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    • 5. 发明授权
    • Process for producing semiconductor substrate
    • 半导体衬底的制造方法
    • US06258698B1
    • 2001-07-10
    • US09046600
    • 1998-03-24
    • Yukiko IwasakiKatsumi NakagawaTakao YoneharaShoji NishidaKiyofumi Sakaguchi
    • Yukiko IwasakiKatsumi NakagawaTakao YoneharaShoji NishidaKiyofumi Sakaguchi
    • H01L2130
    • H01L21/2007
    • A process for producing a semiconductor substrate is provided which comprises a first step of anodizing a surface of a first substrate to form a porous layer on the surface, a second step of simultaneously forming a semiconductor layer on the surface of the porous layer and a semiconductor layer on a surface of the first substrate on its side opposite to the porous layer side, a third step of bonding the surface of the semiconductor layer formed on the surface of the porous layer to a surface of a second substrate, and a fourth step of separating the first substrate and the second substrate at the part of the porous layer to transfer to the second substrate the semiconductor layer formed on the surface of the porous layer, thereby providing the semiconductor layer on the surface of the second substrate. This makes it possible to produce semiconductor substrates at a low cost while making good use of expensive substrate materials.
    • 提供了一种制造半导体衬底的方法,其包括:第一步骤,阳极氧化第一衬底的表面以在表面上形成多孔层;第二步骤,在多孔层的表面上同时形成半导体层,半导体 在与第一基板的与多孔层侧相反的一侧的表面上的第三步骤,将形成在多孔层的表面上的半导体层的表面接合到第二基板的表面上的第三步骤, 在所述多孔层的一部分处分离所述第一基板和所述第二基板,以将所述半导体层转移到所述第二基板,所述半导体层形成在所述多孔层的表面上,从而在所述第二基板的表面上提供所述半导体层。 这使得可以以低成本制造半导体衬底,同时充分利用昂贵的衬底材料。
    • 8. 发明授权
    • Method and apparatus for producing photoelectric conversion device
    • 光电转换装置的制造方法及装置
    • US06391743B1
    • 2002-05-21
    • US09401775
    • 1999-09-22
    • Masaaki IwaneTakao YoneharaKazuaki OhmiShoji NishidaKiyofumi SakaguchiKazutaka Yanagita
    • Masaaki IwaneTakao YoneharaKazuaki OhmiShoji NishidaKiyofumi SakaguchiKazutaka Yanagita
    • H01L2130
    • H01L31/072H01L21/67092H01L21/76254H01L2221/68363Y02E10/50
    • There is disclosed a method of producing a photoelectric conversion device comprising the steps of forming a semiconductor substrate comprising a first and a second semiconductor layers with a separation layer therebetween; bonding a support substrate to a surface of the second semiconductor layer opposite to the separation-layer-side surface to form a bonded substrate; separating the first and the second semiconductor layers by the separation layer; and producing a photoelectric conversion device in the second semiconductor layer, wherein when bonding the semiconductor substrate and the support substrate to each other, at least a portion is formed in the bonded substrate in which at least a part of end portions of the semiconductor substrate and the support substrate is not bonded to the other substrate and a fluid is jetted against a side surface of the bonded substrate, thereby separating the first and the second semiconductor layers. The method makes it possible to separate a bonded substrate with a high yield, thereby supplying photoelectric conversion devices with a high quality at a low production cost.
    • 公开了一种制造光电转换装置的方法,包括以下步骤:形成包括第一和第二半导体层的半导体衬底,其间具有分离层; 将支撑基板接合到与分离层侧表面相对的第二半导体层的表面,以形成键合衬底; 通过分离层分离第一和第二半导体层; 以及在所述第二半导体层中制造光电转换器件,其中当将所述半导体衬底和所述支撑衬底彼此接合时,至少一部分形成在所述键合衬底中,其中所述半导体衬底和所述支撑衬底的至少一部分端部和 支撑基板不与另一个基板接合,并且流体相对于键合衬底的侧表面喷射,从而分离第一和第二半导体层。 该方法可以以高产率分离粘合的基片,从而以低的生产成本提供高质量的光电转换装置。