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1. 发明授权

US07142992B1 Flexible hybrid defect classification for semiconductor manufacturing 有权
标题翻译：用于半导体制造的灵活混合缺陷分类
公开(公告)号：US07142992B1
公开(公告)日：2006-11-28
申请号：US10954968
申请日：2004-09-30
申请人： Patrick Huet , Maruti Shanbhag , Sandeep Bhagwat , Michal Kowalski , Vivekanand Kini , David Randall , Sharon McCauley , Tong Huang , Jianxin Zhang , Kenong Wu , Lisheng Gao , Ariel Tribble , Ashok Kulkarni , Cecelia Anne Campochiaro
发明人： Patrick Huet , Maruti Shanbhag , Sandeep Bhagwat , Michal Kowalski , Vivekanand Kini , David Randall , Sharon McCauley , Tong Huang , Jianxin Zhang , Kenong Wu , Lisheng Gao , Ariel Tribble , Ashok Kulkarni , Cecelia Anne Campochiaro
IPC分类号： G01R31/00 , G06F19/00
CPC分类号： G06T7/0004 , G01R31/2846 , G06T2200/24 , G06T2207/30148
摘要： Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules included in the sequence may be selected by a user using a graphical interface. The method also includes classifying the defects based on results of applying the sequence of rules to the inspection data.
摘要翻译：提供了用于分类半导体制造中的缺陷的混合方法。这些方法包括将错误的规则序列应用于检查数据。规则序列包括确定性规则，统计规则，混合规则或其某种组合。序列中包括的规则可以由用户使用图形界面来选择。该方法还包括基于将规则序列应用于检查数据的结果对缺陷进行分类。

2. 发明申请

US20060265145A1 FLEXIBLE HYBRID DEFECT CLASSIFICATION FOR SEMICONDUCTOR MANUFACTURING 有权
标题翻译：用于半导体制造的灵活混合缺陷分类
公开(公告)号：US20060265145A1
公开(公告)日：2006-11-23
申请号：US10954968
申请日：2004-09-30
申请人： Patrick Huet , Maruti Shanbhag , Sandeep Bhagwat , Michal Kowalski , Vivekanand Kini , David Randall , Sharon McCauley , Tong Huang , Jianxin Zhang , Kenong Wu , Lisheng Gao , Ariel Tribble , Ashok Kulkarni , Cecelia Anne Campochiaro
发明人： Patrick Huet , Maruti Shanbhag , Sandeep Bhagwat , Michal Kowalski , Vivekanand Kini , David Randall , Sharon McCauley , Tong Huang , Jianxin Zhang , Kenong Wu , Lisheng Gao , Ariel Tribble , Ashok Kulkarni , Cecelia Anne Campochiaro
IPC分类号： G01B5/28
CPC分类号： G06T7/0004 , G01R31/2846 , G06T2200/24 , G06T2207/30148
摘要： Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules included in the sequence may be selected by a user using a graphical interface The method also includes classifying the defects based on results of applying the sequence of rules to the inspection data.
摘要翻译：提供了用于分类半导体制造中的缺陷的混合方法。这些方法包括将错误的规则序列应用于检查数据。规则序列包括确定性规则，统计规则，混合规则或其某种组合。包括在序列中的规则可以由用户使用图形界面来选择。该方法还包括基于将规则序列应用于检查数据的结果对缺陷进行分类。

3. 发明申请

US20070133860A1 Methods and systems for binning defects detected on a specimen 有权
标题翻译：在样本上检测到的缺陷的方法和系统
公开(公告)号：US20070133860A1
公开(公告)日：2007-06-14
申请号：US11300172
申请日：2005-12-14
申请人： Jason Lin , Xing Chu , Kenong Wu , Sharon McCauley
发明人： Jason Lin , Xing Chu , Kenong Wu , Sharon McCauley
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G06T2207/30148
摘要： Methods and systems for binning defects detected on a specimen are provided. One method includes comparing a test image to reference images. The test image includes an image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen. The reference images include images of one or more patterned features associated with different regions of interest within a device being formed on the specimen. If the one or more patterned features of the test image match the one or more patterned features of one of the reference images, the method includes assigning the defect to a bin corresponding to the region of interest associated with the reference image.
摘要翻译：提供了在样本上检测到的合并缺陷的方法和系统。一种方法包括将测试图像与参考图像进行比较。测试图像包括形成在样本上的接近于在样本上检测到的缺陷的一个或多个图案特征的图像。参考图像包括在形成在样本上的装置内的与感兴趣的不同区域相关联的一个或多个图案特征的图像。如果测试图像的一个或多个图案特征与参考图像之一的一个或多个图案特征匹配，则该方法包括将缺陷分配给对应于与参考图像相关联的感兴趣区域的区域。

4. 发明授权

US07570800B2 Methods and systems for binning defects detected on a specimen 有权
标题翻译：在样本上检测到的缺陷的方法和系统
公开(公告)号：US07570800B2
公开(公告)日：2009-08-04
申请号：US11300172
申请日：2005-12-14
申请人： Jason Z. Lin , Xing Chu , Kenong Wu , Sharon McCauley
发明人： Jason Z. Lin , Xing Chu , Kenong Wu , Sharon McCauley
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G06T2207/30148
摘要： Methods and systems for binning defects detected on a specimen are provided. One method includes comparing a test image to reference images. The test image includes an image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen. The reference images include images of one or more patterned features associated with different regions of interest within a device being formed on the specimen. If the one or more patterned features of the test image match the one or more patterned features of one of the reference images, the method includes assigning the defect to a bin corresponding to the region of interest associated with the reference image.
摘要翻译：提供了在样本上检测到的合并缺陷的方法和系统。一种方法包括将测试图像与参考图像进行比较。测试图像包括形成在样本上的接近于在样本上检测到的缺陷的一个或多个图案特征的图像。参考图像包括在形成在样本上的装置内的与感兴趣的不同区域相关联的一个或多个图案特征的图像。如果测试图像的一个或多个图案特征与参考图像之一的一个或多个图案特征匹配，则该方法包括将缺陷分配给对应于与参考图像相关联的感兴趣区域的区域。

5. 发明申请

US20090290784A1 METHODS AND SYSTEMS FOR BINNING DEFECTS DETECTED ON A SPECIMEN 审中-公开
标题翻译：用于在样本上检测缺陷的方法和系统
公开(公告)号：US20090290784A1
公开(公告)日：2009-11-26
申请号：US12534709
申请日：2009-08-03
申请人： Jason Z. Lin , Xing Chu , Kenong Wu , Sharon McCauley
发明人： Jason Z. Lin , Xing Chu , Kenong Wu , Sharon McCauley
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G06T2207/30148
摘要： Methods and systems for binning defects detected on a specimen are provided. One method includes comparing a test image to reference images. The test image includes an image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen. The reference images include images of one or more patterned features associated with different regions of interest within a device being formed on the specimen. If the one or more patterned features of the test image match the one or more patterned features of one of the reference images, the method includes assigning the defect to a bin corresponding to the region of interest associated with the reference image.
摘要翻译：提供了在样本上检测到的合并缺陷的方法和系统。一种方法包括将测试图像与参考图像进行比较。测试图像包括形成在样本上的接近于在样本上检测到的缺陷的一个或多个图案特征的图像。参考图像包括在形成在样本上的装置内的与感兴趣的不同区域相关联的一个或多个图案特征的图像。如果测试图像的一个或多个图案特征与参考图像之一的一个或多个图案特征匹配，则该方法包括将缺陷分配给对应于与参考图像相关联的感兴趣区域的区域。

6. 发明授权

US09037280B2 Computer-implemented methods for performing one or more defect-related functions 有权
标题翻译：用于执行一个或多个缺陷相关功能的计算机实现的方法
公开(公告)号：US09037280B2
公开(公告)日：2015-05-19
申请号：US11146342
申请日：2005-06-06
申请人： Mark Dishner , Chris W. Lee , Sharon McCauley , Patrick Huet , David Wang
发明人： Mark Dishner , Chris W. Lee , Sharon McCauley , Patrick Huet , David Wang
IPC分类号： G06F19/00 , G05B23/02
CPC分类号： G05B23/0221
摘要： Computer-implemented methods for performing one or more defect-related functions are provided. One method for identifying noise in inspection data includes identifying events detected in a number of sets of inspection data that is less than a predetermined number as noise. One method for binning defects includes binning the defects into groups based on defect characteristics and the sets of the inspection data in which the defects were detected. One method for selecting defects for defect analysis includes binning defects into group(s) based on proximity of the defects to each other and spatial signatures formed by the group(s). A different method for selecting defects for defect analysis includes selecting defects having the greatest diversity of defect characteristic(s) for defect analysis. One method includes classifying defects on a specimen using inspection data generated for the specimen combined with defect review data generated for the specimen.
摘要翻译：提供了用于执行一个或多个缺陷相关功能的计算机实现的方法。用于识别检查数据中的噪声的一种方法包括将小于预定数目的多组检查数据中检测到的事件识别为噪声。分类缺陷的一种方法包括基于缺陷特征和检测缺陷检查数据的集合将缺陷合并成组。用于选择缺陷分析的缺陷的一种方法包括基于缺陷彼此的接近度和由组形成的空间特征将缺陷合并成组。用于选择缺陷分析缺陷的不同方法包括选择具有最大差异缺陷特征的缺陷以进行缺陷分析。一种方法包括使用生成的样本的检查数据与样本产生的缺陷评估数据相结合来对样本进行分类。

7. 发明申请

US20060287751A1 Computer-implemented methods for performing one or more defect-related functions 有权
公开(公告)号：US20060287751A1
公开(公告)日：2006-12-21
申请号：US11146342
申请日：2005-06-06
申请人： Mark Dishner , Chris Lee , Sharon McCauley , Patrick Huet , David Wang
发明人： Mark Dishner , Chris Lee , Sharon McCauley , Patrick Huet , David Wang
IPC分类号： G06F19/00
CPC分类号： G05B23/0221
摘要： Computer-implemented methods for performing one or more defect-related functions are provided. One method for identifying noise in inspection data includes identifying events detected in a number of sets of inspection data that is less than a predetermined number as noise. One method for binning defects includes binning the defects into groups based on defect characteristics and the sets of the inspection data in which the defects were detected. One method for selecting defects for defect analysis includes binning defects into group(s) based on proximity of the defects to each other and spatial signatures formed by the group(s). A different method for selecting defects for defect analysis includes selecting defects having the greatest diversity of defect characteristic(s) for defect analysis. One method includes classifying defects on a specimen using inspection data generated for the specimen combined with defect review data generated for the specimen.

8. 发明申请

US20060025948A1 Inspection system setup techniques 有权
公开(公告)号：US20060025948A1
公开(公告)日：2006-02-02
申请号：US11238357
申请日：2005-09-28
申请人： David Coldren , Prashant Aji , David Randall , Sharon McCauley
发明人： David Coldren , Prashant Aji , David Randall , Sharon McCauley
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32197 , G05B2219/45031 , H01L21/67276 , Y02P90/20 , Y02P90/22
摘要： Techniques for efficiently setting up inspection, metrology, and review systems for operating upon semiconductor wafers are described. Specifically, this involves setting up recipes that allows each system to accurately inspect semiconductor wafers. The invention gathers pertinent information from these tools and presents the information to users in a way that greatly reduces the time required to complete a recipe. One system embodiment includes an inspection system and a review station that is communicatively linked such that the review station can read from and write to an entire set of data stored at the inspection system. The set of data includes image files of features detected by the inspection system.

9. 发明授权

US09002497B2 Methods and systems for inspection of wafers and reticles using designer intent data 有权
标题翻译：使用设计人员意图数据检查晶圆和标线片的方法和系统
公开(公告)号：US09002497B2
公开(公告)日：2015-04-07
申请号：US10883372
申请日：2004-07-01
申请人： William Volk , James Wiley , Sterling Watson , Sagar A. Kekare , Carl Hess , Paul Frank Marella , Sharon McCauley , Ellis Chang
发明人： William Volk , James Wiley , Sterling Watson , Sagar A. Kekare , Carl Hess , Paul Frank Marella , Sharon McCauley , Ellis Chang
IPC分类号： G06F19/00 , G03F1/84 , G01N21/95 , G01N21/956 , G03F7/20
CPC分类号： G06T7/0006 , G01N21/9501 , G01N21/956 , G01N2021/95676 , G03F1/84 , G03F7/7065 , G06T7/0008 , G06T2207/30148
摘要： Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
摘要翻译：提供了使用设计人员意图数据检查晶圆和标线的方法和系统。一种计算机实现的方法包括基于通过检查光罩产生的检查数据来识别晶片上的有害缺陷，其用于在晶片检查之前在晶片上形成图案。另一种计算机实现的方法包括通过分析通过检查晶片产生的数据来结合表示标线的数据来检测晶片上的缺陷，该数据包括标识掩模版的不同类型的部分的标记。附加的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。进一步的计算机实现的方法包括基于通过检查晶片产生的数据来改变或模拟集成电路的设计的一个或多个特性。

10. 发明申请

US20080081385A1 METHODS AND SYSTEMS FOR INSPECTION OF WAFERS AND RETICLES USING DESIGNER INTENT DATA 审中-公开
标题翻译：使用设计者信息数据检查波形和反射的方法和系统
公开(公告)号：US20080081385A1
公开(公告)日：2008-04-03
申请号：US11939983
申请日：2007-11-14
申请人： Paul Marella , Sharon McCauley , Ellis Chang , William Volk , James Wiley , Sterling Watson , Sagar Kekare , Carl Hess
发明人： Paul Marella , Sharon McCauley , Ellis Chang , William Volk , James Wiley , Sterling Watson , Sagar Kekare , Carl Hess
IPC分类号： H01L21/66
CPC分类号： G06T7/0006 , G01N21/9501 , G01N21/956 , G01N2021/95676 , G03F1/84 , G03F7/7065 , G06T7/0008 , G06T2207/30148
摘要： Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
摘要翻译：提供了使用设计人员意图数据检查晶圆和标线的方法和系统。一种计算机实现的方法包括基于通过检查光罩产生的检查数据来识别晶片上的有害缺陷，其用于在晶片检查之前在晶片上形成图案。另一种计算机实现的方法包括通过分析通过检查晶片产生的数据来结合表示标线的数据来检测晶片上的缺陷，该数据包括标识掩模版的不同类型的部分的标记。附加的计算机实现的方法包括基于改变晶片上形成的器件的特性的缺陷来确定用于处理晶片的制造工艺的特性。进一步的计算机实现的方法包括基于通过检查晶片产生的数据来改变或模拟集成电路的设计的一个或多个特性。

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