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1. 发明申请

US20130056782A1 Optoelectronic Semiconductor Part Containing Alkali-Free and Halogen-Free Metal Phosphate 有权
标题翻译：含有无碱和无卤素金属磷酸盐的光电子半导体零件
公开(公告)号：US20130056782A1
公开(公告)日：2013-03-07
申请号：US13696744
申请日：2011-04-20
申请人： Angela Eberhardt , Christina Wille , Joachim Wirth-Schön
发明人： Angela Eberhardt , Christina Wille , Joachim Wirth-Schön
IPC分类号： H01L33/60
CPC分类号： C03C3/17 , C03C27/00 , G02B19/0028 , G02B19/0061 , G02B19/0095 , G02B27/0916 , H01L33/48 , H01L33/501 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optoelectronic semiconductor part comprising a light source, a housing and electrical connections, wherein the optoelectronic semiconductor part comprises a component which contains metal phosphate, and wherein the metal phosphate is substantially alkali-free and halogen-free.
摘要翻译：一种包括光源，壳体和电连接的光电子半导体部件，其中所述光电子半导体部件包括含有金属磷酸盐的组分，并且其中所述金属磷酸盐基本上不含碱性且不含卤素。

2. 发明申请

US20130126938A1 Optoelectronic Semiconductor Element and Associated Method of Production by Direct Welding of Glass Housing Components by Means of Ultra Short Pulsed Laser without Glass Solder 审中-公开
标题翻译：光电半导体元件及相关的玻璃外壳组件直接焊接生产方法采用超短脉冲激光器，无玻璃焊
公开(公告)号：US20130126938A1
公开(公告)日：2013-05-23
申请号：US13812809
申请日：2011-07-15
申请人： Angela Eberhardt , Joachim Wirth-Schön
发明人： Angela Eberhardt , Joachim Wirth-Schön
IPC分类号： H01L33/48
CPC分类号： H01L33/483 , B23K26/0624 , B23K26/206 , B23K26/57 , C03B23/245 , H01L33/56 , H01L51/5246
摘要： An optoelectronic semiconductor element having a light source, a housing and electrical terminals, wherein the optoelectronic semiconductor element comprises components, which are produced from glass, and wherein at least two components touch at boundary surfaces adjusted to one another and are welded to one another directly there.
摘要翻译：一种具有光源，壳体和电气端子的光电半导体元件，其中所述光电子半导体元件包括由玻璃制成的部件，并且其中至少两个部件在相互调整并彼此直接焊接的边界表面上接触那里。

3. 发明授权

US08772821B2 Optoelectronic semiconductor part containing alkali-free and halogen-free metal phosphate 有权
标题翻译：含有无碱和无卤金属磷酸盐的光电半导体部件
公开(公告)号：US08772821B2
公开(公告)日：2014-07-08
申请号：US13696744
申请日：2011-04-20
申请人： Angela Eberhardt , Christina Wille , Joachim Wirth-Schön
发明人： Angela Eberhardt , Christina Wille , Joachim Wirth-Schön
IPC分类号： H01L33/00 , C03C3/17 , G02B19/00 , H01L33/48 , C03C27/00 , H01L33/50 , H01L33/58 , G02B27/09
CPC分类号： C03C3/17 , C03C27/00 , G02B19/0028 , G02B19/0061 , G02B19/0095 , G02B27/0916 , H01L33/48 , H01L33/501 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An optoelectronic semiconductor part comprising a light source, a housing and electrical connections, wherein the optoelectronic semiconductor part comprises a component which contains metal phosphate, and wherein the metal phosphate is substantially alkali-free and halogen-free.
摘要翻译：一种包括光源，壳体和电连接的光电子半导体部件，其中所述光电子半导体部件包括含有金属磷酸盐的组分，并且其中所述金属磷酸盐基本上不含碱性且不含卤素。

4. 发明申请

US20120187447A1 Part having a First and a Second Substrate and Method for the Production Thereof 审中-公开
标题翻译：具有第一和第二基材的部件及其生产方法
公开(公告)号：US20120187447A1
公开(公告)日：2012-07-26
申请号：US13318343
申请日：2010-04-28
申请人： Angela Eberhardt , Ulrike Beer , Joachim Wirth-Schön , Ewald Pösl
发明人： Angela Eberhardt , Ulrike Beer , Joachim Wirth-Schön , Ewald Pösl
IPC分类号： H01L33/48
CPC分类号： H01L51/5237 , H01L51/5246 , H01L51/525
摘要： A unit is provided which comprises a first substrate (1) and a second substrate (2). At least one optoelectronic component (4) containing at least one organic material is arranged on the first substrate (1). The first substrate (1) and the second substrate (2) are arranged relative to one another such that the optoelectronic component (4) is arranged between the first substrate (1) and the second substrate (2). In addition, a bonding material (3) is arranged between the first substrate (1) and the second substrate (2), which material encloses the optoelectronic component (4) and bonds the first and second substrates (1, 2) together mechanically. The bonding material (3) contains silver oxide in a proportion of more than 0 wt. % and less than 100 wt. %, preferably between 5 wt. % and 80 wt. % inclusive, ideally between 10 wt. % and 70 wt. % inclusive. The bonding material (3) may further contain at least one filler (5), which changes, preferably reduces, the coefficient of thermal expansion of the bonding material (3). In addition, a method of producing such a unit is provided.
摘要翻译：提供了包括第一基板（1）和第二基板（2）的单元。在第一基板（1）上布置有至少一个含有至少一种有机材料的光电子部件（4）。第一基板（1）和第二基板（2）相对于彼此布置，使得光电子部件（4）布置在第一基板（1）和第二基板（2）之间。此外，在第一基板（1）和第二基板（2）之间布置有接合材料（3），该材料包围光电子部件（4）并将第一和第二基板（1,2）机械地结合在一起。接合材料（3）含有大于0重量％的氧化银。％且小于100wt。％，优选5wt。％和80wt。包括在内，理想地在10wt。％和70wt。％包括的。接合材料（3）还可以包含至少一种填料（5），其改变，优选地降低接合材料（3）的热膨胀系数。此外，提供了制造这种单元的方法。

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