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1. 发明授权

US06476388B1 Scanning electron microscope having magnification switching control 有权
标题翻译：具有倍率切换控制的扫描电子显微镜
公开(公告)号：US06476388B1
公开(公告)日：2002-11-05
申请号：US09421093
申请日：1999-10-19
申请人： Ryo Nakagaki , Yuji Takagi , Atsushi Shimoda , Kenji Obara , Yasuhiko Ozawa , Hideka Bamba , Seiji Isogai , Kenji Watanabe , Chie Shishido , Toshiei Kurosaki
发明人： Ryo Nakagaki , Yuji Takagi , Atsushi Shimoda , Kenji Obara , Yasuhiko Ozawa , Hideka Bamba , Seiji Isogai , Kenji Watanabe , Chie Shishido , Toshiei Kurosaki
IPC分类号： G21K700
CPC分类号： G01N23/225 , H01J37/222 , H01J37/265 , H01J2237/24495 , H01J2237/2485 , H01J2237/2817
摘要： The invention is a scanning electron microscope including a switching control unit for controlling to switch at least scanning unit to switch a digital image signal of a low magnification based on a wide image taking field of view to and from a digital image signal of a high magnification based on a narrow image taking field of view from an A/D conversion unit and a beam spot diameter control unit for controlling to switch a spot diameter of electron beam on a surface of an object substrate in controlling to switch the signals by the switching control unit and a defect portion analyzing method using the scanning electron microscope.
摘要翻译：本发明是一种扫描电子显微镜，其特征在于，具备切换控制部，该切换控制部基于与高倍率的数字图像信号相对应的宽拍摄视场，至少切换扫描部，切换低倍率的数字图像信号基于来自A / D转换单元的窄图像拍摄视场和光束光斑直径控制单元，用于控制通过切换控制切换信号来控制在对象基板的表面上切换电子束的光斑直径单元和使用扫描电子显微镜的缺陷部分析方法。

2. 发明授权

US07356177B2 Defect image classifying method and apparatus and a semiconductor device manufacturing process based on the method and apparatus 有权
标题翻译：基于该方法和装置的缺陷图像分类方法和装置以及半导体器件制造方法
公开(公告)号：US07356177B2
公开(公告)日：2008-04-08
申请号：US11506310
申请日：2006-08-17
申请人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiko Ozawa , Toshiei Kurosaki , Seiji Isogai
发明人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiko Ozawa , Toshiei Kurosaki , Seiji Isogai
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： According to the present invention, techniques including a method and apparatus for classifying and displaying images are provided. In an embodiment of the present invention a defect image classification method using inspected objects is provided. The method includes defect images obtained from at least one inspected object. Next a set of defect images is classified into a specified category, which has a feature. The defect images are arranged for display according to the feature and then displayed. The arranging of the defect images may also be based on an evaluation value for each defect image. Another embodiment provides a defect image classification method using inspected objects. Defect images are obtained from at least one inspected object. Next the defect images are classified into a plurality of categories and at least two information items for example, a defect distribution diagram showing locations of defects in the inspected object, information associated with a category of the plurality of categories, and a defect size distribution, are displayed.
摘要翻译：根据本发明，提供包括用于分类和显示图像的方法和装置的技术。在本发明的一个实施例中，提供了使用检查对象的缺陷图像分类方法。该方法包括从至少一个检查对象获得的缺陷图像。接下来，一组缺陷图像被分类为具有特征的指定类别。故障图像根据特征进行显示，然后显示。缺陷图像的布置也可以基于每个缺陷图像的评估值。另一实施例提供使用检查对象的缺陷图像分类方法。从至少一个检查对象获得缺陷图像。接下来，将缺陷图像分为多个类别和至少两个信息项，例如，示出被检查对象中的缺陷的位置的缺陷分布图，与多个类别的类别相关联的信息以及缺陷尺寸分布，被显示。

3. 发明授权

US07113628B1 Defect image classifying method and apparatus and a semiconductor device manufacturing process based on the method and apparatus 有权
公开(公告)号：US07113628B1
公开(公告)日：2006-09-26
申请号：US09716077
申请日：2000-11-17
申请人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiro Ozawa , Toshiei Kurosaki , Seiji Isogai
发明人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiro Ozawa , Toshiei Kurosaki , Seiji Isogai
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： According to the present invention, techniques including a method and apparatus for classifying and displaying images are provided. In an embodiment of the present invention a defect image classification method using inspected objects is provided. The method includes defect images obtained from at least one inspected object. Next a set of defect images is classified into a specified category, which has a feature. The defect images are arranged for display according to the feature and then displayed. The arranging of the defect images may also be based on an evaluation value for each defect image. Another embodiment provides a defect image classification method using inspected objects. Defect images are obtained from at least one inspected object. Next the defect images are classified into a plurality of categories and at least two information items for example, a defect distribution diagram showing locations of defects in the inspected object, information associated with a category of the plurality of categories, and a defect size distribution, are displayed.

4. 发明申请

US20060274933A1 Defect image classifying method and apparatus and a semiconductor device manufacturing process based on the method and apparatus 有权
标题翻译：基于该方法和装置的缺陷图像分类方法和装置以及半导体器件制造方法
公开(公告)号：US20060274933A1
公开(公告)日：2006-12-07
申请号：US11506310
申请日：2006-08-17
申请人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiro Ozawa , Toshiei Kurosaki , Seiji Isogai
发明人： Kenji Obara , Yuji Takagi , Ryo Nakagaki , Yasuhiro Ozawa , Toshiei Kurosaki , Seiji Isogai
IPC分类号： G06K9/00 , G06K9/62
CPC分类号： G06T7/001 , G06T2207/30148
摘要： According to the present invention, techniques including a method and apparatus for classifying and displaying images are provided. In an embodiment of the present invention a defect image classification method using inspected objects is provided. The method includes defect images obtained from at least one inspected object. Next a set of defect images is classified into a specified category, which has a feature. The defect images are arranged for display according to the feature and then displayed. The arranging of the defect images may also be based on an evaluation value for each defect image. Another embodiment provides a defect image classification method using inspected objects. Defect images are obtained from at least one inspected object. Next the defect images are classified into a plurality of categories and at least two information items for example, a defect distribution diagram showing locations of defects in the inspected object, information associated with a category of the plurality of categories, and a defect size distribution, are displayed.
摘要翻译：根据本发明，提供了包括用于分类和显示图像的方法和装置的技术。在本发明的一个实施例中，提供了使用检查对象的缺陷图像分类方法。该方法包括从至少一个检查对象获得的缺陷图像。接下来，一组缺陷图像被分类为具有特征的指定类别。故障图像根据特征进行显示，然后显示。缺陷图像的布置也可以基于每个缺陷图像的评估值。另一实施例提供使用检查对象的缺陷图像分类方法。从至少一个检查对象获得缺陷图像。接下来，将缺陷图像分为多个类别和至少两个信息项，例如，示出被检查对象中的缺陷的位置的缺陷分布图，与多个类别的类别相关联的信息以及缺陷尺寸分布，被显示。

5. 发明授权

US06553323B1 Method and its apparatus for inspecting a specimen 有权
标题翻译：检测样本的方法及其装置
公开(公告)号：US06553323B1
公开(公告)日：2003-04-22
申请号：US09661182
申请日：2000-09-13
申请人： Kenji Obara , Yuji Takagi , Toshifumi Honda , Ryo Nakagaki , Toshiei Kurosaki , Yasuhiko Ozawa
发明人： Kenji Obara , Yuji Takagi , Toshifumi Honda , Ryo Nakagaki , Toshiei Kurosaki , Yasuhiko Ozawa
IPC分类号： G01B528
CPC分类号： H01L22/20 , G01N21/88 , G01N2021/8861
摘要： The present invention improves inspection efficiency in detailed inspections of defects performed based on inspection information from a defect inspection. Particles and defects are detected by a defect inspection device 1. If the cause of the particles and defects are to be determined by performing a detailed inspection with a details inspection device 3 using an SEM or the like, attributes are determined on the particles and defects detected by the defects inspection device 1 before the detailed inspection is performed. The attributes are determined with an attribute inspection device using an optical microscope or the like. Based on these attributes, the defects and particles are separated into those that require detailed inspection and those that do not require detailed inspection or that cannot be inspected in detail. A details inspection device 3 is used to inspect the particles and defects requiring detailed inspection.
摘要翻译：本发明基于来自缺陷检查的检查信息进行的缺陷的详细检查，提高了检查效率。通过缺陷检查装置1检测颗粒和缺陷。如果通过使用SEM等的细节检查装置3进行详细检查来确定颗粒和缺陷的原因，则根据颗粒和缺陷确定属性在执行详细检查之前由缺陷检查装置1检测到。属性由使用光学显微镜等的属性检查装置确定。基于这些属性，缺陷和颗粒被分成需要详细检查的那些和不需要详细检查或者不能被详细检查的那些。细节检查装置3用于检查需要详细检查的颗粒和缺陷。

6. 发明授权

US08428336B2 Inspecting method, inspecting system, and method for manufacturing electronic devices 有权
标题翻译：检查方法，检查系统和电子设备制造方法
公开(公告)号：US08428336B2
公开(公告)日：2013-04-23
申请号：US11431709
申请日：2006-05-11
申请人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
发明人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
IPC分类号： G06K9/00
CPC分类号： G06F3/0486 , G06F2203/04803 , G06T7/0004 , G06T2200/24 , G06T2207/30148
摘要： A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.
摘要翻译：一种用于对缺陷进行分类的方法，包括：通过对样品上的缺陷进行成像而获得的缺陷图像的特征量化计算; 通过使用关于计算的特征量的信息将缺陷图像分类成分类的类别; 在分类的类别的显示屏幕上的区域中显示分类的缺陷图像; 将分类类别的信息添加到所显示的缺陷图像; 将所述分类类别中的信息添加到所述其他类别中的所显示的缺陷图像，并且将所传送的缺陷图像显示在所述显示屏幕上定义为所述其他类别之一的区域中; 并更改关于该类别的信息。

7. 发明授权

US07068834B1 Inspecting method, inspecting system, and method for manufacturing electronic devices 有权
标题翻译：检查方法，检查系统和电子设备制造方法
公开(公告)号：US07068834B1
公开(公告)日：2006-06-27
申请号：US09452149
申请日：1999-12-01
申请人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
发明人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
IPC分类号： G06K9/00
CPC分类号： G06F3/0486 , G06F2203/04803 , G06T7/0004 , G06T2200/24 , G06T2207/30148
摘要： The present invention has an analyzing unit including an image detection device for producing a plurality of images of a workpiece, a storage for storing detected images produced by the image detection device, and a display having a screen with a first area for displaying a plurality of detected images stored in the storage and a plurality of second areas for classifying the detected images according to features of the detected images, whereby the plurality of detected images are moved on the screen from the first area to selected second areas to classify the plurality of detected images in the second areas.
摘要翻译：本发明具有一种分析单元，包括用于产生工件的多个图像的图像检测装置，用于存储由图像检测装置产生的检测图像的存储器以及具有用于显示多个图像的第一区域的屏幕的显示器检测存储在存储器中的图像和多个第二区域，用于根据检测到的图像的特征对检测到的图像进行分类，由此多个检测图像在屏幕上从第一区域移动到选定的第二区域，以对多个检测到的图像进行分类图像在第二个区域。

8. 发明申请

US20060274932A1 Inspecting method, inspecting system, and method for manufacturing electronic devices 有权
公开(公告)号：US20060274932A1
公开(公告)日：2006-12-07
申请号：US11431709
申请日：2006-05-11
申请人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
发明人： Yoko Ikeda , Junko Konishi , Hisafumi Iwata , Yuji Takagi , Kenji Obara , Ryo Nakagaki , Seiji Isogai , Yasuhiko Ozawa
IPC分类号： G06K9/00 , G06K9/62 , G06K9/46
CPC分类号： G06F3/0486 , G06F2203/04803 , G06T7/0004 , G06T2200/24 , G06T2207/30148
摘要： A method for classifying defects, including: calculating feature quantifies of defect image which is obtained by imaging a defect on a sample; classifying the defect image into a classified category by using information on the calculated feature quantities; displaying the classified defect image in a region on a display screen which is defined to the classified category; adding information on the classified category to the displayed defect image; transferring the displayed defect image which is added the information on the classified category to one of the other categories and displaying the transferred defect image in a region on the display screen which is defined to the one of the other categories; and changing information on the category.

9. 发明授权

US07216311B2 System and method for evaluating a semiconductor device pattern, method for controlling process of forming a semiconductor device pattern and method for monitoring a semiconductor device manufacturing process 有权
标题翻译：用于评估半导体器件图案的系统和方法，用于控制形成半导体器件图案的工艺的方法和用于监测半导体器件制造工艺的方法
公开(公告)号：US07216311B2
公开(公告)日：2007-05-08
申请号：US10648231
申请日：2003-08-27
申请人： Maki Tanaka , Chie Shishido , Ryo Nakagaki , Yuji Takagi
发明人： Maki Tanaka , Chie Shishido , Ryo Nakagaki , Yuji Takagi
IPC分类号： G06F17/50 , G06F9/45 , G01N23/00
CPC分类号： H01L22/20 , G11C29/006 , G11C2029/0403 , G11C2029/5002 , H01L2924/0002 , H01L2924/00
摘要： In order to realize a means for acquiring three-dimensional shape information about patterns by nondestruction and evaluate a relationship between the three-dimensional shape information about these patterns and device properties, a semiconductor device pattern evaluating system is provided with a feature index calculating means for quantifying a property of a three-dimensional shape of a pattern to be evaluated, as feature index, a database that records therein a relationship between the feature index of each three-dimensional pattern shape and a device property of a circuit containing patterns each having the feature index, and a device property estimating means for estimating a property of a device circuit formed by the pattern to be evaluated, on the basis of the feature index of the three-dimensional pattern shape, which have been quantified by the feature index calculating means, and the information recorded in the database.
摘要翻译：为了实现用于通过非破坏获取关于图案的三维形状信息的手段，并且评估关于这些图案的三维形状信息和装置特性之间的关系，半导体装置图案评估系统设置有特征指标计算装置，量化要评估的图案的三维形状的属性作为特征索引，记录其中每个三维图案形状的特征索引与包含各自具有所述三维图案形状的图案的电路的装置特性之间的关系的数据库特征索引，以及装置属性估计装置，用于根据由特征指标计算装置量化的三维图案形状的特征指标，估计由待评估图案形成的装置电路的特性，以及记录在数据库中的信息。

10. 发明申请

US20050016682A1 Method of setting etching parameters and system therefor 审中-公开
标题翻译：设置蚀刻参数及其系统的方法
公开(公告)号：US20050016682A1
公开(公告)日：2005-01-27
申请号：US10893275
申请日：2004-07-19
申请人： Wataru Nagatomo , Ryo Nakagaki , Maki Tanaka , Chie Shishido , Yuji Takagi
发明人： Wataru Nagatomo , Ryo Nakagaki , Maki Tanaka , Chie Shishido , Yuji Takagi
IPC分类号： H01L21/3065 , H01L21/311 , H01L21/3213 , H01L21/66 , C23F1/00
CPC分类号： H01L22/20 , H01L21/31116 , H01L21/32136 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a system that automatically calculates optimal etching parameters in order to perform desired etching in an etching process in semiconductor manufacturing. A model representing etching parameters and an etching performance quantitative value at the time when etching is performed with the etching parameters is prepared in advance, and when desired etching is performed, optimal etching parameters are calculated from the model.
摘要翻译：本发明涉及一种在半导体制造中在蚀刻工艺中自动计算最佳蚀刻参数以执行所需蚀刻的系统。预先准备表示蚀刻参数的模型和使用蚀刻参数进行蚀刻时的蚀刻性能定量值，并且当需要蚀刻时，根据该模型计算最佳蚀刻参数。

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