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1. 发明专利

IL234345A Methods and systems for utilizing design data in combination with inspection data 未知
公开(公告)号：IL234345A
公开(公告)日：2016-11-30
申请号：IL23434514
申请日：2014-08-27
申请人： KLA-TENCOR TECH CORP , SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE , KHURRAM ZAFAR
发明人： SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE , KHURRAM ZAFAR
IPC分类号： G01N20060101 , G06K20060101 , G06T20060101
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

2. 发明专利

IL234344A Methods and systems for utilizing design data in combination with inspection data 未知
公开(公告)号：IL234344A
公开(公告)日：2016-11-30
申请号：IL23434414
申请日：2014-08-27
申请人： KLA-TENCOR TECH CORP , SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE , KHURRAM ZAFAR
发明人： SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE , KHURRAM ZAFAR
IPC分类号： G01N20060101 , G06K20060101 , G06T20060101
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

3. 发明专利

IL234343A Methods and systems for utilizing design data in combination with inspection data 未知
公开(公告)号：IL234343A
公开(公告)日：2016-11-30
申请号：IL23434314
申请日：2014-08-27
申请人： KLA-TENCOR TECH CORP , SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE , KHURRAM ZAFAR
发明人： SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE , KHURRAM ZAFAR
IPC分类号： G01N20060101 , G06K20060101 , G06T20060101
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

4. 发明专利

IL234289A Methods and systems for utilizing design data in combination with inspection data 未知
公开(公告)号：IL234289A
公开(公告)日：2016-10-31
申请号：IL23428914
申请日：2014-08-25
申请人： KLA-TENCOR TECH CORP , KHURRAM ZAFAR , SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE
发明人： KHURRAM ZAFAR , SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE
IPC分类号： G01N20060101 , G06K20060101 , G06T20060101
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

5. 发明专利

IL234319A Methods and systems for utilizing design data in combination with inspection data 未知
公开(公告)号：IL234319A
公开(公告)日：2016-10-31
申请号：IL23431914
申请日：2014-08-26
申请人： KLA-TENCOR TECH CORP , SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE , KHURRAM ZAFAR
发明人： SAGAR KEKARE , ELLIS CHANG , ALLEN PARK , PETER ROSE , KHURRAM ZAFAR
IPC分类号： G01N20060101 , G06K20060101 , G06T20060101
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

6. 发明授权

US09659670B2 Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer 有权
公开(公告)号：US09659670B2
公开(公告)日：2017-05-23
申请号：US13056623
申请日：2009-07-28
申请人： SunYong Choi , YeonHo Pae , Ellis Chang
发明人： SunYong Choi , YeonHo Pae , Ellis Chang
IPC分类号： H04N19/00 , G11C29/56
CPC分类号： G11C29/56 , G11C29/56008
摘要： Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer are provided.

7. 发明授权

US08923600B2 Methods and systems for utilizing design data in combination with inspection data 有权
标题翻译：利用设计数据结合检验数据的方法和系统
公开(公告)号：US08923600B2
公开(公告)日：2014-12-30
申请号：US12534547
申请日：2009-08-03
申请人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
发明人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
IPC分类号： G06K9/00 , G06F17/50 , G03F1/84
CPC分类号： G06T7/0006 , G03F1/84 , G06F17/5081 , G06T7/0008 , G06T2207/20076 , G06T2207/30148
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.
摘要翻译：提供了与检测数据结合使用设计数据的各种方法和系统。用于对在晶片上检测到的缺陷进行合并的计算机实现的方法包括将设计数据的部分靠近设计数据空间中的缺陷的位置进行比较。该方法还包括基于比较步骤的结果确定部分中的设计数据是否至少相似。此外，该方法包括将组中的缺陷合并成使得设计数据中靠近每个组中的缺陷的位置的部分至少相似。该方法还包括将合并步骤的结果存储在存储介质中。

8. 发明申请

US20110170091A1 INSPECTION GUIDED OVERLAY METROLOGY 有权
标题翻译：检查指导覆盖度量
公开(公告)号：US20110170091A1
公开(公告)日：2011-07-14
申请号：US12984679
申请日：2011-01-05
申请人： Ellis Chang , Amir Widmann , Allen Park
发明人： Ellis Chang , Amir Widmann , Allen Park
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/95607 , G01N2021/8822 , G03F7/70633 , G03F7/7065 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： Inspection guided overlay metrology may include performing a pattern search in order to identify a predetermined pattern on a semiconductor wafer, generating a care area for all instances of the predetermined pattern on the semiconductor wafer, identifying defects within generated care areas by performing an inspection scan of each of the generated care areas, wherein the inspection scan includes a low-threshold or a high sensitivity inspection scan, identifying overlay sites of the predetermined pattern of the semiconductor wafer having a measured overlay error larger than a selected overlay specification utilizing a defect inspection technique, comparing location data of the identified defects of a generated care area to location data of the identified overlay sites within the generated care area in order to identify one or more locations wherein the defects are proximate to the identified overlay sites, and generating a metrology sampling plan based on the identified locations.
摘要翻译：检查引导覆盖度量可以包括执行图案搜索以便识别半导体晶片上的预定图案，为半导体晶片上的预定图案的所有实例生成护理区域，通过执行检查扫描来检查所产生的护理区域内的缺陷每个生成的护理区域，其中检查扫描包括低阈值或高灵敏度检查扫描，识别具有大于使用缺陷检查技术的所选覆盖规格的测量的覆盖误差的半导体晶片的预定图案的覆盖位置将生成的护理区域的所识别的缺陷的位置数据与生成的护理区域内的所识别的覆盖位置的位置数据进行比较，以便识别其中缺陷接近所识别的覆盖位置的一个或多个位置，以及生成计量取样基于确定的位置进行计划。

9. 发明申请

US20090297019A1 METHODS AND SYSTEMS FOR UTILIZING DESIGN DATA IN COMBINATION WITH INSPECTION DATA 有权
标题翻译：与检验数据组合使用设计数据的方法和系统
公开(公告)号：US20090297019A1
公开(公告)日：2009-12-03
申请号：US12534547
申请日：2009-08-03
申请人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
发明人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G03F1/84 , G06F17/5081 , G06T7/0008 , G06T2207/20076 , G06T2207/30148
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.
摘要翻译：提供了与检测数据结合使用设计数据的各种方法和系统。用于对在晶片上检测到的缺陷进行合并的计算机实现的方法包括将设计数据的部分靠近设计数据空间中的缺陷的位置进行比较。该方法还包括基于比较步骤的结果确定部分中的设计数据是否至少相似。此外，该方法包括将组中的缺陷合并成使得设计数据中靠近每个组中的缺陷的位置的部分至少相似。该方法还包括将合并步骤的结果存储在存储介质中。

10. 发明授权

US07570796B2 Methods and systems for utilizing design data in combination with inspection data 有权
标题翻译：利用设计数据结合检验数据的方法和系统
公开(公告)号：US07570796B2
公开(公告)日：2009-08-04
申请号：US11561659
申请日：2006-11-20
申请人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
发明人： Khurram Zafar , Sagar Kekare , Ellis Chang , Allen Park , Peter Rose
IPC分类号： G06K9/00
CPC分类号： G06T7/0006 , G03F1/84 , G06F17/5081 , G06T7/0008 , G06T2207/20076 , G06T2207/30148
摘要： Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.
摘要翻译：提供了与检测数据结合使用设计数据的各种方法和系统。用于对在晶片上检测到的缺陷进行合并的计算机实现的方法包括将设计数据的部分靠近设计数据空间中的缺陷的位置进行比较。该方法还包括基于比较步骤的结果确定部分中的设计数据是否至少相似。此外，该方法包括将组中的缺陷合并成使得设计数据中靠近每个组中的缺陷的位置的部分至少相似。该方法还包括将合并步骤的结果存储在存储介质中。

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