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    • 2. 发明授权
    • Laser printer and light source suitable for the same
    • 激光打印机和光源适合相同
    • US6091439A
    • 2000-07-18
    • US966193
    • 1997-11-07
    • Shinichi NakatsukaSusumu SaitoAkira Arimoto
    • Shinichi NakatsukaSusumu SaitoAkira Arimoto
    • H01S5/042H01S3/08
    • H01S5/0425H01S2301/18
    • A laser printer is provided printing with a high precision simply and at a high speed, and the laser printer uses a semiconductor laser which can vary the diameter of the emitted light while the light density is held constant. In the laser printer, laser rays emitted from a semiconductor laser are irradiated onto a photoconductor to vary its surface potential to produce a charge pattern particles adhere, and printing is performed by transferring the changed particles to a printing object. The semiconductor laser has a plurality of waveguide type resonators, the emitted beams of the resonators having a spatial superposition, and light emission is possible so that the emitted beams of the resonators having a spatial superposition with respect to each other among the resonators of the semiconductor laser are not substantially superimposed in time.
    • 提供了一种激光打印机,其简单且高速地以高精度进行打印,并且激光打印机使用半导体激光器,其可以在光密度保持恒定的同时改变发射光的直径。 在激光打印机中,将从半导体激光器发射的激光照射到光电导体上以改变其表面电位以产生电荷图案颗粒粘附,并且通过将改变的颗粒转印到印刷对象来进行印刷。 半导体激光器具有多个波导型谐振器,发射的谐振器的光束具有空间叠加,并且发光是可能的,使得谐振器的发射光束在半导体的谐振器之间具有相对于彼此的空间叠加 激光器在时间上基本上没有重叠。
    • 5. 发明授权
    • Semiconductor laser array
    • 半导体激光阵列
    • US06829265B2
    • 2004-12-07
    • US10145022
    • 2002-05-15
    • Shinichi NakatsukaSusumu SaitoJunshin SakamotoKazuo SakakiMasahide Tokuda
    • Shinichi NakatsukaSusumu SaitoJunshin SakamotoKazuo SakakiMasahide Tokuda
    • H01S304
    • H01S5/4031H01L2224/13H01S5/0224H01S5/02272H01S5/02276
    • The subject of the disclosed art is to prevent a short circuit between plural electrodes caused by soldering in the assembling process for a semiconductor laser element. The constitution for improving the subject is as follows. A semiconductor laser device comprises a semiconductor laser chip having a first electrode and a laser sustaining material, in which the laser sustaining material has electrodes and solder layers connected electrically therewith on the surface where the semiconductor laser chip is mounted, the first electrode of the semiconductor laser chip is connected with the solder layer of the laser sustaining material and at least the solder layer of the laser sustaining material extends from at least one end face in the longitudinal direction of an optical resonator of the semiconductor laser chip to the outside of the optical resonator.
    • 所公开的技术的主题是为了防止在半导体激光元件的组装过程中由焊接引起的多个电极之间的短路。 改进主题的宪法如下。 半导体激光器件包括具有第一电极和激光维持材料的半导体激光器芯片,其中激光维持材料具有在其上安装半导体激光器芯片的表面上与其电连接的电极和焊料层,半导体的第一电极 激光芯片与激光维持材料的焊料层连接,并且至少激光维持材料的焊料层从半导体激光器芯片的光学谐振器的纵向方向上的至少一个端面延伸到光学器件的外部 谐振器。
    • 9. 发明申请
    • Method for assembling array-type semiconductor laser device
    • 阵列式半导体激光器件的组装方法
    • US20090042327A1
    • 2009-02-12
    • US12219133
    • 2008-07-16
    • Shinichi Nakatsuka
    • Shinichi Nakatsuka
    • H01L21/02
    • H01S5/4031H01S5/02268H01S5/02272
    • According to an aspect of the present invention, there is provided a method for assembling a semiconductor laser device, including: preparing a laser chip including: a substrate; stripe waveguides that are formed on the substrate and that each includes a gain producing area and a window area; electrodes formed on the stripe waveguides; an insulating layer formed on the electrodes; a metal layer formed on the insulating layer; projections arranged at an interval in the window areas; and joining structures connected to the electrodes and formed in the window areas; preparing a submount including: a first solder; second solders arranged at the interval; and submount electrodes connected to the second solders; contacting the laser chip to the submount by fitting the projections with respect to the second solders; and heating the submount and the laser chip.
    • 根据本发明的一个方面,提供了一种用于组装半导体激光器件的方法,包括:准备包括:衬底的激光器芯片; 条形波导,其形成在基板上,并且每个包括增益产生区域和窗口区域; 在条形波导上形成的电极; 形成在电极上的绝缘层; 形成在所述绝缘层上的金属层; 在窗口区域间隔布置的突起; 以及连接到电极并形成在窗口区域中的接合结构; 准备一个底座,包括:第一个焊锡; 第二次焊接间隔排列; 和连接到第二焊料的底座电极; 通过将所述突起相对于所述第二焊料接合来将所述激光芯片接触所述基座; 并加热底座和激光芯片。
    • 10. 发明授权
    • Fabrication process of semiconductor lasers
    • 半导体激光器的制造工艺
    • US4783425A
    • 1988-11-08
    • US924774
    • 1986-10-30
    • Tadashi FukuzawaYuichi OnoShinichi NakatsukaTakashi Kajimura
    • Tadashi FukuzawaYuichi OnoShinichi NakatsukaTakashi Kajimura
    • H01L33/00H01S5/20H01S5/223H01S5/323H01S5/34H01L21/205H01L21/225H01L21/265
    • B82Y20/00H01L33/0062H01S5/2231H01S5/34H01S5/2081H01S5/32316
    • A p-GaAlAs cladding layer is exposed to the air if a groove of the form of a stripe is formed by chemical etching in an n-GaAs layer that serves as a current confinement layer on the p-GaAlAs cladding layer, the groove being so formed as to reach the cladding layer. The GaAlAs is oxidized so easily that an unstable degradation layer is formed on the surface thereof. To solve this problem according to the prior art, an undoped GaAs layer that serves as a cover layer is formed on the p-GaAlAs cladding layer, the n-GaAs layer is formed, and the etching is effected so that the undoped GaAs layer is simply exposed. The undoped GaAs layer is then heated in the MBE apparatus while being irradiated with the As molecular beam and is thermally etched. Therefore, the cladding layer is exposed in vacuum and the p-GaAlAs layer is formed thereon. However, this method is not suited for mass-production since the thermal etching is unstable and it needs the MBE apparatus of a very high degree of vacuum. Quality of the crystal decreases, too, due to the heating. This invention therefore provides a fabrication process of semiconductor lasers in which the cover layer disappears due to interdiffusion of constituent elements that stem from the diffusion of impurities such as zinc ions in the undoped GaAs layer.
    • 如果通过在p-GaAlAs包层上作为电流限制层的n-GaAs层中的化学蚀刻形成条纹形式的沟槽,则p-GaAlAs包层暴露于空气中,凹槽为 形成为到达包层。 GaAlAs容易氧化,从而在其表面上形成不稳定的降解层。 为了解决现有技术的问题,在p-GaAlAs包层上形成作为覆盖层的未掺杂的GaAs层,形成n-GaAs层,进行蚀刻,使未掺杂的GaAs层为 简单暴露。 然后在MBE装置中加热未掺杂的GaAs层,同时用As分子束照射并进行热蚀刻。 因此,在真空中露出包覆层,在其上形成p-GaAlAs层。 然而,该方法不适于批量生产,因为热蚀刻不稳定,并且需要非常高真空度的MBE装置。 由于加热,晶体的质量也降低。 因此,本发明提供一种半导体激光器的制造工艺,其中由于在未掺杂的GaAs层中的诸如锌离子的杂质的扩散而导致的构成元素的相互扩散,覆盖层消失。