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    • 3. 发明申请
    • Reduction of etch mask feature critical dimensions
    • 蚀刻掩模的减少具有关键尺寸
    • US20060134917A1
    • 2006-06-22
    • US11016455
    • 2004-12-16
    • Zhisong HuangS.M. SadjadiJeffrey Marks
    • Zhisong HuangS.M. SadjadiJeffrey Marks
    • H01L21/4757C23F1/00
    • H01L21/67069H01L21/0337H01L21/0338H01L21/31144
    • A method for forming features in an etch layer in an etch stack with an etch mask over the etch layer, wherein the etch mask has etch mask features with sidewalls, where the etch mask features have a first critical dimension, is provided. A cyclical critical dimension reduction is performed to form deposition layer features with a second critical dimension, which is less than the first critical dimension. Each cycle, comprises a depositing phase for depositing a deposition layer over the exposed surfaces, including the vertical sidewalls, of the etch mask features and an etching phase for etching back the deposition layer leaving a selective deposition on the vertical sidewalls. Features are etched into the etch layer, wherein the etch layer features have a third critical dimension, which is less than the first critical dimension.
    • 一种用于在蚀刻层上的蚀刻层中形成蚀刻层中的特征的方法,其中蚀刻掩模具有带侧壁的蚀刻掩模特征,其中蚀刻掩模特征具有第一临界尺寸。 执行周期性临界尺寸降低以形成具有小于第一临界尺寸的第二临界尺寸的沉积层特征。 每个循环包括沉积相,用于在包括垂直侧壁的蚀刻掩模特征的暴露表面上沉积沉积层,以及用于蚀刻回沉积层的蚀刻阶段,在垂直侧壁上留下选择性沉积。 将特征蚀刻到蚀刻层中,其中蚀刻层特征具有小于第一临界尺寸的第三临界尺寸。
    • 4. 发明申请
    • Reduction of feature critical dimensions using multiple masks
    • 使用多个掩模降低功能关键尺寸
    • US20060172540A1
    • 2006-08-03
    • US11050985
    • 2005-02-03
    • Jeffrey MarksS.M. Sadjadi
    • Jeffrey MarksS.M. Sadjadi
    • H01L21/311
    • H01L21/0273H01L21/3088H01L21/31144H01L21/32139
    • A method for forming features in an etch layer is provided. A first mask is formed over the etch layer wherein the first mask defines a plurality of spaces with widths. A sidewall layer is formed over the first mask. Features are etched into the etch layer through the sidewall layer, wherein the features have widths that are smaller than the widths of the spaces defined by the first mask. The mask and sidewall layer are removed. An additional mask is formed over the etch layer wherein the additional mask defines a plurality of spaces with widths. A sidewall layer is formed over the additional mask. Features are etched into the etch layer through the sidewall layer, wherein the widths that are smaller than the widths of the spaces defined by the first mask. The mask and sidewall layer are removed.
    • 提供了一种在蚀刻层中形成特征的方法。 在蚀刻层上形成第一掩模,其中第一掩模限定具有宽度的多个空间。 在第一掩模上形成侧壁层。 特征通过侧壁蚀刻到蚀刻层中,其中特征具有小于由第一掩模限定的空间的宽度的宽度。 去除掩模和侧壁层。 在蚀刻层上形成另外的掩模,其中附加掩模限定具有宽度的多个空间。 侧壁层形成在附加掩模上。 特征通过侧壁蚀刻到蚀刻层中,其中宽度小于由第一掩模限定的空间的宽度。 去除掩模和侧壁层。
    • 5. 发明申请
    • Pitch reduction
    • 节距减少
    • US20070264830A1
    • 2007-11-15
    • US11432194
    • 2006-05-10
    • Zhisong HuangJeffrey MarksS.M. Sadjadi
    • Zhisong HuangJeffrey MarksS.M. Sadjadi
    • H01L21/311H01L21/306
    • H01L21/0337H01L21/0338H01L21/3086H01L21/3088H01L21/31144H01L21/32139
    • A method for providing features in an etch layer is provided. A sacrificial patterned layer with sacrificial features is provided over an etch layer. Conformal sidewalls are formed in the sacrificial features, comprising at least two cycles of a sidewall formation process, wherein each cycle comprises a sidewall deposition phase and a sidewall profile shaping phase. Parts of the sacrificial patterned layer between conformal sidewalls are removed leaving the conformal sidewalls with gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed. Features are etched in the etch layer using the conformal sidewalls as an etch mask, wherein the features in the etch layer are etched through the gaps between the conformal sidewalls where parts of the sacrificial patterned layer were selectively removed.
    • 提供了一种用于在蚀刻层中提供特征的方法。 在蚀刻层上提供具有牺牲特征的牺牲图案层。 保形侧壁形成在牺牲特征中,包括侧壁形成工艺的至少两个循环,其中每个循环包括侧壁沉积阶段和侧壁轮廓成形阶段。 除去共形侧壁之间的牺牲图案层的部分,留下保形侧壁,其中保形侧壁之间的间隙被选择性地去除牺牲图案层的部分。 使用保形侧壁作为蚀刻掩模在蚀刻层中蚀刻特征,其中蚀刻层中的特征被蚀刻通过牺牲图案层的部分被选择性去除的共形侧壁之间的间隙。
    • 8. 发明授权
    • Reduction of feature critical dimensions using multiple masks
    • 使用多个掩模降低功能关键尺寸
    • US07271107B2
    • 2007-09-18
    • US11050985
    • 2005-02-03
    • Jeffrey MarksS. M. Reza Sadjadi
    • Jeffrey MarksS. M. Reza Sadjadi
    • H01L21/311
    • H01L21/0273H01L21/3088H01L21/31144H01L21/32139
    • A method for forming features in an etch layer is provided. A first mask is formed over the etch layer wherein the first mask defines a plurality of spaces with widths. A sidewall layer is formed over the first mask. Features are etched into the etch layer through the sidewall layer, wherein the features have widths that are smaller than the widths of the spaces defined by the first mask. The mask and sidewall layer are removed. An additional mask is formed over the etch layer wherein the additional mask defines a plurality of spaces with widths. A sidewall layer is formed over the additional mask. Features are etched into the etch layer through the sidewall layer, wherein the widths that are smaller than the widths of the spaces defined by the first mask. The mask and sidewall layer are removed.
    • 提供了一种在蚀刻层中形成特征的方法。 在蚀刻层上形成第一掩模,其中第一掩模限定具有宽度的多个空间。 在第一掩模上形成侧壁层。 特征通过侧壁蚀刻到蚀刻层中,其中特征具有小于由第一掩模限定的空间的宽度的宽度。 去除掩模和侧壁层。 在蚀刻层上形成另外的掩模,其中附加掩模限定具有宽度的多个空间。 侧壁层形成在附加掩模上。 特征通过侧壁蚀刻到蚀刻层中,其中宽度小于由第一掩模限定的空间的宽度。 去除掩模和侧壁层。
    • 10. 发明授权
    • Method and apparatus for detecting endpoint during plasma etching of thin films
    • 用于在薄膜等离子体蚀刻期间检测端点的方法和装置
    • US06908846B2
    • 2005-06-21
    • US10401114
    • 2003-03-27
    • Brian K. McMillinEric HudsonJeffrey Marks
    • Brian K. McMillinEric HudsonJeffrey Marks
    • H01L21/311H01L21/66H01L21/768H01L21/4763H01L21/302H01L23/48
    • H01L21/76829H01J37/32963H01L21/31116H01L21/31138H01L21/76801H01L21/76807H01L22/26
    • A method for controlling a plasma etch process while etching a layer stack having a first layer disposed above an end-point generating layer is disclosed. The method includes etching through the first layer and at least partially through the end-point generating layer while monitoring an absorption rate of a light beam traversing an interior portion of the plasma processing chamber, wherein the end-point generating layer is selected from a material that produces a detectable change in the absorption rate when etched. The end-point generating layer is characterized by at least one of a first characteristic and a second characteristic. The first characteristic is an insufficient thickness to function as an etch stop layer, and the second characteristic is an insufficient selectivity to etchants employed to etch through the first layer to function as the etch stop layer. The method additionally includes generating an end-point signal upon detecting the detectable change.
    • 公开了一种用于在蚀刻具有设置在端点产生层上方的第一层的层堆叠的同时控制等离子体蚀刻工艺的方法。 该方法包括:在监测穿过等离子体处理室的内部部分的光束的吸收率的同时,蚀刻穿过第一层并且至少部分地穿过端点产生层,其中端点产生层选自材料 其在蚀刻时产生可检测的吸收速率变化。 端点产生层的特征在于第一特征和第二特性中的至少一个。 第一特征是不足以用作蚀刻停止层的厚度,并且第二特性对于用于蚀刻通过第一层以用作蚀刻停止层的蚀刻剂的选择性不足。 该方法还包括在检测到可检测变化时产生端点信号。