专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2013181109A Tacky adhesive sheet 有权
标题翻译： TACKY粘合片
公开(公告)号：JP2013181109A
公开(公告)日：2013-09-12
申请号：JP2012046107
申请日：2012-03-02
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAKAHASHI TOMOKAZU , MORITA MIKI , KAMEI KATSUTOSHI , HABU TSUYOSHI , HONDA TETSUJI , ASAI FUMITERU
IPC分类号： C09J7/02 , C09J123/00 , C09J123/12 , C09J123/14 , C09J123/20 , C09J201/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a tacky adhesive sheet retaining sufficient tacky adhesive power, and excellent in handleability after peeling a separator such as paper passability.SOLUTION: A tacky adhesive sheet is provided with a substrate layer and a tacky adhesive layer, where the ball number is 2 or less in the ball tack test of the tacky adhesive layer, and adhesive power to a silicon mirror wafer is 0.3 N/20 mm or greater. By using such tacky adhesive sheet, a tacky adhesive sheet satisfying both sufficient tacky adhesive power as the tacky adhesive sheet and handleability after peeling a separator such as paper passability can be obtained.
摘要翻译：要解决的问题：提供一种保持足够的粘性粘合力的粘性粘合片，并且在剥离诸如纸张通过性的隔膜之后的可操作性优异。解决方案：粘性粘合片设置有基底层和粘性层，其中在粘性层的球粘性试验中球数为2以下，硅镜片的粘合力为0.3N / 20mm以上。通过使用这样的粘性粘合片，可以获得满足粘性粘合剂的粘合力的粘性粘合片和剥离纸等通过性的剥离剂之后的处理性。

2. 发明专利

JP2013163775A Adhesive tape 审中-公开
标题翻译：胶粘带
公开(公告)号：JP2013163775A
公开(公告)日：2013-08-22
申请号：JP2012028150
申请日：2012-02-13
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HABU TSUYOSHI , KAMEI KATSUTOSHI , IKUSHIMA NOBUSUKE , ASAI FUMITERU
IPC分类号： C09J7/02 , C09J123/18
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape excellent in balance of adhesive force with peelability and level difference followability, and manufacturable by co-extrusion molding.SOLUTION: An adhesive tape is provided with an adhesive layer composed of a resin composition including an amorphous propylene-(1-butene) copolymer. When the adhesive tape is applied to an adherend having a step of 30 μm, the tape has ≤650 μm of the width of a portion at which the adhesive tape and the adherend do not contact by floating-up of the tape at the vicinity of a step lower portion, and an adhesive force of the tape adhering to a mirror wafer of a silicon-made semiconductor measured by a method based on JIS Z 0237(2000) (sticking condition of one reciprocating by 2-kg roller, peeling rate of 300 mm/min, and peeling angle of 180°) is ≤2.0 N/20 mm.
摘要翻译：要解决的问题：提供粘合力与剥离性和水平差跟随性的平衡优异的粘合带，并且可通过共挤出成型制造。粘合带设置有由包含非晶形的丙烯 - （1-丁烯）共聚物。当将粘合带施加到具有30μm的台阶的被粘物上时，胶带的宽度不小于带宽和被粘物不接触的部分的宽度，通过基于JIS Z 0237（2000）的方法（通过2kg辊的一次往复运动的粘附条件）测量的粘合到硅制半导体的镜面晶片的带的粘合力，剥离速度 300mm / min，剥离角度180°）≤2.0N/ 20mm。

3. 发明专利

JP2012052037A Viscoelastic body and method for producing the same 有权
标题翻译：粘弹体及其制造方法
公开(公告)号：JP2012052037A
公开(公告)日：2012-03-15
申请号：JP2010196250
申请日：2010-09-01
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HABU TSUYOSHI , ASAI FUMITERU , TAKAHASHI TOMOKAZU , IMOTO EIICHI , SHIMAZAKI YUTA
IPC分类号： C08F290/06 , H01L21/304
CPC分类号： C08F299/065 , C08G18/672 , C08G18/753 , C08G2170/40 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , C08G18/48
摘要： PROBLEM TO BE SOLVED: To provide a resin material usable for a pressure-sensitive adhesive sheet for semiconductor wafer protection which, even when a semiconductor wafer is ground to an ultrathin thickness or a large diameter wafer is ground, does not cause bending (warpage) to the semiconductor wafer, has excellent followability to a pattern, avoids lifting from the pattern with time, ensures good stress dispersibility in grinding, suppresses wafer cracking and wafer edge chipping, avoids delamination in peeling, and leaves no adhesive residue on a wafer surface.SOLUTION: A viscoelastic body is provided containing a urethane polymer/acrylic polymer copolymer obtained through a monomer having in one molecule a functional group formable of a urethane bond with a urethane polymer and an activated carbon-carbon double bond copolymerizzble with a (meth)acryloyl group.
摘要翻译：要解决的问题：为了提供可用于半导体晶片保护用粘合片的树脂材料，即使将半导体晶片研磨成超薄厚度或大直径晶片，也不会引起弯曲（翘曲）到半导体晶片，具有优异的图案追随性，避免随着时间的推移而从图案中脱离，确保研磨中的良好的应力分散性，抑制晶片裂纹和晶片边缘碎裂，避免剥离时的剥离，并且不会在晶圆表面。解决方案：提供一种粘弹性体，其含有通过具有一分子的单体获得的氨基甲酸酯聚合物/丙烯酸类聚合物共聚物，其具有与氨基甲酸酯聚合物形成的氨基甲酸酯键的官能团和与（氨基甲酸酯聚合物）的活性炭 - 碳双键共聚，甲基）丙烯酰基。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2010053346A Re-releasable adhesive and re-releasable adhesive sheet 审中-公开
标题翻译：可再发胶粘和可再发胶粘片
公开(公告)号：JP2010053346A
公开(公告)日：2010-03-11
申请号：JP2009153890
申请日：2009-06-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HABU TSUYOSHI , TAKAHASHI TOMOKAZU , ASAI FUMITERU , HIRAYAMA TAKAMASA
IPC分类号： C09J4/00 , C09J7/02
CPC分类号： C09J133/066 , C08L2312/06 , Y10T428/2809
摘要： PROBLEM TO BE SOLVED: To provide a re-releasable adhesive, in which the adhesiveness can be sufficiently reduced by curing reaction by radiation irradiation, and the reduction of the adhesiveness or the split of the adhesive, and, further, contamination of a semiconductor wafer and the like with liquid and so on can be inhibited as much as possible, by reducing the liquid immersion properties. SOLUTION: A re-releasable adhesive includes a radiation reactive polymer and a radiation polymerization initiator, in which the radiation reactive polymer having a side chain originated from one or more monomers represented by CH 2 =CR 1 COOR 2 (wherein R 1 represents a hydrogen atom or a methyl group, R 2 represents an alkyl group having 6 or more carbon atoms) and a side chain having one carbon-to-carbon double bond, and the monomers are polymerized in the ratio of 50 mol% of the total monomers constituting the main chain of the radiation reactive polymer. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种可再剥离的粘合剂，其中通过辐射照射固化反应可以充分降低粘合性，并且粘合性的降低或粘合剂的分裂，以及另外的污染可以通过降低液浸性而尽可能地抑制具有液体等的半导体晶片等。解决方案：可再剥离的粘合剂包括辐射反应性聚合物和辐射聚合引发剂，其中具有源自由CH 2 SBR = CR表示的一种或多种单体的侧链的辐射反应性聚合物其中R 1 代表氢原子或甲基，R SP 2表示烷基具有6个或更多个碳原子）和具有一个碳 - 碳双键的侧链，并且单体以构成辐射反应性聚合物的主链的总单体的50摩尔％的比例聚合。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2014189015A Soft magnetism thermosetting adhesive film, magnetic film laminate circuit substrate and position detection device 有权
标题翻译：软磁性热固性胶带，磁性膜层状电路基板和位置检测装置
公开(公告)号：JP2014189015A
公开(公告)日：2014-10-06
申请号：JP2013069684
申请日：2013-03-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： EBE HIROSHI , HABU TSUYOSHI
IPC分类号： B32B27/00 , B32B27/18 , H01F1/26 , H01F1/375 , H05K1/02 , H05K1/03
CPC分类号： C09J7/0282 , B32B7/12 , B32B27/00 , B32B27/08 , B32B27/18 , B32B27/308 , B32B27/38 , B32B2307/208 , B32B2405/00 , B32B2457/08 , C08K3/08 , C08K2201/01 , C09J7/0278 , C09J7/245 , C09J7/25 , C09J7/35 , C09J9/00 , C09J133/00 , C09J163/00 , C09J165/02 , C09J2201/36 , C09J2203/326 , C09J2205/102 , C09J2433/00 , C09J2461/00 , C09J2463/00 , G01D5/20 , G06F3/046 , G06F2203/04103 , H01F1/26 , H01F1/37 , H05K1/0313 , H05K1/0373 , H05K3/281 , H05K2201/0195 , H05K2201/086
摘要： PROBLEM TO BE SOLVED: To provide a soft magnetism thermosetting adhesive film having excellent reflow resistance when adhered on a surface of a circuit board, and also to provide a magnetic film laminate circuit substrate and a position detection device achieved from the soft magnetism thermosetting adhesive film.SOLUTION: A soft magnetism thermosetting adhesive film 4 includes a magnetic layer 2 and a surface layer 1 laminated on one surface of the magnetic layer 2. The magnetic layer 2 is composed of a magnetic composition 12 including an acrylic resin, an epoxy resin, a phenolic resin, and soft magnetic particles 12. The surface layer 1 is composed of a surface layer composition 11 including an acrylic resin, an epoxy resin, and a phenolic resin, and substantially not including soft magnetic particles 14.
摘要翻译：要解决的问题：提供粘附在电路板的表面上时具有优异的耐回弹性的软磁性热固性粘合剂膜，并且还提供由软磁性热固性粘合剂膜实现的磁性膜层叠电路基板和位置检测装置解决方案：软磁性热固性粘合膜4包括层叠在磁性层2的一个表面上的磁性层2和表面层1.磁性层2由包含丙烯酸树脂，环氧树脂，酚醛树脂和软磁性颗粒12.表面层1由包括丙烯酸树脂，环氧树脂和酚醛树脂的表面层组合物11组成，并且基本上不包括软磁性颗粒14。

6. 发明专利

JP2014165363A Soft magnetic thermosetting adhesive film, soft magnetic film lamination circuit board and position detection device 有权
标题翻译：软磁热固化膜，软磁膜层压电路板及位置检测装置
公开(公告)号：JP2014165363A
公开(公告)日：2014-09-08
申请号：JP2013035700
申请日：2013-02-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HABU TSUYOSHI , EBE HIROSHI
IPC分类号： H01F1/28
CPC分类号： C09J11/04 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/308 , B32B27/38 , B32B27/42 , B32B2307/208 , B32B2307/306 , B32B2457/08 , C08K3/34 , C08L33/06 , C08L63/00 , C09J7/35 , C09J161/06 , C09J161/34 , G06F3/046 , H01F1/26 , H01F41/16
摘要： PROBLEM TO BE SOLVED: To provide a soft magnetic thermosetting adhesion film which is capable of embedding soft magnetic particles in a gap between circuit wires formed on a circuit board surface when affixed to the circuit board surface and improves reflow resistance, a soft magnetic film lamination circuit board employing the soft magnetic thermosetting adhesion film, and a position detection device.SOLUTION: A soft magnetic thermosetting adhesion film 2 is formed from a soft magnetic thermosetting composition containing soft magnetic particles 6, an acrylic resin, an epoxy resin, a phenol resin and a thermosetting catalyst. In the soft magnetic thermosetting composition, a total content of the epoxy resin and the phenol resin is equal to or more than 20 mass% and equal to or less than 99 mass% with respect to a soft magnetic particle excluded component, excluding the soft magnetic particles 6, in 100 mass%.
摘要翻译：要解决的问题：提供一种软磁性热固性粘合膜，其能够在固定到电路板表面上时在电路板表面上形成的电路布线之间的间隙中嵌入软磁性颗粒并提高耐回流性，软磁性层压使用软磁性热固性粘合膜的电路板和位置检测装置。解决方案：软磁性热固性粘合膜2由含有软磁性颗粒6，丙烯酸树脂，环氧树脂，酚醛树脂的软磁性热固性组合物形成和热固性催化剂。在软磁性热固性组合物中，环氧树脂和酚醛树脂的总含量相对于软磁性颗粒排除组分为20质量％以上且等于或小于99质量％，不包括软磁性颗粒6，100质量％。

7. 发明专利

JP2014164562A Magnetic circuit board, method for manufacturing the same, and position detection device 审中-公开
标题翻译：磁电路板及其制造方法及位置检测装置
公开(公告)号：JP2014164562A
公开(公告)日：2014-09-08
申请号：JP2013035701
申请日：2013-02-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： EBE HIROSHI , HABU TSUYOSHI
IPC分类号： G06F3/046 , G06F3/041
CPC分类号： G06F3/046 , C09D1/00 , G06F2203/04103 , H01F1/083 , H01F1/28 , H01F10/06 , H01F41/16
摘要： PROBLEM TO BE SOLVED: To provide a magnetic circuit board which can be reduced in size, a method for manufacturing the same, and a position detection device.SOLUTION: A magnetic circuit board 1 is provided with a double-side conductor pattern substrate 2, and a magnetic film 3 that is directly laminated on one face of the double-side conductor pattern substrate 2 and is formed from a magnetic composition comprising magnetic material particles and resin, wherein the magnetic flux generated in a circuit board part converges within a magnetic layer, in order to achieve efficient communication between an indicator and a loop coil.
摘要翻译：要解决的问题：提供可以减小尺寸的磁路板，其制造方法和位置检测装置。解决方案：磁路板1设置有双面导体图案基板2，以及直接层叠在双面导体图案基板2的一面上并由包含磁性材料颗粒和树脂的磁性组合物形成的磁性膜3，其中在电路板部分中产生的磁通在磁性层中收敛，以实现指示器和环形线圈之间的有效通信。

8. 发明专利

JP2013170197A Tacky adhesive tape 审中-公开
标题翻译： TACKY胶粘带
公开(公告)号：JP2013170197A
公开(公告)日：2013-09-02
申请号：JP2012033967
申请日：2012-02-20
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HABU TSUYOSHI , KAMEI KATSUTOSHI , IKUSHIMA NOBUSUKE , MIZUNO KOJI , ASAI FUMITERU
IPC分类号： C09J7/00 , C09J7/02 , C09J123/14
摘要： PROBLEM TO BE SOLVED: To provide a tacky adhesive tape which is used at a step of grinding the back surface of a semiconductor wafer and at a step of dicing the semiconductor wafer, has moderate tacky adhesive power and the tacky adhesive of which is prevented from being left over as residues when the tacky adhesive tape is peeled off.SOLUTION: The tacky adhesive tape includes a tacky adhesive layer, the storage modulus G' of which is 1-15 MPa at 23°C, the arithmetic surface roughness Ra of whose tacky adhesive surface side is 0-0.5 μm and which has ≤5 MPa-μm of the product obtained by multiplying the storage modulus G' thereof by the arithmetic surface roughness Ra thereof on the tacky adhesive surface side.
摘要翻译：要解决的问题：为了提供在半导体晶片的背面研磨的步骤中使用的粘性胶带，并且在切割半导体晶片的步骤中，具有适度的粘性粘合力，并且其粘合剂被防止当粘性胶带被剥离时作为残留物残留。解决方案：粘性胶带包括粘性粘合剂层，其储存模量G'在23℃为1-15MPa，其运算表面粗糙度Ra为粘合剂表面侧为0-0.5μm，并且通过将其储能模量G'乘以粘合剂表面侧的算术表面粗糙度Ra而获得的乘积≤5MPa-μm。

9. 发明专利

JP2013001738A Method for selecting separator and pressure-sensitive adhesive sheet using separator selected by the same 有权
标题翻译：使用其选择的分离器选择分离器和压敏粘合片的方法
公开(公告)号：JP2013001738A
公开(公告)日：2013-01-07
申请号：JP2011131911
申请日：2011-06-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KAMEI KATSUTOSHI , IKUSHIMA NOBUSUKE , HABU TSUYOSHI , ASAI FUMITERU
IPC分类号： C09J7/02 , B32B27/00 , C09J123/00 , C09J123/14
CPC分类号： C09J123/14 , B32B7/06 , B32B7/12 , B32B27/06 , B32B27/327 , B32B2307/748 , B32B2405/00 , C08L2207/14 , C08L2314/06 , C09J7/40 , C09J2423/00
摘要： PROBLEM TO BE SOLVED: To provide a method for simply selecting a separator suitable to a pressure-sensitive adhesive sheet.SOLUTION: The method includes: a step which attaches a material for forming at least a pressure-sensitive adhesive layer to the separator in a state in which the material is melted, and obtains the pressure-sensitive adhesive sheet having at least a pressure-sensitive adhesive layer and the separator; a step which separates the separator from the obtained pressure-sensitive adhesive sheet and fabricates an evaluation pressure-sensitive adhesive sheet by sticking the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet and an evaluation separator, and a step which sandwiches the evaluation pressure-sensitive adhesive sheet by a pair of cushion materials and a pair of press plates, and after maintaining it for 1 min. at a press plate surface temperature of 140°C and a pressure of 5 MPa, evaluates the peel force of the evaluation separator by a 180° peeling test at a peeling speed of 300 mm/min.
摘要翻译：要解决的问题：提供一种简单地选择适合于压敏粘合片的隔膜的方法。解决方案：该方法包括：在材料熔融的状态下，将至少形成至少粘合剂层的材料附着到隔板的步骤，并获得至少具有粘合剂层的粘合片压敏粘合剂层和隔膜; 将分离器与所得压敏粘合片分隔开的步骤，通过粘贴压敏粘合片和评价用隔膜的粘合剂层来制造评价用粘合片，以及将评价压敏粘合片由一对缓冲材料和一对压板组成，并保持1分钟。在压板表面温度为140℃，压力为5MPa的条件下，以剥离速度为300mm / min的180°剥离试验评价评价用隔膜的剥离力。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2012193295A Adhesive tape 有权
标题翻译：胶粘带
公开(公告)号：JP2012193295A
公开(公告)日：2012-10-11
申请号：JP2011058944
申请日：2011-03-17
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SASAKI TAKATOSHI , HABU TSUYOSHI , IKUSHIMA NOBUSUKE , KAMEI KATSUTOSHI , ASAI FUMITERU
IPC分类号： C09J7/02 , C08F210/08 , C09J123/14 , C09J201/00
CPC分类号： C09J123/14 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2423/00 , H01L21/6836 , H01L2221/68327 , H01L2221/6834
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape having a step following property capable of sufficiently filling a concavo-convex pattern of an adherend and capable of maintaining the sufficiently filling state in the concavo-convex pattern with lapse of time.SOLUTION: The adhesive tape includes an adhesive layer and a substrate layer 20, in which the adhesive layer 10 shows a storage elastic modulus of 0.5×10to 1.0×10Pa at 20°C and a loss tangent tanδ of 0.1 or more at 20 to 80°C. Further, the adhesive layer contains an amorphous propylene-(1-butene) copolymer polymerized by using a metallocene catalyst. The weight average molecular weight (Mw) of the propylene-(1-butene) copolymer is 200,000 or more, and a molecular weight distribution (Mw/Mn) of the propylene-(1-butene) copolymer is 2 or less.
摘要翻译：解决的问题：提供一种能够充分填充被粘物的凹凸图案并且能够随着时间的过去保持凹凸图案中的充分填充状态的具有以下特性的粘合带。粘合剂层包括粘合剂层和基材层20，其中粘合剂层10的储能弹性模量为0.5×10 6 至1.0×10 在20℃下的 8℃，在20〜80℃下的损耗角正切tanδ为0.1以上。此外，粘合剂层含有通过使用金属茂催化剂聚合的无定形丙烯 - （1-丁烯）共聚物。丙烯 - （1-丁烯）共聚物的重均分子量（Mw）为20万以上，丙烯 - （1-丁烯）共聚物的分子量分布（Mw / Mn）为2以下。版权所有（C）2013，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式