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1. 发明授权

US09064628B2 Inductor with stacked conductors 有权
标题翻译：具有堆叠导体的电感器
公开(公告)号：US09064628B2
公开(公告)日：2015-06-23
申请号：US13477978
申请日：2012-05-22
申请人： Robert E. Fontana, Jr. , Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
发明人： Robert E. Fontana, Jr. , Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
IPC分类号： H01F5/00 , H01F27/28 , H01F17/00 , H01L49/02
CPC分类号： H01F27/2804 , H01F5/00 , H01F17/0013 , H01F2017/0066 , H01F2017/0086 , H01F2027/2809 , H01L28/10
摘要： A thin film coupled inductor, a thin film spiral inductor, and a system that includes an electronic device and a power supply or power converter incorporating one or more such inductors. A thin film coupled inductor includes a wafer substrate; a bottom yoke comprising a magnetic material above the wafer substrate; a first insulating layer above the bottom yoke; a first conductor above the bottom yoke and separated therefrom by the first insulating layer; a second insulating layer above the first conductor; a second conductor above the second insulating layer; a third insulating layer above the second conductor; and a non-planar top yoke above the third insulating layer, the top yoke comprising a magnetic material.
摘要翻译：薄膜耦合电感器，薄膜螺旋电感器以及包括电子器件和并入一个或多个此类电感器的电源或功率转换器的系统。薄膜耦合电感器包括晶片衬底; 底部轭，其包括晶片衬底上方的磁性材料; 在底部轭上方的第一绝缘层; 第一导体，位于底部磁轭之上并由第一绝缘层分离; 在所述第一导体上方的第二绝缘层; 在第二绝缘层上方的第二导体; 在第二导体上方的第三绝缘层; 以及在第三绝缘层上方的非平面顶部磁轭，顶部磁轭包括磁性材料。

2. 发明授权

US08717136B2 Inductor with laminated yoke 有权
标题翻译：带有叠片轭的电感器
公开(公告)号：US08717136B2
公开(公告)日：2014-05-06
申请号：US13347571
申请日：2012-01-10
申请人： Robert E. Fontana, Jr. , William J. Gallagher , Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
发明人： Robert E. Fontana, Jr. , William J. Gallagher , Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
IPC分类号： H01F27/30 , H01F5/00 , H01F27/28 , H01F27/24
CPC分类号： H01F41/042 , H01F27/2804 , H01F41/046 , H01F2017/0066 , H01F2027/348
摘要： A thin film inductor having yokes, one or more of which is laminated, and one or more conductors passing between the yokes. The laminated yoke or yokes help reduce eddy currents and/or hysteresis losses.
摘要翻译：一种薄膜电感器，其具有轭，其中一个或多个层叠，以及一个或多个通过轭之间的导体。叠片磁轭或磁轭有助于减少涡流和/或磁滞损耗。

3. 发明申请

US20130314192A1 INDUCTOR WITH STACKED CONDUCTORS 有权
标题翻译：带导体的电感器
公开(公告)号：US20130314192A1
公开(公告)日：2013-11-28
申请号：US13477978
申请日：2012-05-22
申请人： Robert E. Fontana, JR. , Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
发明人： Robert E. Fontana, JR. , Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
IPC分类号： H01F27/28
CPC分类号： H01F27/2804 , H01F5/00 , H01F17/0013 , H01F2017/0066 , H01F2017/0086 , H01F2027/2809 , H01L28/10
摘要： A thin film coupled inductor, a thin film spiral inductor, and a system that includes an electronic device and a power supply or power converter incorporating one or more such inductors. A thin film coupled inductor includes a wafer substrate; a bottom yoke comprising a magnetic material above the wafer substrate; a first insulating layer above the bottom yoke; a first conductor above the bottom yoke and separated therefrom by the first insulating layer; a second insulating layer above the first conductor; a second conductor above the second insulating layer; a third insulating layer above the second conductor; and a non-planar top yoke above the third insulating layer, the top yoke comprising a magnetic material.
摘要翻译：薄膜耦合电感器，薄膜螺旋电感器以及包括电子器件和并入一个或多个此类电感器的电源或功率转换器的系统。薄膜耦合电感器包括晶片衬底; 底部轭，其包括晶片衬底上方的磁性材料; 在底部轭上方的第一绝缘层; 第一导体，位于底部磁轭之上并由第一绝缘层分离; 在所述第一导体上方的第二绝缘层; 在第二绝缘层上方的第二导体; 在第二导体上方的第三绝缘层; 以及在第三绝缘层上方的非平面顶部磁轭，顶部磁轭包括磁性材料。

4. 发明申请

US20130176095A1 INDUCTOR WITH LAMINATED YOKE 有权
标题翻译：带有层压板的电感器
公开(公告)号：US20130176095A1
公开(公告)日：2013-07-11
申请号：US13347571
申请日：2012-01-10
申请人： Robert E. Fontana, JR. , William J. Gallagher , Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
发明人： Robert E. Fontana, JR. , William J. Gallagher , Philipp Herget , Eugene J. O'Sullivan , Lubomyr T. Romankiw , Naigang Wang , Bucknell C. Webb
IPC分类号： H01F27/245 , H01F41/00
CPC分类号： H01F41/042 , H01F27/2804 , H01F41/046 , H01F2017/0066 , H01F2027/348
摘要： A thin film inductor having yokes, one or more of which is laminated, and one or more conductors passing between the yokes. The laminated yoke or yokes help reduce eddy currents and/or hysteresis losses.
摘要翻译：一种薄膜电感器，其具有轭，其中一个或多个层叠，以及一个或多个通过轭之间的导体。叠片磁轭或磁轭有助于减少涡流和/或磁滞损耗。

5. 发明授权

US5164869A Magnetic recording head with integrated magnetoresistive element and open yoke 失效
标题翻译：磁性录音头与集成磁性元件和开放的YOKE
公开(公告)号：US5164869A
公开(公告)日：1992-11-17
申请号：US661797
申请日：1991-02-27
申请人： Robert E. Fontana, Jr. , Lubomyr T. Romankiw , Mason L. Williams, III
发明人： Robert E. Fontana, Jr. , Lubomyr T. Romankiw , Mason L. Williams, III
IPC分类号： G11B5/31 , G11B5/39
CPC分类号： G11B5/3967
摘要： An integrated inductive write, magnetoresistive (MR) read thin film magnetic head comprising an open magnetic yoke having outside legs each having a winding thereon and a central leg having an opening across which the MR element is coupled. The outer legs are overlapped at one end to form confronting pole pieces having a transducing gap between the pole pieces, and the central leg is positioned between the pole pieces at one end and joined with the outer legs at the other end to form a symmetrical magnetic yoke structure. The windings are wound in a direction so that the flux produced by equally energizing the windings is equal and opposite in each of the outside legs, is additive at the transducing gap between the pole pieces, and produces no net flux through the central leg.

6. 发明授权

US5310580A Electroless metal adhesion to organic dielectric material with phase separated morphology 失效
标题翻译：无机金属与相分离形态的有机介电材料粘合
公开(公告)号：US5310580A
公开(公告)日：1994-05-10
申请号：US874665
申请日：1992-04-27
申请人： Eugene J. O'Sullivan , Terrence R. O'Toole , Judith M. Roldan , Lubomyr T. Romankiw , Carlos J. Sambucetti , Ravi Saraf
发明人： Eugene J. O'Sullivan , Terrence R. O'Toole , Judith M. Roldan , Lubomyr T. Romankiw , Carlos J. Sambucetti , Ravi Saraf
IPC分类号： B05D1/34 , C23C18/20 , H05K3/18 , H05K3/38 , B05D2/06
CPC分类号： H05K3/387 , B05D1/34 , C23C18/20 , C23C18/2033 , C23C18/208 , C23C18/24 , C23C18/30 , H05K2201/0154 , H05K2201/0212 , H05K2203/0759 , H05K2203/0773 , H05K2203/0793 , H05K3/181 , H05K3/381
摘要： Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation. Upon exposure to alkaline solution there is etching of one of the polymer phases at a faster rate and simultaneous opening of the seeding colloid. The rough surface is overcoated with a photoresist, exposed and developed. Subsequent electroless metal deposition results in improved metal to dielectric layer adhesion. The method is applicable to selective deposition of electroless copper onto a polyimide layer.
摘要翻译：沉积在具有相分离形态的有机电介质层上的化学金属的改善的粘附通过自发形成形态和形貌上粗糙的表面来实现。在一个实施方案中，可以将不同顺序的两相分离的相同聚合物的极性溶剂和两种聚合物前体的三元溶液在基材上成膜并加热形成不同阶数的两相以自发产生粗糙表面。在暴露于碱性溶液时，以比另一相更快的速率蚀刻一相。在粗糙表面上的金属的接种和无电沉积导致金属对电介质层的附着力提高。在第二个实施方案中，将极性溶剂，接种剂，可以在两相中分离的相同聚合物的两种聚合物前体的四元溶液浇铸在基材上的薄膜中，并加热形成三相。固化前体由于相分离而导致表面粗糙化。暴露在碱性溶液中时，以更快的速率蚀刻聚合物相之一并同时打开接种胶体。粗糙表面用光致抗蚀剂涂覆，曝光和显影。随后的无电金属沉积导致金属与电介质层粘附性的改善。该方法适用于将化学镀铜选择性沉积到聚酰亚胺层上。

7. 发明申请

US20110272287A1 METHOD FOR PATTERNING MAGNETIC FILMS 审中-公开
标题翻译：用于绘制磁片的方法
公开(公告)号：US20110272287A1
公开(公告)日：2011-11-10
申请号：US12776010
申请日：2010-05-07
申请人： Elizabeth A. Duch , Ronald Goldblatt , David L. Rath , Lubomyr T. Romankiw , Xiaoyan Shao , Steven E. Steen , James Vichiconti
发明人： Elizabeth A. Duch , Ronald Goldblatt , David L. Rath , Lubomyr T. Romankiw , Xiaoyan Shao , Steven E. Steen , James Vichiconti
IPC分类号： C25D5/34
CPC分类号： C25D5/48 , C25D5/02 , G11B5/855 , G11B5/858
摘要： A method of patterning magnetic devices and sensors by double etching, which includes forming a layer of dielectric on a substrate; depositing a thin adhesion layer and a thin seed layer; applying a thin resist frame to pattern a structure; cleaning the metal surface to prepare for plating; electroplating to fill up the structure and the uncovered field area, which uses a paddle cell with a permanent magnet providing magnetic field to induce magnetic orientation; stripping the resist frame; etching the seed layer/adhesion layer exposed below the resist frame down to the dielectric surface; etching the rest of magnetic materials and the seed layer using electrolytic etching in the field; etching the adhesion layer in the field, and repeating the steps for building structures with multiple levels.
摘要翻译：一种通过双蚀刻图案化磁性器件和传感器的方法，包括在衬底上形成电介质层; 沉积薄的粘合层和薄的种子层; 施加薄的抗蚀剂框架以构图结构; 清洗金属表面进行电镀准备; 电镀以填充结构和未覆盖的场区域，其使用具有提供磁场的永磁体的桨电池来诱导磁取向; 剥离抗蚀框架; 将暴露在抗蚀剂框架下方的种子层/粘合层蚀刻到电介质表面; 在现场使用电解蚀刻蚀刻其余的磁性材料和种子层; 在现场蚀刻粘合层，并重复用于建造具有多层结构的步骤。

8. 发明授权

US07944006B2 Metal gate electrode stabilization by alloying 有权
标题翻译：金属栅电极通过合金化稳定
公开(公告)号：US07944006B2
公开(公告)日：2011-05-17
申请号：US12014511
申请日：2008-01-15
申请人： Veeraraghavan S. Basker , Hariklia Deligianni , Rajarao Jammy , Vamsi Krishna Paruchuri , Lubomyr T. Romankiw
发明人： Veeraraghavan S. Basker , Hariklia Deligianni , Rajarao Jammy , Vamsi Krishna Paruchuri , Lubomyr T. Romankiw
IPC分类号： H01L29/78
CPC分类号： C25D3/567 , C25D5/02 , C25D7/12 , H01L21/28079 , H01L21/28088 , H01L21/28176 , H01L29/495 , H01L29/4966 , H01L29/517
摘要： Stabilized metal gate electrode for complementary metal-oxide-semiconductor (“CMOS”) applications and methods of making the stabilized metal gate electrodes are disclosed. Specifically, the metal gate electrodes are stabilized by alloying wherein the alloy comprises a metal selected from the group consisting of Re, Ru, Pt, Rh, Ni, Al and combinations thereof and an element selected from the group consisting of W, V, Ti, Ta and combinations thereof.
摘要翻译：公开了用于互补金属氧化物半导体（“CMOS”）应用的稳定金属栅极电极和制造稳定的金属栅电极的方法。具体地说，金属栅电极通过合金化来稳定化，其中合金包括选自Re，Ru，Pt，Rh，Ni，Al及其组合的金属和选自W，V，Ti ，Ta及其组合。

9. 发明授权

US07785982B2 Structures containing electrodeposited germanium and methods for their fabrication 失效
标题翻译：含有电沉积锗的结构及其制造方法
公开(公告)号：US07785982B2
公开(公告)日：2010-08-31
申请号：US11620224
申请日：2007-01-05
申请人： Stephen W. Bedell , Hariklia Deligianni , Qiang Huang , Lubomyr T. Romankiw , Devendra K. Sadana , Katherine L. Saenger
发明人： Stephen W. Bedell , Hariklia Deligianni , Qiang Huang , Lubomyr T. Romankiw , Devendra K. Sadana , Katherine L. Saenger
IPC分类号： H01L21/76
CPC分类号： H01L21/823807 , H01L21/0237 , H01L21/02532 , H01L21/02628 , H01L21/02636 , H01L21/02639 , H01L21/28255 , H01L29/1054 , H01L29/78
摘要： Methods for electrodepositing germanium on various semiconductor substrates such as Si, Ge, SiGe, and GaAs are provided. The electrodeposited germanium can be formed as a blanket or patterned film, and may be crystallized by solid phase epitaxy to the orientation of the underlying semiconductor substrate by subsequent annealing. These plated germanium layers may be used as the channel regions of high-mobility channel field effect transistors (FETs) in complementary metal oxide semiconductor (CMOS) circuits.
摘要翻译：提供了在诸如Si，Ge，SiGe和GaAs的各种半导体衬底上电沉积锗的方法。电沉积锗可以形成为覆盖或图案化的膜，并且可以通过后续退火使固相外延结晶到下面的半导体衬底的取向。这些电镀锗层可以用作互补金属氧化物半导体（CMOS）电路中的高迁移率沟道场效应晶体管（FET）的沟道区。

10. 发明申请

US20090294989A1 FORMATION OF VERTICAL DEVICES BY ELECTROPLATING 有权
标题翻译：通过电镀形成垂直装置
公开(公告)号：US20090294989A1
公开(公告)日：2009-12-03
申请号：US12538782
申请日：2009-08-10
申请人： Hariklia Deligianni , Qiang Huang , John P. Hummel , Lubomyr T. Romankiw , Mary B. Rothwell
发明人： Hariklia Deligianni , Qiang Huang , John P. Hummel , Lubomyr T. Romankiw , Mary B. Rothwell
IPC分类号： H01L23/48
CPC分类号： H01L21/76879 , H01L21/2885 , Y10S205/925
摘要： The present invention is related to a method for forming vertical conductive structures by electroplating. Specifically, a template structure is first formed, which includes a substrate, a discrete metal contact pad located on the substrate surface, an inter-level dielectric (ILD) layer over both the discrete metal contact pad and the substrate, and a metal via structure extending through the ILD layer onto the discrete metal contact pad. Next, a vertical via is formed in the template structure, which extends through the ILD layer onto the discrete metal contact pad. A vertical conductive structure is then formed in the vertical via by electroplating, which is conducted by applying an electroplating current to the discrete metal contact pad through the metal via structure. Preferably, the template structure comprises multiple discrete metal contact pads, multiple metal via structures, and multiple vertical vias for formation of multiple vertical conductive structures.
摘要翻译：本发明涉及通过电镀形成垂直导电结构的方法。具体地，首先形成模板结构，其包括衬底，位于衬底表面上的离散金属接触焊盘，分立金属接触焊盘和衬底两者之间的级间电介质（ILD）层，以及金属通孔结构延伸穿过ILD层到分立的金属接触垫上。接下来，在模板结构中形成垂直通孔，其延伸穿过ILD层到分立的金属接触垫上。然后通过电镀在垂直通孔中形成垂直导电结构，电镀通过通过金属通孔结构将电镀电流施加到离散的金属接触焊盘来进行。优选地，模板结构包括多个分立的金属接触焊盘，多个金属通孔结构以及用于形成多个垂直导电结构的多个垂直通孔。

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