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1. 发明授权

US07142992B1 Flexible hybrid defect classification for semiconductor manufacturing 有权
标题翻译：用于半导体制造的灵活混合缺陷分类
公开(公告)号：US07142992B1
公开(公告)日：2006-11-28
申请号：US10954968
申请日：2004-09-30
申请人： Patrick Huet , Maruti Shanbhag , Sandeep Bhagwat , Michal Kowalski , Vivekanand Kini , David Randall , Sharon McCauley , Tong Huang , Jianxin Zhang , Kenong Wu , Lisheng Gao , Ariel Tribble , Ashok Kulkarni , Cecelia Anne Campochiaro
发明人： Patrick Huet , Maruti Shanbhag , Sandeep Bhagwat , Michal Kowalski , Vivekanand Kini , David Randall , Sharon McCauley , Tong Huang , Jianxin Zhang , Kenong Wu , Lisheng Gao , Ariel Tribble , Ashok Kulkarni , Cecelia Anne Campochiaro
IPC分类号： G01R31/00 , G06F19/00
CPC分类号： G06T7/0004 , G01R31/2846 , G06T2200/24 , G06T2207/30148
摘要： Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules included in the sequence may be selected by a user using a graphical interface. The method also includes classifying the defects based on results of applying the sequence of rules to the inspection data.
摘要翻译：提供了用于分类半导体制造中的缺陷的混合方法。这些方法包括将错误的规则序列应用于检查数据。规则序列包括确定性规则，统计规则，混合规则或其某种组合。序列中包括的规则可以由用户使用图形界面来选择。该方法还包括基于将规则序列应用于检查数据的结果对缺陷进行分类。

2. 发明申请

US20060265145A1 FLEXIBLE HYBRID DEFECT CLASSIFICATION FOR SEMICONDUCTOR MANUFACTURING 有权
标题翻译：用于半导体制造的灵活混合缺陷分类
公开(公告)号：US20060265145A1
公开(公告)日：2006-11-23
申请号：US10954968
申请日：2004-09-30
申请人： Patrick Huet , Maruti Shanbhag , Sandeep Bhagwat , Michal Kowalski , Vivekanand Kini , David Randall , Sharon McCauley , Tong Huang , Jianxin Zhang , Kenong Wu , Lisheng Gao , Ariel Tribble , Ashok Kulkarni , Cecelia Anne Campochiaro
发明人： Patrick Huet , Maruti Shanbhag , Sandeep Bhagwat , Michal Kowalski , Vivekanand Kini , David Randall , Sharon McCauley , Tong Huang , Jianxin Zhang , Kenong Wu , Lisheng Gao , Ariel Tribble , Ashok Kulkarni , Cecelia Anne Campochiaro
IPC分类号： G01B5/28
CPC分类号： G06T7/0004 , G01R31/2846 , G06T2200/24 , G06T2207/30148
摘要： Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules included in the sequence may be selected by a user using a graphical interface The method also includes classifying the defects based on results of applying the sequence of rules to the inspection data.
摘要翻译：提供了用于分类半导体制造中的缺陷的混合方法。这些方法包括将错误的规则序列应用于检查数据。规则序列包括确定性规则，统计规则，混合规则或其某种组合。包括在序列中的规则可以由用户使用图形界面来选择。该方法还包括基于将规则序列应用于检查数据的结果对缺陷进行分类。

3. 发明授权

US09037280B2 Computer-implemented methods for performing one or more defect-related functions 有权
标题翻译：用于执行一个或多个缺陷相关功能的计算机实现的方法
公开(公告)号：US09037280B2
公开(公告)日：2015-05-19
申请号：US11146342
申请日：2005-06-06
申请人： Mark Dishner , Chris W. Lee , Sharon McCauley , Patrick Huet , David Wang
发明人： Mark Dishner , Chris W. Lee , Sharon McCauley , Patrick Huet , David Wang
IPC分类号： G06F19/00 , G05B23/02
CPC分类号： G05B23/0221
摘要： Computer-implemented methods for performing one or more defect-related functions are provided. One method for identifying noise in inspection data includes identifying events detected in a number of sets of inspection data that is less than a predetermined number as noise. One method for binning defects includes binning the defects into groups based on defect characteristics and the sets of the inspection data in which the defects were detected. One method for selecting defects for defect analysis includes binning defects into group(s) based on proximity of the defects to each other and spatial signatures formed by the group(s). A different method for selecting defects for defect analysis includes selecting defects having the greatest diversity of defect characteristic(s) for defect analysis. One method includes classifying defects on a specimen using inspection data generated for the specimen combined with defect review data generated for the specimen.
摘要翻译：提供了用于执行一个或多个缺陷相关功能的计算机实现的方法。用于识别检查数据中的噪声的一种方法包括将小于预定数目的多组检查数据中检测到的事件识别为噪声。分类缺陷的一种方法包括基于缺陷特征和检测缺陷检查数据的集合将缺陷合并成组。用于选择缺陷分析的缺陷的一种方法包括基于缺陷彼此的接近度和由组形成的空间特征将缺陷合并成组。用于选择缺陷分析缺陷的不同方法包括选择具有最大差异缺陷特征的缺陷以进行缺陷分析。一种方法包括使用生成的样本的检查数据与样本产生的缺陷评估数据相结合来对样本进行分类。

4. 发明申请

US20060287751A1 Computer-implemented methods for performing one or more defect-related functions 有权
公开(公告)号：US20060287751A1
公开(公告)日：2006-12-21
申请号：US11146342
申请日：2005-06-06
申请人： Mark Dishner , Chris Lee , Sharon McCauley , Patrick Huet , David Wang
发明人： Mark Dishner , Chris Lee , Sharon McCauley , Patrick Huet , David Wang
IPC分类号： G06F19/00
CPC分类号： G05B23/0221
摘要： Computer-implemented methods for performing one or more defect-related functions are provided. One method for identifying noise in inspection data includes identifying events detected in a number of sets of inspection data that is less than a predetermined number as noise. One method for binning defects includes binning the defects into groups based on defect characteristics and the sets of the inspection data in which the defects were detected. One method for selecting defects for defect analysis includes binning defects into group(s) based on proximity of the defects to each other and spatial signatures formed by the group(s). A different method for selecting defects for defect analysis includes selecting defects having the greatest diversity of defect characteristic(s) for defect analysis. One method includes classifying defects on a specimen using inspection data generated for the specimen combined with defect review data generated for the specimen.

5. 发明授权

US07570797B1 Methods and systems for generating an inspection process for an inspection system 有权
标题翻译：生成检查系统检查过程的方法和系统
公开(公告)号：US07570797B1
公开(公告)日：2009-08-04
申请号：US11125429
申请日：2005-05-10
申请人： David Wang , Patrick Huet , Tong Huang , Martin Plihal , Adam Chien-Huei Chen , Mike Van Riet , Stewart Hill
发明人： David Wang , Patrick Huet , Tong Huang , Martin Plihal , Adam Chien-Huei Chen , Mike Van Riet , Stewart Hill
IPC分类号： G06K9/00
CPC分类号： G06K9/6253 , G01N21/9501 , G06K2209/19 , G06T7/0004 , G06T2200/24 , G06T2207/10152 , G06T2207/20081 , G06T2207/30148
摘要： Methods and systems for generating an inspection process for an inspection system are provided. One computer implemented method includes generating inspection data for a selected defect on a specimen at different values of one or more image acquisition parameters of the inspection system. The method also includes determining which of the different values produces the best inspection data for the selected defect. In addition, the method includes selecting the different values determined to produce the best inspection data as values of the one or more image acquisition parameters to be used for the inspection process.
摘要翻译：提供了用于产生检查系统的检查过程的方法和系统。一种计算机实现的方法包括在检查系统的一个或多个图像采集参数的不同值处产生用于样本上的选定缺陷的检查数据。该方法还包括确定哪个不同的值产生用于所选缺陷的最佳检查数据。此外，该方法包括选择确定为产生最佳检查数据的不同值作为要用于检查过程的一个或多个图像获取参数的值。

6. 发明申请

US20110224932A1 MONITORING OF TIME-VARYING DEFECT CLASSIFICATION PERFORMANCE 有权
标题翻译：监测时变缺陷分类性能
公开(公告)号：US20110224932A1
公开(公告)日：2011-09-15
申请号：US12811319
申请日：2010-06-23
申请人： Patrick Huet , Brian Duffy , Martin Plihal , Thomas Trautzsch , Chris Maher
发明人： Patrick Huet , Brian Duffy , Martin Plihal , Thomas Trautzsch , Chris Maher
IPC分类号： G06F19/00
CPC分类号： G01R31/2656 , G01R31/2894 , G05B19/41875 , G05B2219/37224 , H01L22/12 , H01L22/20 , H01L2924/0002 , Y02P90/22 , H01L2924/00
摘要： Systems and methods for monitoring time-varying classification performance are disclosed. A method may include, but is not limited to: receiving one or more signals indicative of one or more properties of one or more samples from one or more scanning inspection tools; determining populations of one or more defect types for the one or more samples according an application of one or more classification rules to the one or more signals received from the one or more scanning inspection tools; determining populations of the one or more defect types for the one or more samples using one or more high-resolution inspection tools; and computing one or more correlations between populations of one or more defect types for one or more samples determined from application of one or more classification rules applied to one or more signals received from the one or more scanning inspection tools and populations of the one or more defect types for the one or more samples determined using the one or more high-resolution inspection tools.
摘要翻译：公开了用于监视时变分类性能的系统和方法。方法可以包括但不限于：从一个或多个扫描检查工具接收指示一个或多个样品的一个或多个特性的一个或多个信号; 根据一个或多个分类规则对从一个或多个扫描检查工具接收的一个或多个信号的应用来确定一个或多个样本的一个或多个缺陷类型的种群; 使用一个或多个高分辨率检查工具确定所述一个或多个样品的一种或多种缺陷类型的种群; 以及计算一个或多个缺陷类型的群体之间的一个或多个相关性，所述一个或多个缺陷类型的群体由应用于从所述一个或多个扫描检查工具和所述一个或多个扫描检查工具的群体接收到的一个或多个信号应用的一个或多个分类规则确定使用一个或多个高分辨率检查工具确定的一个或多个样品的缺陷类型。

7. 发明授权

US06758438B2 Jet engine suspension 有权
标题翻译：喷气发动机悬架
公开(公告)号：US06758438B2
公开(公告)日：2004-07-06
申请号：US10263736
申请日：2002-10-04
申请人： François Brefort , Patrick Huet , Félix Pasquer
发明人： François Brefort , Patrick Huet , Félix Pasquer
IPC分类号： B64D2700
CPC分类号： B64D27/26 , B64D2027/266 , B64D2027/268
摘要： A jet engine suspension includes a master component for attachment, fixed to an aircraft pylon. In the event of breakage of the master component and in the situation where the fixing screws are no longer able to transmit force, a peg is provided which resists transmitted loads such that the master component collapses until an upper shoulder rests on the pylon and supports the master component. The peg is free of dynamic stress in normal service and there is absolutely no risk of it cracking in fatigue.
摘要翻译：喷气发动机悬架包括用于附接的主组件，固定到飞机塔架。在主元件断裂的情况下，并且在固定螺钉不再能够传递力的情况下，提供抵抗传递的负载的钉，使得主构件塌陷直到上肩部搁置在吊架上并支撑主组件。在正常服务中，钉子没有动态压力，绝对没有疲劳开裂的风险。

8. 发明授权

US08537349B2 Monitoring of time-varying defect classification performance 有权
标题翻译：监测时变缺陷分类性能
公开(公告)号：US08537349B2
公开(公告)日：2013-09-17
申请号：US12811319
申请日：2010-06-23
申请人： Patrick Huet , Brian Duffy , Martin Plihal , Thomas Trautzsch , Chris Maher
发明人： Patrick Huet , Brian Duffy , Martin Plihal , Thomas Trautzsch , Chris Maher
IPC分类号： G01N21/00
CPC分类号： G01R31/2656 , G01R31/2894 , G05B19/41875 , G05B2219/37224 , H01L22/12 , H01L22/20 , H01L2924/0002 , Y02P90/22 , H01L2924/00
摘要： Systems and methods for monitoring time-varying classification performance are disclosed. A method may include, but is not limited to: receiving one or more signals indicative of one or more properties of one or more samples from one or more scanning inspection tools; determining populations of one or more defect types for the one or more samples according an application of one or more classification rules to the one or more signals received from the one or more scanning inspection tools; determining populations of the one or more defect types for the one or more samples using one or more high-resolution inspection tools; and computing one or more correlations between populations of one or more defect types for one or more samples determined from application of one or more classification rules applied to one or more signals received from the one or more scanning inspection tools and populations of the one or more defect types for the one or more samples determined using the one or more high-resolution inspection tools.
摘要翻译：公开了用于监视时变分类性能的系统和方法。方法可以包括但不限于：从一个或多个扫描检查工具接收指示一个或多个样品的一个或多个特性的一个或多个信号; 根据一个或多个分类规则对从一个或多个扫描检查工具接收的一个或多个信号的应用来确定一个或多个样本的一个或多个缺陷类型的种群; 使用一个或多个高分辨率检查工具确定所述一个或多个样品的一种或多种缺陷类型的种群; 以及计算一个或多个缺陷类型的群体之间的一个或多个相关性，所述一个或多个缺陷类型的群体由应用于从所述一个或多个扫描检查工具和所述一个或多个扫描检查工具的群体接收到的一个或多个信号应用的一个或多个分类规则确定使用一个或多个高分辨率检查工具确定的一个或多个样品的缺陷类型。

9. 发明授权

US07417724B1 Wafer inspection systems and methods for analyzing inspection data 有权
标题翻译：晶圆检查系统和检验数据分析方法
公开(公告)号：US07417724B1
公开(公告)日：2008-08-26
申请号：US11746884
申请日：2007-05-10
申请人： Paul Sullivan , George Kren , Eliezer Rosengaus , Patrick Huet , Robinson Piramuthu , Martin Plihal , Yan Xiong
发明人： Paul Sullivan , George Kren , Eliezer Rosengaus , Patrick Huet , Robinson Piramuthu , Martin Plihal , Yan Xiong
IPC分类号： G01N21/88 , G06K9/00
CPC分类号： G01N21/9501 , G01N21/9503 , H01L21/67005 , H01L21/67288
摘要： Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.
摘要翻译：提供晶圆检查系统和方法。一个检查系统包括通过晶片处理器耦合到主机检查系统的模块测量单元。模块测量单元被配置为在主机检查系统检查晶片之前使用一种或多种模式来检查晶片。一种或多种模式包括后侧检查，边缘检查，前侧宏观缺陷检查或其组合。另一种检查系统包括以多个视角布置的两个或多个低分辨率电子传感器。传感器被配置为基本上同时检测从晶片返回的光。用于分析检查数据的方法包括在检查晶片的背面之前选择与支撑装置相对应的模板，所述支撑装置接触晶片的背面。该方法还包括从通过检查晶片的背面产生的检查数据中减去表示模板的数据。

10. 发明授权

US07227628B1 Wafer inspection systems and methods for analyzing inspection data 有权
标题翻译：晶圆检查系统和检验数据分析方法
公开(公告)号：US07227628B1
公开(公告)日：2007-06-05
申请号：US10964585
申请日：2004-10-12
申请人： Paul Sullivan , George Kren , Eliezer Rosengaus , Patrick Huet , Robinson Piramuthu , Martin Plihal , Yan Xiong
发明人： Paul Sullivan , George Kren , Eliezer Rosengaus , Patrick Huet , Robinson Piramuthu , Martin Plihal , Yan Xiong
IPC分类号： G01N21/88 , G06K9/00
CPC分类号： G01N21/9501 , G01N21/9503 , H01L21/67005 , H01L21/67288
摘要： Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.
摘要翻译：提供晶圆检查系统和方法。一个检查系统包括通过晶片处理器耦合到主机检查系统的模块测量单元。模块测量单元被配置为在主机检查系统检查晶片之前使用一种或多种模式来检查晶片。一种或多种模式包括后侧检查，边缘检查，前侧宏观缺陷检查或其组合。另一种检查系统包括以多个视角布置的两个或多个低分辨率电子传感器。传感器被配置为基本上同时检测从晶片返回的光。用于分析检查数据的方法包括在检查晶片的背面之前选择与支撑装置相对应的模板，所述支撑装置接触晶片的背面。该方法还包括从通过检查晶片的背面产生的检查数据中减去表示模板的数据。

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