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1. 发明授权

US06882782B2 Photonic devices for optical and optoelectronic information processing 失效
标题翻译：用于光电和光电子信息处理的光子器件
公开(公告)号：US06882782B2
公开(公告)日：2005-04-19
申请号：US09855741
申请日：2001-05-16
申请人： Samuel D. Conzone , Joseph S. Hayden , Alexander J. Marker, III , Marren Walther , Rainer Liebald , Ulrike Beer , Ulrich Peuschert , Ruediger Sprengard , Tobias Käleer
发明人： Samuel D. Conzone , Joseph S. Hayden , Alexander J. Marker, III , Marren Walther , Rainer Liebald , Ulrike Beer , Ulrich Peuschert , Ruediger Sprengard , Tobias Käleer
IPC分类号： G02B6/12 , G02B6/125 , G02B6/26 , G02B6/28 , G02B6/34 , G02B6/42
CPC分类号： G02B6/12019 , G02B6/12 , G02B6/12007 , G02B6/125 , G02B6/266 , G02B6/2804 , G02B6/29355 , G02B6/29395 , G02B6/4213 , G02B6/4215 , G02B6/424 , G02B6/4245 , G02B6/4246
摘要： The invention concerns a photonic device comprising a first section including a material adapted to interact with photons, a second section including a material adapted to interact with photons, with an area of said first section and an area of said second section abutting each other wherein at least a part of said first area and a part of said second area defines a low temperature bonding area to provide adaptability for a plurality of applications based on a combination of materials having specific characteristic benefits, however without introducing unwanted effects having a negative influence on the quality of optical signals.
摘要翻译：本发明涉及一种光子器件，其包括第一部分，该第一部分包括适于与光子相互作用的材料，第二部分，包括适于与光子相互作用的材料，所述第一部分的区域与所述第二部分的区域彼此邻接，所述第一区域的至少一部分和所述第二区域的一部分限定低温粘合区域，以基于具有特定特征益处的材料的组合为多个应用提供适应性，然而不引入不利影响对光信号质量。

2. 发明授权

US06698242B1 Brittle article comprising joined-together hardened glass and/or glass-ceramic parts and method of making same 失效
标题翻译：包括硬化玻璃和/或玻璃 - 陶瓷部件的连接的脆性制品及其制造方法
公开(公告)号：US06698242B1
公开(公告)日：2004-03-02
申请号：US09504230
申请日：2000-02-15
申请人： Wolfram Beier , Ulrike Beer , Roland Schnabel , Evelin Weiss , Stefan Hubert , Patrik Schober , Rainer Liebald
发明人： Wolfram Beier , Ulrike Beer , Roland Schnabel , Evelin Weiss , Stefan Hubert , Patrik Schober , Rainer Liebald
IPC分类号： C03C824
CPC分类号： C03C27/08 , Y10S228/903
摘要： In the method according to the invention cold or unheated hardened glass and/or glass-ceramic parts are bonded together with a metallic ductile joining material, preferably silver, copper, aluminum or an alloy of those metals, to form a brittle article. The parts to be joined in an initial unheated state are placed with the metallic ductile joining material between them in a high frequency alternating field with frequencies preferably from 100 to 500 kHz. Then the joining material is inductively heated locally to melt it by means of the alternating field and the parts are pressed together to form a sufficiently strong bond between the parts.
摘要翻译：在根据本发明的方法中，冷或未加热的硬化玻璃和/或玻璃 - 陶瓷部件用金属延性接合材料（优选银，铜，铝或这些金属的合金）粘合在一起，以形成脆性制品。要在初始未加热状态下接合的部件在它们之间的金属延性接合材料放置在频率优选为100至500kHz的高频交变场中。然后，接合材料被局部地感应加热，通过交变场熔化，并将这些部件压在一起以在部件之间形成足够牢固的结合。

3. 发明申请

US20120187447A1 Part having a First and a Second Substrate and Method for the Production Thereof 审中-公开
标题翻译：具有第一和第二基材的部件及其生产方法
公开(公告)号：US20120187447A1
公开(公告)日：2012-07-26
申请号：US13318343
申请日：2010-04-28
申请人： Angela Eberhardt , Ulrike Beer , Joachim Wirth-Schön , Ewald Pösl
发明人： Angela Eberhardt , Ulrike Beer , Joachim Wirth-Schön , Ewald Pösl
IPC分类号： H01L33/48
CPC分类号： H01L51/5237 , H01L51/5246 , H01L51/525
摘要： A unit is provided which comprises a first substrate (1) and a second substrate (2). At least one optoelectronic component (4) containing at least one organic material is arranged on the first substrate (1). The first substrate (1) and the second substrate (2) are arranged relative to one another such that the optoelectronic component (4) is arranged between the first substrate (1) and the second substrate (2). In addition, a bonding material (3) is arranged between the first substrate (1) and the second substrate (2), which material encloses the optoelectronic component (4) and bonds the first and second substrates (1, 2) together mechanically. The bonding material (3) contains silver oxide in a proportion of more than 0 wt. % and less than 100 wt. %, preferably between 5 wt. % and 80 wt. % inclusive, ideally between 10 wt. % and 70 wt. % inclusive. The bonding material (3) may further contain at least one filler (5), which changes, preferably reduces, the coefficient of thermal expansion of the bonding material (3). In addition, a method of producing such a unit is provided.
摘要翻译：提供了包括第一基板（1）和第二基板（2）的单元。在第一基板（1）上布置有至少一个含有至少一种有机材料的光电子部件（4）。第一基板（1）和第二基板（2）相对于彼此布置，使得光电子部件（4）布置在第一基板（1）和第二基板（2）之间。此外，在第一基板（1）和第二基板（2）之间布置有接合材料（3），该材料包围光电子部件（4）并将第一和第二基板（1,2）机械地结合在一起。接合材料（3）含有大于0重量％的氧化银。％且小于100wt。％，优选5wt。％和80wt。包括在内，理想地在10wt。％和70wt。％包括的。接合材料（3）还可以包含至少一种填料（5），其改变，优选地降低接合材料（3）的热膨胀系数。此外，提供了制造这种单元的方法。

4. 发明申请

US20120139001A1 Method For Producing An Organic Optoelectronic Component And Organic Optoelectronic Component 审中-公开
标题翻译：生产有机光电子元件和有机光电元件的方法
公开(公告)号：US20120139001A1
公开(公告)日：2012-06-07
申请号：US13141081
申请日：2009-12-10
申请人： Angela Eberhardt , Tilman Schlenker , Marc Philippens , Ulrike Beer , Joachim Wirth-Schoen , Florian Peskoller , Ewald Poesl
发明人： Angela Eberhardt , Tilman Schlenker , Marc Philippens , Ulrike Beer , Joachim Wirth-Schoen , Florian Peskoller , Ewald Poesl
IPC分类号： H01L51/52 , H01L51/56
CPC分类号： C03C27/06 , H01L51/5246 , H01L51/5256 , H01L51/5259
摘要： Production of an organic optoelectronic component comprising the following steps: A) providing a first substrate (1) having an active region (12) and a first connection region (11) surrounding said active region (12), wherein an organic, functional layer sequence (3) is formed in said active region (12), B) providing a second substrate (2) having a cover region (22) and a second connection region (21) surrounding said cover region (22), C) applying a first connection layer (4) made from a first glass solder material directly to said second substrate (2) in said second connection region (21), D) vitrifying (91) said first glass solder material of said first connection layer (4), E) applying a second connection layer (5) to said vitrified first connection layer (4) or to said first connection region (11) of said first substrate (1) and F) connecting said first substrate (1) to said second substrate (2) such that said second connection layer (5) connects said first connection region (11) to said first connection layer (4). The invention furthermore relates to an organic optoelectronic component.
摘要翻译：制备有机光电子部件包括以下步骤：A）提供具有有源区（12）的第一衬底（1）和围绕所述有源区（12）的第一连接区（11），其中有机功能层序列（3）形成在所述有源区（12）中，B）提供具有覆盖区域（22）和围绕所述覆盖区域（22）的第二连接区域（21）的第二基板（2），C）在所述第二连接区域（21）中由第一玻璃焊料直接与所述第二基板（2）制成的连接层（4），D）玻璃化所述第一连接层（4）的所述第一玻璃焊料材料，E 将第二连接层（5）施加到所述玻璃化的第一连接层（4）或所述第一基板（1）的所述第一连接区域（11）上，以及F）将所述第一基板（1）连接到所述第二基板），使得所述第二连接层（5）将所述第一连接区域（11）到所述第一连接层（4）。本发明还涉及有机光电子部件。

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