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1. 发明专利

JP2013219371A Film for flip-chip type semiconductor rear face, and use thereof 有权
标题翻译：片状薄膜型半导体后面膜的使用及其使用
公开(公告)号：JP2013219371A
公开(公告)日：2013-10-24
申请号：JP2013109200
申请日：2013-05-23
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAKAMOTO HISAHIDE , SHIGA GOSHI , ASAI FUMITERU
IPC分类号： H01L21/301 , H01L21/60 , H01L23/00
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a film for a flip-chip type semiconductor rear face, capable of preventing formation of a stain even when flux adheres to the film, and manufacturing a semiconductor device excellent in appearance characteristics.SOLUTION: A film for a flip-chip type semiconductor rear face is arranged on a rear face of a semiconductor element flip-chip connected on adherend, and comprises an adhesive layer and a protective layer laminated on the adhesive layer. In the film for the flip-chip type semiconductor rear face, the protective layer comprises heat resistant resin having glass transition temperature of 200°C or more or metal.
摘要翻译：要解决的问题：为了提供一种用于倒装芯片型半导体后表面的膜，即使当焊剂粘附到膜上时也能防止污渍形成，并且制造出具有优异外观特性的半导体器件。解决方案：倒装芯片型半导体后表面设置在连接在被粘物上的半导体元件倒装芯片的背面，并且包括粘合剂层和层压在粘合剂层上的保护层。在用于倒装芯片型半导体后表面的膜中，保护层包括玻璃化转变温度为200℃以上或金属的耐热性树脂。

2. 发明专利

JP2013163774A Adhesive tape 审中-公开
标题翻译：胶粘带
公开(公告)号：JP2013163774A
公开(公告)日：2013-08-22
申请号：JP2012028149
申请日：2012-02-13
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HABU TSUYOSHI , KAMEI KATSUTOSHI , IKUSHIMA NOBUSUKE , ASAI FUMITERU
IPC分类号： C09J7/00 , C09J7/02 , C09J123/18
摘要： PROBLEM TO BE SOLVED: To provide an adhesive tape excellent in balance of adhesive force with peelability and level difference followability, and manufacturable by co-extrusion molding.SOLUTION: An adhesive tape is provided with an adhesive layer formed of a resin composition including an amorphous propylene-(1-butene) copolymer, and the total content rate of a unit derived from 1-butene in the resin composition is ≥5 wt.% based on the total weight of resins in the composition. In a preferable embodiment, the resin composition includes the amorphous propylene-(1-butene) copolymer and a crystalline resin which is a crystalline propylene-(1-butene) copolymer and/or crystalline ethylene-(1-butene) copolymer.
摘要翻译：要解决的问题：提供粘合力与剥离性和水平差跟随性的平衡优异的粘合带，并且可以通过共挤出成型制造。粘合带设置有由包含非晶形物质的树脂组合物形成的粘合层丙烯 - （1-丁烯）共聚物，并且在树脂组合物中由1-丁烯衍生的单元的总含量比基于组合物中树脂的总重量≥5重量％。在优选的实施方案中，树脂组合物包括无定形丙烯 - （1-丁烯）共聚物和结晶性丙烯 - （1-丁烯）共聚物和/或结晶乙烯 - （1-丁烯）共聚物的结晶树脂。

3. 发明专利

JP2013100415A Adhesive sheet with separator 有权
标题翻译：粘合片与分离器
公开(公告)号：JP2013100415A
公开(公告)日：2013-05-23
申请号：JP2011245245
申请日：2011-11-09
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KAMEI KATSUTOSHI , IKUSHIMA NOBUSUKE , HABU TSUYOSHI , ASAI FUMITERU
IPC分类号： C09J7/02 , B32B27/00 , C09J123/00 , C09J123/14 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet with separator, which has excellent handleability and in which a proper adhesive force can be retained even after the separator is removed.SOLUTION: An adhesive sheet with separator sequentially includes a base material layer, an adhesive layer, and the separator. The adhesive sheet can be obtained by: coextruding a material forming the adhesive layer and a material forming the base material layer; and bonding the adhesive layer with the separator in a state that at least the material forming the adhesive layer thus coextruded is fused. The separator contains a removing agent layer, wherein the content ratio of a polyfunctional silicone in a silicone contained in the removing agent layer is 10% or larger.
摘要翻译：要解决的问题：提供具有优异的可操作性的隔膜的粘合片，并且即使在除去隔板之后也能够保持适当的粘合力。解决方案：具有分离器的粘合片依次包括基材层，粘合剂层和隔膜。粘合片可以通过以下方式获得：共挤出形成粘合剂层的材料和形成基材层的材料; 并且将粘合剂层与分离器粘合在至少形成由此共挤出的粘合剂层的材料融合的状态。分离器含有去除剂层，其中除去剂层中所含的硅氧烷中的多官能硅酮的含量比为10％以上。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2012033636A Thermal peeling sheet integrated film for semiconductor rear face, method of collecting semiconductor element, and method of manufacturing semiconductor device 有权
标题翻译：用于半导体后面的热剥离片集成膜，半导体元件的收集方法和制造半导体器件的方法
公开(公告)号：JP2012033636A
公开(公告)日：2012-02-16
申请号：JP2010170919
申请日：2010-07-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAKAMOTO HISAHIDE , SHIGA GOSHI , ASAI FUMITERU
IPC分类号： H01L21/301 , H01L23/00
CPC分类号： C09J5/06 , C09J7/22 , C09J7/29 , C09J7/38 , C09J2201/36 , C09J2203/326 , C09J2205/102 , C09J2205/11 , C09J2205/302 , H01L21/563 , H01L21/6836 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2221/68327 , H01L2221/68381 , H01L2223/54433 , H01L2223/54486 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16238 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81911 , H01L2224/83104 , H01L2924/10253 , Y10T428/25 , Y10T428/31504 , H01L2924/00014 , H01L2924/01082 , H01L2924/0103 , H01L2924/01083 , H01L2924/00012 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a thermal peeling sheet integrated film for a semiconductor rear face which can easily be peeled off in picking up a semiconductor element in a manner integrated with a film for the semiconductor rear face, thereby improving a yield and a manufacturing effect.SOLUTION: A thermal peeling sheet integrated film for a semiconductor rear face includes: an adhesive sheet having a base material layer and an adhesive layer; and a film for the semiconductor rear face that is formed on the adhesive layer of the adhesive sheet. The adhesive sheet is a thermal peeling type adhesive sheet whose adhesive force with the film for the semiconductor rear face is decreased by heating.
摘要翻译：要解决的问题：提供一种用于半导体后表面的热剥离片一体膜，其可以以与用于半导体后面的膜一体化的方式拾取半导体元件而容易地剥离，从而提高产率和制造效果。解决方案：一种用于半导体后表面的热剥离片一体膜包括：具有基材层和粘合剂层的粘合片; 以及形成在粘合片的粘合剂层上的用于半导体后表面的膜。粘合片是与半导体背面的膜的粘合力通过加热而降低的热剥离型粘合片。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012033557A Film for manufacturing semiconductor device, method of manufacturing film for manufacturing semiconductor device, and method of manufacturing semiconductor device 有权
标题翻译：用于制造半导体器件的膜，制造半导体器件的膜的制造方法和制造半导体器件的方法
公开(公告)号：JP2012033557A
公开(公告)日：2012-02-16
申请号：JP2010169556
申请日：2010-07-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAKAMOTO HISAHIDE , SHIGA GOSHI , ASAI FUMITERU
IPC分类号： H01L23/00 , C09J7/02 , H01L21/301
CPC分类号： H01L21/6836 , B32B37/1284 , B32B38/0004 , B32B38/10 , B32B2405/00 , B32B2457/14 , C09J7/02 , C09J7/20 , C09J165/00 , C09J2201/606 , C09J2203/326 , C09J2461/00 , C09J2463/00 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L23/293 , H01L23/3114 , H01L23/3164 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2221/68336 , H01L2221/68377 , H01L2221/68381 , H01L2221/68386 , H01L2223/54406 , H01L2223/5442 , H01L2223/5448 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/27003 , H01L2224/27436 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/73204 , H01L2224/81095 , H01L2224/81191 , H01L2224/81815 , H01L2224/8191 , H01L2224/83191 , H01L2224/8385 , H01L2224/92 , H01L2224/92125 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , Y10T156/1052 , Y10T156/1064 , Y10T156/1075 , Y10T156/1077 , Y10T156/1082 , Y10T156/1093 , Y10T428/1471 , Y10T428/1476 , Y10T428/1495 , Y10T428/15 , Y10T428/21 , H01L21/78 , H01L2224/83 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/01083 , H01L2224/13099
摘要： PROBLEM TO BE SOLVED: To provide a film for manufacturing a semiconductor device that allows an adhesive-layer-laminated dicing tape to be favorably removed from a separator, the adhesive-layer-laminated dicing tape being laminated on the separator at a predetermined interval.SOLUTION: The film for manufacturing a semiconductor device includes the adhesive-layer-laminated dicing tape, in which an adhesive layer is laminated on a dicing tape. The adhesive-layer-laminated dicing tape is laminated on the separator with the adhesive layer as an attached face at the predetermined interval. The separator has a notch along the circumference of the dicing tape. The depth of the notch is equal to or less than 2/3 of a thickness of the separator.
摘要翻译：要解决的问题：为了提供一种用于制造半导体器件的膜，其允许将粘合剂层层叠的切割带从隔膜中有利地移除，粘合层层叠的切割带被层压在隔膜上预定间隔。解决方案：用于制造半导体器件的膜包括其中粘合剂层层压在切割带上的粘合层层叠的切割带。粘合层层叠的切割带以预定间隔以粘合剂层作为附着层压在隔膜上。分离器沿着切割带的圆周具有凹口。切口的深度等于或小于隔板厚度的2/3。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012033555A Film for flip-chip type semiconductor rear face 有权
标题翻译：片状薄膜型半导体后面膜
公开(公告)号：JP2012033555A
公开(公告)日：2012-02-16
申请号：JP2010169551
申请日：2010-07-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIGA GOSHI , TAKAMOTO HISAHIDE , ASAI FUMITERU
IPC分类号： H01L21/52 , C08J5/18 , H01L21/301
CPC分类号： H01L23/3164 , C09J163/00 , H01L21/561 , H01L21/6836 , H01L23/3114 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L2221/68327 , H01L2221/68377 , H01L2221/68386 , H01L2223/54433 , H01L2223/54473 , H01L2224/13099 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/73204 , H01L2224/81815 , H01L2224/8191 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01073 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/3511 , Y10T428/28 , H01L2924/00014 , H01L2924/01083 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a film for a flip-chip type semiconductor rear face capable of suppressing or preventing generation of warpage in a semiconductor element that is flip-chip bonded onto an adherend, and to provide a film for a dicing tape integrated semiconductor rear face having the same.SOLUTION: A film 2 for a flip-chip type semiconductor rear face is formed on a rear face of a semiconductor element that is flip-chip bonded onto an adherend. A tensile storage elastic modulus at a temperature of 25°C after thermal hardening is in a range of 10 to 30 GPa, which is 4 to 20 times wider than a tensile storage elastic modulus at a temperature of 25°C before thermal hardening.
摘要翻译：解决的问题：为了提供一种倒装芯片型半导体后表面的膜，其能够抑制或防止将倒装芯片粘合到被粘物上的半导体元件中产生翘曲，并提供用于切割带集成半导体后表面具有相同的功能。解决方案：用于倒装芯片型半导体后表面的膜2形成在倒装芯片粘合到被粘物上的半导体元件的背面上。加热硬化后的25℃温度下的拉伸储存弹性模量为10〜30GPa的范围，比热固化前的25℃的拉伸储能弹性模量宽4〜20倍。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011228450A Dicing tape-integrated film for semiconductor back surface 有权
标题翻译：用于半导体背面的双面胶带
公开(公告)号：JP2011228450A
公开(公告)日：2011-11-10
申请号：JP2010096295
申请日：2010-04-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TAKAMOTO HISAHIDE , SHIGA GOSHI , ASAI FUMITERU , SUGIMURA TOSHIMASA
IPC分类号： H01L21/301 , H01L21/60
CPC分类号： H01L21/6836 , C09J7/0246 , C09J7/22 , C09J7/38 , C09J2203/326 , C09J2205/31 , H01L21/78 , H01L23/544 , H01L24/16 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2221/68381 , H01L2223/54486 , H01L2224/16225 , H01L2924/12042 , Y10T428/1467 , Y10T428/1471 , Y10T428/28 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a dicing tape-integrated film for a semiconductor back surface, the film which keeps a good detachability when a semiconductor element is picked up, prevents generation of chip scattering and chipping of the semiconductor element when dicing a semiconductor wafer, and prevents cutting water used in dicing from intruding between an adhesive layer and a flip-chip film used for a semiconductor back surface when dicing the semiconductor wafer, and to provide method for producing a semiconductor device.SOLUTION: The dicing tape-integrated film for a semiconductor back surface according to the present invention comprises: a flip-chip film for a semiconductor back surface, the film flip-chip-connected onto the adhered body and used for protecting the back surface of a semiconductor element; and a dicing tape. The dicing tape has a structure in which at least a sticker layer is provided on a base member, and the flip-chip type film for the semiconductor back surface is provided on the adhesive layer. The sticker layer is a radiation curable type which decreases the adhesive force to the flip-chip film for the semiconductor back surface through irradiation with radiation.
摘要翻译：要解决的问题：为了提供用于半导体背表面的切割带集成膜，当拾取半导体元件时保持良好的可拆卸性的膜防止当切割时产生半导体元件的芯片散射和碎裂半导体晶片，并且当切割半导体晶片时，防止切割中使用的切割水侵入用于半导体背表面的粘合剂层和倒装芯片膜之间，并且提供半导体器件的制造方法。解决方案：根据本发明的用于半导体背表面的切割带集成膜包括：用于半导体背表面的倒装芯片膜，将倒装芯片连接到粘附体上并用于保护半导体元件的背面; 和切割胶带。切割胶带具有至少在基材上设置粘合剂层的结构，并且在粘合剂层上设置用于半导体背面的倒装芯片型膜。贴纸层是可辐射固化型，其通过辐射照射降低了半导体背表面的倒装芯片膜的粘合力。版权所有（C）2012，JPO＆INPIT

8. 发明专利

JP2009135124A Adhesive sheet for dicing 审中-公开
标题翻译：胶粘片
公开(公告)号：JP2009135124A
公开(公告)日：2009-06-18
申请号：JP2007295526
申请日：2007-11-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TERADA YOSHIO , HASHIMOTO HIROKUNI , ASAI FUMITERU
IPC分类号： H01L21/301 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for dicing, which enables an inspection for electrical conduction to be performed even when the adhesive sheet is bonded to a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer, and also which makes it possible to prevent deformation (warping) or breakage of the semiconductor wafer or the occurrence of cracks or scratches on the back surface of the semiconductor wafer during the inspection, and to provide a manufacturing method of a semiconductor device using the same.
SOLUTION: The adhesive sheet for dicing is provided wherein an adhesive layer 3 is formed on a base film 1. The adhesive sheet is characterized in that the base film 1 is composed of conductive fibers 5 and a part of the conductive fibers 5 are exposed on a surface of the adhesive layer 3 to form a path for electrical conduction between the surface of the adhesive layer 3 and the base film 1.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于切割的粘合片，即使当粘合片粘合到通过切割半导体晶片而获得的半导体晶片或半导体芯片时，也能够进行导电检查，并且还这使得可以在检查期间防止半导体晶片的变形（翘曲）或破裂或半导体晶片的背面上出现裂纹或划痕，并提供使用该半导体晶片的半导体器件的制造方法。＆lt; P＆gt;解决方案：提供了一种用于切割的粘合片，其中在基膜1上形成粘合剂层3.该粘合片的特征在于，基膜1由导电纤维5和导电纤维5的一部分暴露在粘合剂层3的表面上以形成粘合剂层3的表面和基膜1之间的导电路径。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008117943A Adhesive sheet for water jet laser dicing 审中-公开
公开(公告)号：JP2008117943A
公开(公告)日：2008-05-22
申请号：JP2006299859
申请日：2006-11-06
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ASAI FUMITERU , SASAKI TAKATOSHI , MIKI TASUKU , TAKAHASHI TOMOKAZU , SHINTANI TOSHIAKI , YAMAMOTO AKIYOSHI
IPC分类号： H01L21/301 , C09J7/02 , C09J201/00
CPC分类号： H01L21/6836 , B23K26/146 , B23K26/40 , B23K2203/50 , C09J7/21 , C09J2203/326 , H01L21/78 , H01L2221/68327 , Y10T428/249962
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of machining extremely thin semiconductor wafers or materials without any defects, such as a chipping occurring when separating a chip, an IC component, or the like, by improving and stabilizing permeability in liquid caused by a liquid flow in water jet laser dicing.
SOLUTION: In the adhesive sheet for water jet laser dicing, an adhesive layer is laminated on a base material film made of mesh formed by fiber.
COPYRIGHT: (C)2008,JPO&INPIT

10. 发明专利

JP2008085303A Adhesive sheet for water jet laser dicing 审中-公开
标题翻译：水喷射激光胶粘剂表
公开(公告)号：JP2008085303A
公开(公告)日：2008-04-10
申请号：JP2007187968
申请日：2007-07-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SASAKI TAKATOSHI , MIKI TASUKU , ASAI FUMITERU , TAKAHASHI TOMOKAZU , SHINTANI TOSHIAKI , YAMAMOTO AKIYOSHI
IPC分类号： H01L21/301 , C09J7/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for achieving the working of an extremely thin semiconductor wafer or materials by securing the satisfactory adhesion of a wafer or the like in dicing, and preventing a chip or component from being peeled from an adhesive tape, and preventing the generation of such a failure as chip in the case of peeling the chip or IC component or the like after dicing under such circumstances that critical significance to the adhesive force of the adhesive sheet for dicing changes according to the change of the dicing technology of the semiconductor wafer or the like. SOLUTION: An adhesive sheet for water jet laser dicing is configured by laminating an adhesive layer on a base film, wherein the adhesive constituting the adhesive layer is an energy radiation curing type adhesive, and the adhesive sheet has adhesive strength of at least 1.5 N/20 mm. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于通过确保切片中的晶片等的令人满意的粘合力来实现极薄的半导体晶片或材料的加工的粘合片，并且防止芯片或部件从在这样的情况下，在切割后的芯片或IC部件等的剥离的情况下，防止在切割粘合片的粘合力的关键意义上根据变化而发生对切割的粘合剂的粘合力的影响，半导体晶片等的切割技术。解决方案：用于水喷射激光切割的粘合片通过在基膜上层压粘合剂层而构成，其中构成粘合剂层的粘合剂是能量辐射固化型粘合剂，并且粘合片具有至少的粘合强度 1.5 N / 20 mm。版权所有（C）2008，JPO＆INPIT

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