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1. 发明申请

US20120139001A1 Method For Producing An Organic Optoelectronic Component And Organic Optoelectronic Component 审中-公开
标题翻译：生产有机光电子元件和有机光电元件的方法
公开(公告)号：US20120139001A1
公开(公告)日：2012-06-07
申请号：US13141081
申请日：2009-12-10
申请人： Angela Eberhardt , Tilman Schlenker , Marc Philippens , Ulrike Beer , Joachim Wirth-Schoen , Florian Peskoller , Ewald Poesl
发明人： Angela Eberhardt , Tilman Schlenker , Marc Philippens , Ulrike Beer , Joachim Wirth-Schoen , Florian Peskoller , Ewald Poesl
IPC分类号： H01L51/52 , H01L51/56
CPC分类号： C03C27/06 , H01L51/5246 , H01L51/5256 , H01L51/5259
摘要： Production of an organic optoelectronic component comprising the following steps: A) providing a first substrate (1) having an active region (12) and a first connection region (11) surrounding said active region (12), wherein an organic, functional layer sequence (3) is formed in said active region (12), B) providing a second substrate (2) having a cover region (22) and a second connection region (21) surrounding said cover region (22), C) applying a first connection layer (4) made from a first glass solder material directly to said second substrate (2) in said second connection region (21), D) vitrifying (91) said first glass solder material of said first connection layer (4), E) applying a second connection layer (5) to said vitrified first connection layer (4) or to said first connection region (11) of said first substrate (1) and F) connecting said first substrate (1) to said second substrate (2) such that said second connection layer (5) connects said first connection region (11) to said first connection layer (4). The invention furthermore relates to an organic optoelectronic component.
摘要翻译：制备有机光电子部件包括以下步骤：A）提供具有有源区（12）的第一衬底（1）和围绕所述有源区（12）的第一连接区（11），其中有机功能层序列（3）形成在所述有源区（12）中，B）提供具有覆盖区域（22）和围绕所述覆盖区域（22）的第二连接区域（21）的第二基板（2），C）在所述第二连接区域（21）中由第一玻璃焊料直接与所述第二基板（2）制成的连接层（4），D）玻璃化所述第一连接层（4）的所述第一玻璃焊料材料，E 将第二连接层（5）施加到所述玻璃化的第一连接层（4）或所述第一基板（1）的所述第一连接区域（11）上，以及F）将所述第一基板（1）连接到所述第二基板），使得所述第二连接层（5）将所述第一连接区域（11）到所述第一连接层（4）。本发明还涉及有机光电子部件。

2. 发明申请

US20120241802A1 Method for Producing a Component with at Least One Organic Material and Component with at Least One Organic Material 有权
标题翻译：使用至少一种有机材料制造具有至少一种有机材料和成分的组分的方法
公开(公告)号：US20120241802A1
公开(公告)日：2012-09-27
申请号：US13388275
申请日：2010-06-15
申请人： Marc Philippens , Tilman Schlenker , Karsten Heuser
发明人： Marc Philippens , Tilman Schlenker , Karsten Heuser
IPC分类号： H01L33/52 , H01L31/18 , H01L31/0203
CPC分类号： H01L51/5237 , H01L51/5246 , H01L51/56
摘要： In at least one embodiment of the component (10) the latter comprises a first substrate (1) and a second substrate (2), at least one radiation-emitting or radiation-receiving element (3) being arranged on the first substrate (1), which element contains at least one organic material. The first substrate (1) and the second substrate (2) are arranged relative to one another such that the element (3) is located between the first substrate (1) and second substrate (2). The first substrate (1) and second substrate (2) are bonded together mechanically by means of a bonding agent (4) arranged in a sheet between the first substrate (1) and the second substrate (2), which bonding agent contains a glass and surrounds the element (3) with the organic material in the manner of a frame. Furthermore, the component (10) comprises a sealant (5) between the first substrate (1) and the second substrate (2), the sealant (5) surrounding and sealing the element (3) with the organic material and the bonding agent (4) in the manner of a frame.
摘要翻译：在组件（10）的至少一个实施例中，后者包括第一基板（1）和第二基板（2），至少一个辐射发射或辐射接收元件（3）布置在第一基板），该元素含有至少一种有机材料。第一基板（1）和第二基板（2）相对于彼此布置，使得元件（3）位于第一基板（1）和第二基板（2）之间。第一基板（1）和第二基板（2）通过布置在第一基板（1）和第二基板（2）之间的片材中的粘合剂（4）机械地接合在一起，该粘合剂包含玻璃并且以框架的方式用有机材料围绕元件（3）。此外，组件（10）包括在第一基板（1）和第二基板（2）之间的密封剂（5），密封剂（5）围绕元件（3）与有机材料和粘结剂（ 4）以帧的方式。

3. 发明授权

US08829496B2 Organic component and method for the production thereof 有权
标题翻译：有机成分及其制造方法
公开(公告)号：US08829496B2
公开(公告)日：2014-09-09
申请号：US13387978
申请日：2010-07-08
申请人： Marc Philippens , Tilman Schlenker
发明人： Marc Philippens , Tilman Schlenker
IPC分类号： H01L51/00
CPC分类号： H01L51/56 , H01L51/5246
摘要： A device comprising: a first substrate (1); a second substrate; at least one optoelectronic component (4) containing at least one organic material is arranged on the first substrate; the first substrate (1) and the second substrate (2) being arranged relative to one another in such a way that the optoelectronic component (4) is arranged between the first substrate (1) and the second substrate; a bonding material (3) is arranged between the first substrate (1) and the second substrate (2), said bonding material enclosing the optoelectronic component (4) in a frame type fashion and mechanically connecting the first and second substrates (1, 2) to one another; and wherein the bonding material (3) was softened by an exothermic chemical process of a reactive material (7) for mechanically connecting the substrates (1, 2).
摘要翻译：一种装置，包括：第一基板（1）; 第二基板; 包含至少一种有机材料的至少一个光电子部件（4）被布置在第一基板上; 第一基板（1）和第二基板（2）相对于彼此布置成使得光电子部件（4）布置在第一基板（1）和第二基板之间; 在第一基板（1）和第二基板（2）之间布置有接合材料（3），所述接合材料以框架形式包围光电子部件（4），并机械连接第一和第二基板（1,2））彼此; 并且其中所述接合材料（3）通过用于机械连接所述基板（1,2）的反应性材料（7）的放热化学过程软化。

4. 发明申请

US20120256170A1 Organic Component and Method for the Production Thereof 有权
标题翻译：有机成分及其生产方法
公开(公告)号：US20120256170A1
公开(公告)日：2012-10-11
申请号：US13387978
申请日：2010-07-08
申请人： Marc Philippens , Tilman Schlenker
发明人： Marc Philippens , Tilman Schlenker
IPC分类号： H01L51/52 , H01L51/48 , H01L51/44 , H01L51/56
CPC分类号： H01L51/56 , H01L51/5246
摘要： A device comprising: a first substrate (1); a second substrate; at least one optoelectronic component (4) containing at least one organic material is arranged on the first substrate; the first substrate (1) and the second substrate (2) being arranged relative to one another in such a way that the optoelectronic component (4) is arranged between the first substrate (1) and the second substrate; a bonding material (3) is arranged between the first substrate (1) and the second substrate (2), said bonding material enclosing the optoelectronic component (4) in a frame type fashion and mechanically connecting the first and second substrates (1, 2) to one another; and wherein the bonding material (3) was softened by an exothermic chemical process of a reactive material (7) for mechanically connecting the substrates (1, 2).
摘要翻译：一种装置，包括：第一基板（1）; 第二基板; 包含至少一种有机材料的至少一个光电子部件（4）被布置在第一基板上; 第一基板（1）和第二基板（2）相对于彼此布置成使得光电子部件（4）布置在第一基板（1）和第二基板之间; 在第一基板（1）和第二基板（2）之间布置有接合材料（3），所述接合材料以框架形式包围光电子部件（4），并机械连接第一和第二基板（1,2））彼此; 并且其中所述接合材料（3）通过用于机械连接所述基板（1,2）的反应性材料（7）的放热化学过程软化。

5. 发明授权

US08866181B2 Method for producing a component with at least one organic material and component with at least one organic material 有权
标题翻译：用至少一种有机材料制成组分的方法和具有至少一种有机材料的组分
公开(公告)号：US08866181B2
公开(公告)日：2014-10-21
申请号：US13388275
申请日：2010-06-15
申请人： Marc Philippens , Tilman Schlenker , Karsten Heuser
发明人： Marc Philippens , Tilman Schlenker , Karsten Heuser
IPC分类号： H01L33/00 , H01L23/02 , H01L51/52 , H01L51/56
CPC分类号： H01L51/5237 , H01L51/5246 , H01L51/56
摘要： In at least one embodiment of the component (10) the latter comprises a first substrate (1) and a second substrate (2), at least one radiation-emitting or radiation-receiving element (3) being arranged on the first substrate (1), which element contains at least one organic material. The first substrate (1) and the second substrate (2) are arranged relative to one another such that the element (3) is located between the first substrate (1) and second substrate (2). The first substrate (1) and second substrate (2) are bonded together mechanically by means of a bonding agent (4) arranged in a sheet between the first substrate (1) and the second substrate (2), which bonding agent contains a glass and surrounds the element (3) with the organic material in the manner of a frame. Furthermore, the component (10) comprises a sealant (5) between the first substrate (1) and the second substrate (2), the sealant (5) surrounding and sealing the element (3) with the organic material and the bonding agent (4) in the manner of a frame.
摘要翻译：在组件（10）的至少一个实施例中，后者包括第一基板（1）和第二基板（2），至少一个辐射发射或辐射接收元件（3）布置在第一基板），该元素含有至少一种有机材料。第一基板（1）和第二基板（2）相对于彼此布置，使得元件（3）位于第一基板（1）和第二基板（2）之间。第一基板（1）和第二基板（2）通过布置在第一基板（1）和第二基板（2）之间的片材中的粘合剂（4）机械地接合在一起，该粘合剂包含玻璃并且以框架的方式用有机材料围绕元件（3）。此外，组件（10）包括在第一基板（1）和第二基板（2）之间的密封剂（5），密封剂（5）围绕元件（3）与有机材料和粘结剂（ 4）以帧的方式。

6. 发明申请

US20120241729A1 Optoelectronic Organic Component and Method for the Production Thereof 失效
标题翻译：光电有机成分及其生产方法
公开(公告)号：US20120241729A1
公开(公告)日：2012-09-27
申请号：US13499608
申请日：2010-09-29
申请人： Marc Philippens , Ralph Paetzold , Wiebke Sarfert , David Hartmann , Arvid Hunze , Ralf Krause
发明人： Marc Philippens , Ralph Paetzold , Wiebke Sarfert , David Hartmann , Arvid Hunze , Ralf Krause
IPC分类号： H01L51/54 , H01L51/40
CPC分类号： H01L51/5206 , H01L51/0035 , H01L51/0036 , H01L51/0037 , H01L51/0042 , H01L51/0059 , H01L51/50 , H01L51/5004 , H01L51/5088 , H01L51/5221 , H01L51/5228 , H01L2251/552
摘要： Optoelectronic organic component, comprising: a first electrode, a first planarization layer which is disposed on the first electrode, a first injection layer which is disposed on the planarization layer, an organic functional layer which is disposed on the injection layer, a second electrode which is disposed on the organic functional layer, wherein in the case that the first electrode is an anode, the following applies for the energy levels: EF-EHOMO,Inj.≦EF-EHOMO,Plan. and EF-EHOMO,Inj.
摘要翻译：光电子有机成分，包括：第一电极，设置在第一电极上的第一平坦化层，设置在平坦化层上的第一注入层，设置在注入层上的有机功能层，第二电极，设置在有机功能层上，其中在第一电极是阳极的情况下，以下适用于能级：EF-EHOMO，Inj。＆nlE; EF-EHOMO，Plan。和EF-EHOMO，Inj。

7. 发明申请

US20110070456A1 Method for Producing an Organic Electronic Component, and Organic Electronic Component 审中-公开
标题翻译：有机电子元件的制造方法和有机电子元件
公开(公告)号：US20110070456A1
公开(公告)日：2011-03-24
申请号：US12922833
申请日：2009-06-17
申请人： Marc Philippens , Richard Scheicher , Andreas Lovich , Ansgar Fischer , Martin Muller , Karsten Heuser , Ralph Paetzold
发明人： Marc Philippens , Richard Scheicher , Andreas Lovich , Ansgar Fischer , Martin Muller , Karsten Heuser , Ralph Paetzold
IPC分类号： B32B37/14 , B32B27/32
CPC分类号： H01L51/0097 , H01L51/524 , H01L51/5268 , H01L2251/5338 , H01L2251/5361 , H01L2251/566 , Y02E10/549 , Y02P70/521 , Y10T428/31938
摘要： A method for producing an organic electronic component comprises, in particular, the following steps: A) producing at least one functional layer stack (10) with the following substeps: A1) providing a flexible first substrate (1), A2) applying at least one organic layer (2) in large-area fashion on the first substrate (1) by means of a coil coating plant (90), and A3) singulating the first substrate (1) with the at least one organic layer (2) into a plurality of functional layer stacks (10); B) providing a second substrate (5), which has a lower flexibility and a higher impermeability with respect to moisture and oxygen than the first substrate (1); and C) applying the at least one of the plurality of the functional layer stacks (10) with a surface (11) of the first substrate (1) remote from the organic layer (2) on the second substrate (5).
摘要翻译：一种制造有机电子部件的方法特别包括以下步骤：A）产生具有以下子步骤的至少一个功能层堆叠（10）：A1）提供柔性第一基板（1），A2）至少施加一个有机层（2）以大面积方式通过线圈涂覆设备（90）在第一基底（1）上，以及A3）将具有至少一个有机层（2）的第一基底（1）分成多个功能层堆叠（10）; B）提供第二衬底（5），其具有比第一衬底（1）更低的柔性和相对于水分和氧气的更高的不渗透性; 以及C）将所述多个所述功能层堆叠（10）中的所述至少一个与所述第一基板（1）的远离所述有机层（2）的表面（11）施加在所述第二基板（5）上。

8. 发明授权

US07646799B2 Edge emitting semiconductor laser comprising a plurality of monolithically integrated laser diodes 有权
标题翻译：包括多个单片集成激光二极管的边缘发射半导体激光器
公开(公告)号：US07646799B2
公开(公告)日：2010-01-12
申请号：US11904060
申请日：2007-09-25
申请人： Peter Brick , Johann Luft , Martin Müller , Marc Philippens
发明人： Peter Brick , Johann Luft , Martin Müller , Marc Philippens
IPC分类号： H01S5/00
CPC分类号： H01S5/4043 , B82Y20/00 , H01S5/02461 , H01S5/0421 , H01S5/2004 , H01S5/3095 , H01S5/3213 , H01S5/34 , H01S5/4018 , H01S5/4087
摘要： An edge emitting semiconductor laser containing a plurality of monolithically integrated laser diodes (1, 2, 3). Each laser diode (1, 2, 3) contains an active zone (11, 12, 13), with the active zones (11, 12, 13) being in each case arranged between waveguide layers (6), the waveguide layers (6) in each case adjoining a cladding layer (7, 8) at a side remote from the active zone (11, 12, 13). The cladding layers (7, 8) comprise inner cladding layers (7), which are arranged above a bottommost active zone (11) and below a topmost active zone (13), and outer cladding layers (8) which are arranged below the bottommost active zone (11) or above the topmost active zone (13). The inner cladding layers (7) have a smaller thickness than the outer cladding layers (8).
摘要翻译：一种边缘发射半导体激光器，包含多个单片集成的激光二极管（1,2,3）。每个激光二极管（1,2,3）包含有源区（11,12,13），其中有源区（11,12,13）各自布置在波导层（6）之间，波导层（6））在与活动区域（11,12,13）相邻的一侧邻接包层（7,8）。包覆层（7,8）包括布置在最下面的活性区域（11）的上方并位于最上面的活性区域（13）的下方的内部包层（7），以及设置在最下面的外部包层活动区域（11）或最上面的活动区域（13）之上。内包层（7）具有比外包层（8）更小的厚度。

9. 发明授权

US07620087B2 Radiation-emitting semiconductor component 有权
标题翻译：辐射发射半导体元件
公开(公告)号：US07620087B2
公开(公告)日：2009-11-17
申请号：US11047833
申请日：2005-01-31
申请人： Marc Philippens , Tony Albrecht
发明人： Marc Philippens , Tony Albrecht
IPC分类号： H01S5/00
CPC分类号： H01L27/15 , H01L33/08 , H01S5/026 , H01S5/0425 , H01S5/18311 , H01S2301/18
摘要： A radiation-emitting semiconductor component comprising a semiconductor body (3) with a first active zone (1) and a second active zone (2) arranged above the first active zone, the first active zone being provided for generating a radiation having a first wavelength λ1 (11) and the second active zone being provided for generating a radiation having a second wavelength λ2 (22), the radiation having the first wavelength λ1 being coherent and the radiation having the second wavelength λ2 being incoherent.
摘要翻译：一种辐射发射半导体部件，包括具有第一有源区（1）的半导体本体（3）和布置在所述第一有源区上方的第二有源区（2），所述第一有源区被设置用于产生具有第一波长 λ1（11）并且第二有源区被提供用于产生具有第二波长λ2（22）的辐射，所述具有第一波长λ1的辐射是相干的，并且具有第二波长λ2的辐射是不相干的。

10. 发明申请

US20120178190A1 Arrangement for Holding a Substrate in a Material Deposition Apparatus 有权
标题翻译：用于在材料沉积装置中保持基板的布置
公开(公告)号：US20120178190A1
公开(公告)日：2012-07-12
申请号：US13262776
申请日：2010-03-29
申请人： Johannes Krijne , Erwin Eiling , Karl-Heinz Hohaus , Wolfgang Goergen , Andreas Lovich , Marc Philippens , Richard Scheicher , Ansgar Fischer , Martin Mueller
发明人： Johannes Krijne , Erwin Eiling , Karl-Heinz Hohaus , Wolfgang Goergen , Andreas Lovich , Marc Philippens , Richard Scheicher , Ansgar Fischer , Martin Mueller
IPC分类号： H01L51/56 , B05D3/12 , B05C13/02
CPC分类号： C23C14/042 , C23C14/50
摘要： An arrangement (1) for holding a substrate (10) in a material deposition apparatus, which substrate (10) has a deposition side (10a) upon which material (M) is to be deposited, and which arrangement (1) comprises: a shadow mask (20) comprising a number of deposition openings (Di); a support structure (30) comprising a number of surround openings (Si); and a support structure holding means (6) for holding the support mask (30) and/or a substrate holding means (5) for holding the substrate (10), such that the support structure (30) is on the same side as the deposition side (10a) of the substrate (10), and the shadow mask (20) is positioned between the substrate (10) and the support structure (30) such that at least one deposition opening (Di) of the shadow mask (10) lies within a corresponding surround opening (Si) of the support structure (30).
摘要翻译：一种用于将材料（10）保持在材料沉积装置中的装置（1），所述衬底（10）具有要沉积材料（M）的沉积侧（10a），并且所述装置（1）包括：包括多个沉积开口（Di）的荫罩（20）; 包括多个环绕开口（Si）的支撑结构（30）; 以及用于保持支撑掩模（30）的支撑结构保持装置（6）和/或用于保持基板（10）的基板保持装置（5），使得支撑结构（30）位于与所述基板（10）的沉积侧（10a）和所述荫罩（20）位于所述基板（10）和所述支撑结构（30）之间，使得所述荫罩（10）的至少一个沉积开口（Di））位于支撑结构（30）的相应环绕开口（Si）内。

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