifying part of the water-soluble resin film adjacent to the resist pattern through mixing to form a water-insolubilized layer (4) which cannot be removed by water washing on the surface of the resist pattern, and removing unmodified part of the water-soluble resin film by water washing and which enables the effective scale-down of separation size and hole opening size of a resist pattern to a level finer than the limit of resolution of the wave length of exposure. It is preferable to use as the water-soluble vinyl resin a homopolymer of a nitrogen-containing vinyl monomer such as acrylamine, vinylpyrrolidone or vinylimidazole, a copolymer of two or more nitrogen-containing vinyl monomers, or a copolymer of at least one nitrogen-containing vinyl monomer and at least one nitrogen-free vinyl monomer.
    • 一种方法,其包括将包含水溶性乙烯基树脂的水溶性树脂组合物,分子中具有至少两个氨基的化合物,溶剂和必要时在抗蚀图案上添加表面活性剂等添加剂 2)形成在基板(1)上以形成水溶性树脂膜(3),通过混合将与抗蚀剂图案相邻的水溶性树脂膜的一部分进行改性以形成不可溶的水不溶层(4) 通过在抗蚀剂图案的表面上进行水洗除去,并且通过水洗除去未改性的水溶性树脂膜的部分,并且能够将抗蚀剂图案的分离尺寸和开孔尺寸有效地缩小到比 曝光波长分辨率的极限。 作为水溶性乙烯基树脂,优选使用丙烯酰胺,乙烯基吡咯烷酮或乙烯基咪唑等含氮乙烯基单体的均聚物,两种以上含氮乙烯基单体的共聚物,或至少一种含氮乙烯基单体的共聚物, 含有乙烯基单体和至少一种无氮乙烯基单体。
    • 2. 发明授权
    • Apparatus for detecting defects of wires on a wiring board wherein
optical sensor includes a film of polymer non-linear optical material
    • 用于检测布线板上的导线缺陷的装置,其中光学传感器包括聚合物非线性光学材料的薄膜
    • US5844249A
    • 1998-12-01
    • US779571
    • 1997-01-07
    • Yusuke TakanoShizuo OguraTsunetoshi SugiyamaWen-Bing Kang
    • Yusuke TakanoShizuo OguraTsunetoshi SugiyamaWen-Bing Kang
    • G01N21/956G01R31/309G01N21/86
    • G01N21/956G01R31/309
    • A detecting apparatus capable of supporting even narrow wire widths and of detecting defects of wires in a non-contact manner is provided. The detecting apparatus comprises an optical sensor, a sensor head, and a signal processing unit. The optical sensor comprises a transparent substrate, a transparent electrode disposed on the transparent substrate, a thin film of a polymer non-linear optical material disposed on the transparent electrode, and a reflective film disposed on the thin film, and is positioned in close approximation to and without contacting an electrode to be measured on the wiring board. The sensor head comprises a light source, optical means for guiding light from the light source into the optical sensor, and detecting means for detecting reflected light from the optical sensor. The detecting means supplies the signal processing unit with a signal corresponding to the intensity of the reflected light when the electrode on the wiring board is applied with a voltage.
    • 提供能够以非接触方式支持甚至窄线宽度和检测线的缺陷的检测装置。 检测装置包括光学传感器,传感器头和信号处理单元。 光学传感器包括透明基板,设置在透明基板上的透明电极,设置在透明电极上的聚合物非线性光学材料的薄膜和设置在薄膜上的反射膜,并且近似定位 在接线板上接触和不接触要测量的电极。 传感器头包括光源,用于将来自光源的光引导到光学传感器中的光学装置,以及用于检测来自光学传感器的反射光的检测装置。 当施加电压时,检测装置向信号处理单元提供与反射光的强度对应的信号。
    • 3. 发明授权
    • Triazine polymers
    • 三嗪聚合物
    • US5652327A
    • 1997-07-29
    • US386886
    • 1995-02-10
    • Wen-Bing KangTsunetoshi SugiyamaShizuo OguraYusuke Takano
    • Wen-Bing KangTsunetoshi SugiyamaShizuo OguraYusuke Takano
    • G02F1/35C08G65/40C08G73/02C08G73/06C08G75/02C08G75/04G02F1/355G02F1/361C08F26/06C08F126/06
    • G02F1/3617C08G65/4006C08G73/0273C08G73/0644
    • A polymer containing triazine rings that has a molecular weight of 5,000-1,000,000 and that comprises a recurring unit represented by the general formula (I): ##STR1## wherein X.sup.1 and X.sup.2 are each independently S, NR.sup.1 (R is a hydrogen atom, an alkyl group or an aryl group) or O; Y may be an alkylene group, a divalent substituted or unsubstituted aromatic ring group that do not contain chromophore moieties or a group in which said aromatic ring groups are bonded or condensed together; Z is either a spacer group comprising a group represented by --G--(CH.sub.2).sub.n -- (n is an integer of 1-10) or a direct bond (G is S, NR.sup.4 or O, and R.sup.4 is a hydrogen atom, an alkyl group or an aryl group); and A is an organic chromophore moiety in which an electron donative group and an electron attractive group are conjugated via a .pi.-electron system. The polymer is lightproof, forms a thin film of high quality and has a high glass transition point.
    • 包含分子量为5,000-1,000,000的三嗪环的聚合物,其包含由通式(I)表示的重复单元:其中X1和X2各自独立地为S,NR1(R为氢) 原子,烷基或芳基)或O; Y可以是亚烷基,不含发色团部分的二价取代或未取代的芳环基团或所述芳环结合或缩合在一起的基团; Z是由-G-(CH2)n-(n为1-10的整数)或直接键(G为S,NR4或O,R4为氢原子, 烷基或芳基); A是有机发色团部分,其中给电子基团和吸电子基团通过π电子体系共轭。 聚合物是防光的,形成高质量的薄膜,玻璃化转变温度高。
    • 4. 发明授权
    • Process for preventing development defect and composition for use in the same
    • 用于预防发展缺陷和组合物的方法
    • US07799513B2
    • 2010-09-21
    • US10518105
    • 2003-06-10
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • G03F7/00
    • G03F7/11G03F7/168
    • The composition for preventing development-defects containing (1) an ammonium salt, a tetraalkylammonium salt or a C1 to C4 alkanolamine salt of C4 to C15 perfluoroalkylcarboxylic acid, C4 to C10 perfluoroalkylsulfonic acid and perfluoroadipic acid, or (2) a fluorinated alkyl quaternary ammonium salt of inorganic acid, wherein said surfactant is formed at the equivalent ratio of acid to base of 1:1-1:3 is applied on a chemically amplified photoresist coating on a substrate having a diameter of 8 inches or more. The chemically amplified photoresist coating is baked before and/or after applying the composition for preventing development-defects described above. Then, the baked coating with the development-defect preventing composition coating is exposed to light, post-exposure-baked, and developed. By this process, compared with the case of not using the composition for preventing development-defects, the amount of reduction in film thickness of the photoresist subsequent to development treatment is made further bigger by 100 Å to 600 Å, and the development-defects on a substrate having a diameter of 8 inches or more is reduced as well as a resist pattern having a good cross section form can be formed without T-top form etc.
    • (1)C4〜C15全氟烷基羧酸,C4〜C10全氟烷基磺酸和全氟己二酸的铵盐,四烷基铵盐或C1〜C4烷醇胺盐的预防显影缺陷用组合物,或(2)氟化烷基季铵 无机酸的盐,其中所述表面活性剂以相对于酸与碱的比例为1:1-1:3的比例形成在直径为8英寸或更大的基材上的化学放大的光致抗蚀剂涂层上。 在施加用于防止上述显影缺陷的组合物之前和/或之后烘烤化学放大的光致抗蚀剂涂层。 然后,将具有显影缺陷防止组合物涂层的烘烤涂层曝光,曝光后烘烤和显影。 通过该方法,与不使用用于防止显影缺陷的组合物的情况相比,显影处理后的光致抗蚀剂的膜厚减少量进一步大于100埃至600埃,并且显影缺陷在 直径为8英寸以上的基板减少,并且可以形成具有良好横截面形状的抗蚀剂图案而不具有T形顶端形式等。
    • 5. 发明授权
    • Water soluble resin composition and method for pattern formation using the same
    • 水溶性树脂组合物及其形成方法
    • US07745093B2
    • 2010-06-29
    • US11547707
    • 2005-04-08
    • Takeshi NishibeSung Eun HongYusuke TakanoTetsuo Okayasu
    • Takeshi NishibeSung Eun HongYusuke TakanoTetsuo Okayasu
    • G03F7/40G03F7/11
    • G03F7/40H01L21/0273Y10S430/106Y10S430/11Y10S430/115Y10S430/162Y10S430/165
    • In the present invention, in a water soluble resin composition for use in a method for pattern formation in which a covering layer is provided on a resist pattern formed of a radiation-sensitive resin composition capable of coping with ArF exposure to increase the width of the resist pattern and thus to realize effective formation of higher density trench or hole pattern, the size reduction level of the resist pattern layer can be further increased as compared with that in the prior art technique, and, in addition, the size reduction level dependency of the coarse-and-fine resist pattern can be reduced. A method for pattern formation using the water soluble resin composition is also provided. The water soluble resin composition which is usable for the method for pattern formation applicable to ArF excimer laser irradiation comprises a water soluble resin, an acid generating agent capable of generating an acid upon heating, a surfactant, a crosslinking agent, and a water-containing solvent.
    • 在本发明中,在用于图案形成方法的水溶性树脂组合物中,其中在由能够应对ArF曝光的辐射敏感性树脂组合物形成的抗蚀剂图案上设置覆盖层以增加其宽度 抗蚀剂图案,从而实现有效形成更高密度的沟槽或孔图案,与现有技术相比,抗蚀剂图案层的尺寸减小水平可以进一步提高,另外,尺寸缩小级依赖性 可以减少粗细和抗蚀剂图案。 还提供了使用水溶性树脂组合物的图案形成方法。 可用于适用于ArF准分子激光照射的图案形成方法的水溶性树脂组合物包括水溶性树脂,加热时能产生酸的酸产生剂,表面活性剂,交联剂和含水的 溶剂。
    • 6. 发明申请
    • Process for Preventing Development Defect and Composition for Use in the Same
    • 防止发展缺陷和组合使用的过程
    • US20100324330A1
    • 2010-12-23
    • US12853640
    • 2010-08-10
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • C07C309/02C07C53/21C07C55/14
    • G03F7/11G03F7/168
    • The composition for preventing development-defects containing (1) an ammonium salt, a tetraalkylammonium salt or a C1 to C4 alkanolamine salt of C4 to C15 perfluoroalkylcarboxylic acid, C4 to C10 perfluoroalkylsulfonic acid and perfluoroadipic acid, or (2) a fluorinated alkyl quaternary ammonium salt of inorganic acid, wherein said surfactant is formed at the equivalent ratio of acid to base of 1:1-1:3 is applied on a chemically amplified photoresist coating on a substrate having a diameter of 8 inches or more. The chemically amplified photoresist coating is baked before and/or after applying the composition for preventing development-defects described above. Then, the baked coating with the development-defect preventing composition coating is exposed to light, post-exposure-baked, and developed. By this process, compared with the case of not using the composition for preventing development-defects, the amount of reduction in film thickness of the photoresist subsequent to development treatment is made further bigger by 100 Å to 600 Å, and the development-defects on a substrate having a diameter of 8 inches or more is reduced as well as a resist pattern having a good cross section form can be formed without T-top form etc.
    • (1)C4〜C15全氟烷基羧酸,C4〜C10全氟烷基磺酸和全氟己二酸的铵盐,四烷基铵盐或C1〜C4链烷醇胺盐,或(2)氟化烷基季铵 无机酸的盐,其中所述表面活性剂以相对于酸与碱的比例为1:1-1:3的比例形成在直径为8英寸或更大的基材上的化学放大的光致抗蚀剂涂层上。 在施加用于防止上述显影缺陷的组合物之前和/或之后烘烤化学放大的光致抗蚀剂涂层。 然后,将具有显影缺陷防止组合物涂层的烘烤涂层曝光,曝光后烘烤和显影。 通过该方法,与不使用用于防止显影缺陷的组合物的情况相比,显影处理后的光致抗蚀剂的膜厚减少量进一步大于100埃至600埃,并且显影缺陷在 直径为8英寸以上的基板减少,并且可以形成具有良好横截面形状的抗蚀剂图案而不具有T形顶端形式等。
    • 7. 发明授权
    • Water soluble resin composition, method of pattern formation and method of inspecting resist pattern
    • 水溶性树脂组合物,图案形成方法和抗蚀剂图案检查方法
    • US07335464B2
    • 2008-02-26
    • US10546334
    • 2004-02-16
    • Yusuke TakanoSung-Eun Hong
    • Yusuke TakanoSung-Eun Hong
    • G03F7/039G03F7/40
    • G03F7/40Y10S430/115Y10S430/165
    • A water-soluble resin composition of the present invention comprises at least a water-soluble resin, an acid generator capable of generating an acid by heating and a solvent containing water. The water-soluble resin composition is applied on a highly water-repellant resist pattern 3 formed by a resist such as an ArF-responsive radiation sensitive resin composition on a substrate 1 to form a coated layer 4 thereon. The resist pattern 3 and the coated layer 4 are heat-treated to form a developer-insoluble modified coated layer 5 in the vicinity of a surface of the resist pattern 3. The coated layer is developed and the resist pattern thickened by the modified layer 5 is formed. The modified layer is a layer with sufficient thickness and is able to be formed with a high dimensional controllability in a highly water-repellant resist pattern such as ArF-responsive radiation sensitive resin composition. As a result, a separation size and a hole aperture size of the resist pattern are reduced effectively to less than a limit resolution. As the modified layer 5 has a function of a protecting film for the resist pattern upon electron beam irradiation, a size measurement fluctuation of a resist pattern upon electron beam irradiation by a size measuring SEM can be prevented.
    • 本发明的水溶性树脂组合物至少包含水溶性树脂,能够通过加热产生酸的酸发生剂和含有水的溶剂。 将水溶性树脂组合物涂布在由抗蚀剂如ArF响应性辐射敏感性树脂组合物形成的高度防水抗蚀剂图案3上,在基材1上形成涂层4。 抗蚀剂图案3和涂层4被热处理以在抗蚀剂图案3的表面附近形成显影剂不溶性改性涂层5。 显影涂层,形成由改性层5增厚的抗蚀剂图案。 改性层是具有足够厚度的层,并且能够在诸如ArF响应性辐射敏感性树脂组合物的高度防水抗蚀剂图案中形成具有高尺寸可控性。 结果,抗蚀剂图案的分离尺寸和孔径尺寸被有效地降低到小于限定分辨率。 由于改性层5具有电子束照射时抗蚀剂图案的保护膜的功能,因此可以防止通过尺寸测量SEM的电子束照射时的抗蚀剂图案的尺寸测量波动。
    • 8. 发明申请
    • Water soluble resin composition, method of pattern formation and method of inspecting resist pattern
    • 水溶性树脂组合物,图案形成方法和抗蚀剂图案检查方法
    • US20060160015A1
    • 2006-07-20
    • US10546334
    • 2004-02-16
    • Yusuke TakanoSung-Eun Hong
    • Yusuke TakanoSung-Eun Hong
    • G03C1/76
    • G03F7/40Y10S430/115Y10S430/165
    • A water-soluble resin composition of the present invention comprises at least a water-soluble resin, an acid generator capable of generating an acid by heating and a solvent containing water. The water-soluble resin composition is applied on a highly water-repellant resist pattern 3 formed by a resist such as an ArF-responsive radiation sensitive resin composition on a substrate 1 to form a coated layer 4 thereon. The resist pattern 3 and the coated layer 4 are heat-treated to form a developer-insoluble modified coated layer 5 in the vicinity of a surface of the resist pattern 3. The coated layer is developed and the resist pattern thickened by the modified layer 5 is formed. The modified layer is a layer with sufficient thickness and is able to be formed with a high dimensional controllability in a highly water-repellant resist pattern such as ArF-responsive radiation sensitive resin composition. As a result, a separation size and a hole aperture size of the resist pattern are reduced effectively to less than a limit resolution. As the modified layer 5 has a function of a protecting film for the resist pattern upon electron beam irradiation, a size measurement fluctuation of a resist pattern upon electron beam irradiation by a size measuring SEM can be prevented.
    • 本发明的水溶性树脂组合物至少包含水溶性树脂,能够通过加热产生酸的酸发生剂和含有水的溶剂。 将水溶性树脂组合物涂布在由抗蚀剂如ArF响应性辐射敏感性树脂组合物形成的高度防水抗蚀剂图案3上,在基材1上形成涂层4。 抗蚀剂图案3和涂层4被热处理以在抗蚀剂图案3的表面附近形成显影剂不溶性改性涂层5.涂层被显影,并且由改性层5增厚的抗蚀剂图案 形成了。 改性层是具有足够厚度的层,并且能够在诸如ArF响应性辐射敏感性树脂组合物的高度防水抗蚀剂图案中形成具有高尺寸可控性。 结果,抗蚀剂图案的分离尺寸和孔径尺寸被有效地降低到小于限定分辨率。 由于改性层5具有电子束照射时抗蚀剂图案的保护膜的功能,因此可以防止通过尺寸测量SEM的电子束照射时的抗蚀剂图案的尺寸测量波动。
    • 9. 发明申请
    • Water Soluble Resin Composition and Method for Pattern Formation Using the Same
    • 水溶性树脂组合物及其形成方法
    • US20080193880A1
    • 2008-08-14
    • US11547707
    • 2005-04-08
    • Takeshi NishibeSung Eun HongYusuke TakanoTetsuo Okayasu
    • Takeshi NishibeSung Eun HongYusuke TakanoTetsuo Okayasu
    • G03F7/004
    • G03F7/40H01L21/0273Y10S430/106Y10S430/11Y10S430/115Y10S430/162Y10S430/165
    • In the present invention, in a water soluble resin composition for use in a method for pattern formation in which a covering layer is provided on a resist pattern formed of a radiation-sensitive resin composition capable of coping with ArF exposure to increase the width of the resist pattern and thus to realize effective formation of higher density trench or hole pattern, the size reduction level of the resist pattern layer can be further increased as compared with that in the prior art technique, and, in addition, the size reduction level dependency of the coarse-and-fine resist pattern can be reduced. A method for pattern formation using the water soluble resin composition is also provided. The water soluble resin composition which is usable for the method for pattern formation applicable to ArF excimer laser irradiation comprises a water soluble resin, an acid generating agent capable of generating an acid upon heating, a surfactant, a crosslinking agent, and a water-containing solvent.
    • 在本发明中,在用于图案形成方法的水溶性树脂组合物中,其中在由能够应对ArF曝光的辐射敏感性树脂组合物形成的抗蚀剂图案上设置覆盖层以增加其宽度 抗蚀剂图案,从而实现有效形成更高密度的沟槽或孔图案,与现有技术相比,抗蚀剂图案层的尺寸减小水平可以进一步提高,另外,尺寸缩小级依赖性 可以减少粗细和抗蚀剂图案。 还提供了使用水溶性树脂组合物的图案形成方法。 可用于适用于ArF准分子激光照射的图案形成方法的水溶性树脂组合物包括水溶性树脂,加热时能产生酸的酸产生剂,表面活性剂,交联剂和含水的 溶剂。
    • 10. 发明申请
    • Process for preventing development defect and composition for use in the same
    • 用于预防发展缺陷和组合物的方法
    • US20050221236A1
    • 2005-10-06
    • US10518105
    • 2003-06-10
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • Yasushi AkiyamaYusuke TakanoKiyohisa TakahashiSung-Eun HongTetsuo Okayasu
    • G03F7/11G03F7/16G03F7/38H01L21/027G03F7/40
    • G03F7/11G03F7/168
    • The composition for preventing development-defects containing (1) an ammonium salt, a tetraalkylammonium salt or a C1 to C4 alkanolamine salt of C4 to C15 perfluoroalkylcarboxylic acid, C4 to C10 perfluoroalkylsulfonic acid and perfluoroadipic acid, or (2) a fluorinated alkyl quaternary ammonium salt of inorganic acid, wherein said surfactant is formed at the equivalent ratio of acid to base of 1:1-1:3 is applied on a chemically amplified photoresist coating on a substrate having a diameter of 8 inches or more. The chemically amplified photoresist coating is baked before and/or after applying the composition for preventing development-defects described above. Then, the baked coating with the development-defect preventing composition coating is exposed to light, post-exposure-baked, and developed. By this process, compared with the case of not using the composition for preventing development-defects, the amount of reduction in film thickness of the photoresist subsequent to development treatment is made further bigger by 100 Å to 600 Å, and the development-defects on a substrate having a diameter of 8 inches or more is reduced as well as a resist pattern having a good cross section form can be formed without T-top form etc.
    • 用于防止含有(1)C 4的铵盐,四烷基铵盐或C 1〜C 4烷醇胺盐的显影缺陷的组合物 的全氟烷基羧酸,C 4〜C 10全氟烷基磺酸和全氟己二酸,或(2)氟代烷基季铵盐 无机酸,其中所述表面活性剂以相对于酸与碱的比例为1:1:1:3的比例形成在直径为8英寸或更大的基材上的化学放大的光致抗蚀剂涂层上。 在施加用于防止上述显影缺陷的组合物之前和/或之后烘烤化学放大的光致抗蚀剂涂层。 然后,将具有显影缺陷防止组合物涂层的烘烤涂层曝光,曝光后烘烤和显影。 通过该方法,与不使用用于防止显影缺陷的组合物的情况相比,显影处理后的光致抗蚀剂的膜厚减少量进一步大于100埃至600埃,并且显影缺陷在 直径为8英寸以上的基板减少,并且可以形成具有良好横截面形状的抗蚀剂图案而不具有T形顶端形式等。