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1. 发明专利

JP2013170197A Tacky adhesive tape 审中-公开
标题翻译： TACKY胶粘带
公开(公告)号：JP2013170197A
公开(公告)日：2013-09-02
申请号：JP2012033967
申请日：2012-02-20
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HABU TSUYOSHI , KAMEI KATSUTOSHI , IKUSHIMA NOBUSUKE , MIZUNO KOJI , ASAI FUMITERU
IPC分类号： C09J7/00 , C09J7/02 , C09J123/14
摘要： PROBLEM TO BE SOLVED: To provide a tacky adhesive tape which is used at a step of grinding the back surface of a semiconductor wafer and at a step of dicing the semiconductor wafer, has moderate tacky adhesive power and the tacky adhesive of which is prevented from being left over as residues when the tacky adhesive tape is peeled off.SOLUTION: The tacky adhesive tape includes a tacky adhesive layer, the storage modulus G' of which is 1-15 MPa at 23°C, the arithmetic surface roughness Ra of whose tacky adhesive surface side is 0-0.5 μm and which has ≤5 MPa-μm of the product obtained by multiplying the storage modulus G' thereof by the arithmetic surface roughness Ra thereof on the tacky adhesive surface side.
摘要翻译：要解决的问题：为了提供在半导体晶片的背面研磨的步骤中使用的粘性胶带，并且在切割半导体晶片的步骤中，具有适度的粘性粘合力，并且其粘合剂被防止当粘性胶带被剥离时作为残留物残留。解决方案：粘性胶带包括粘性粘合剂层，其储存模量G'在23℃为1-15MPa，其运算表面粗糙度Ra为粘合剂表面侧为0-0.5μm，并且通过将其储能模量G'乘以粘合剂表面侧的算术表面粗糙度Ra而获得的乘积≤5MPa-μm。

2. 发明专利

JP2013123002A Laminated sheet and method for manufacturing semiconductor device using laminated sheet 有权
公开(公告)号：JP2013123002A
公开(公告)日：2013-06-20
申请号：JP2011271279
申请日：2011-12-12
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： CHITOSE HIROYUKI , TANAKA SHUNPEI , MIZUNO KOJI
IPC分类号： H01L21/304 , C09J7/02 , C09J201/00 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a laminated sheet which can prevent a decrease in adhesive force and electrical reliability of a resin composition layer, and in which back grind tapes can be stripped from a plurality of semiconductor devices in block after dicing.SOLUTION: A laminated sheet comprises: a back grind tape having a structure in which an adhesive layer is formed on a base; and a resin composition layer provided on the adhesive layer of the back grind tape. A tensile elasticity of the adhesive layer is 0.1 to 5.0 MPa at 23°C, The peel strength T between the adhesive layer and the resin composition layer is 0.1 to 5 N/20 mm under a condition of 23°C and 300 mm/minute.

3. 发明专利

JP2011054940A Adhesive sheet for supporting and protecting semiconductor wafer and method for grinding back of semiconductor wafer 审中-公开
标题翻译：用于支持和保护半导体波形的粘合片和用于研磨半导体晶片的方法
公开(公告)号：JP2011054940A
公开(公告)日：2011-03-17
申请号：JP2010162701
申请日：2010-07-20
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MIZUNO KOJI , ASAI FUMITERU , SASAKI TAKATOSHI
IPC分类号： H01L21/304 , C09J4/00 , C09J7/02 , C09J133/04
CPC分类号： H01L21/6836 , B32B37/1284 , B32B38/164 , B32B2309/02 , B32B2309/105 , B32B2310/0806 , B32B2310/0831 , C09J7/29 , C09J2203/326 , C09J2433/00 , H01L2221/6834 , Y10T428/24959
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for supporting and protecting a semiconductor wafer, and a method for grinding the back of the semiconductor wafer such that adhesion residue is effectively prevented owing to unevenness of a formation surface for a circuit pattern or the like of a recent semiconductor wafer. SOLUTION: The adhesive sheet 40 for supporting and protecting the semiconductor wafer that is stuck on a semiconductor wafer surface to support and protect the semiconductor wafer has an intermediate layer 20 and an adhesive layer 30 formed on a one side of a base film 10 in this order, the adhesive layer 30 being made of a radiation curing type adhesive, and having a thickness of 1 to 50 μm and a shear stress of 0.5 to 10 MPa, the intermediate layer 20 having a thickness of 10 to 500 μm and an elastic modulus of 0.01 to 5 MPa. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于支撑和保护半导体晶片的粘合片，以及用于研磨半导体晶片的背面的方法，使得由于电路图案的形成表面的不均匀性有效地防止了粘附残留或近似的半导体晶片等。解决方案：用于支撑和保护粘附在半导体晶片表面上以支撑和保护半导体晶片的半导体晶片的粘合片40具有中间层20和形成在基膜一侧上的粘合层30 如图10所示，粘合层30由辐射固化型粘合剂制成，厚度为1〜50μm，剪切应力为0.5〜10MPa，中间层20的厚度为10〜500μm，弹性模量为0.01〜5MPa。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2011054939A Adhesive sheet for holding and protecting semiconductor wafer, and method for grinding back of semiconductor wafer 审中-公开
标题翻译：用于保持和保护半导体波形的粘合片和用于研磨半导体波形的方法
公开(公告)号：JP2011054939A
公开(公告)日：2011-03-17
申请号：JP2010162700
申请日：2010-07-20
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SASAKI TAKATOSHI , ASAI FUMITERU , MIZUNO KOJI
IPC分类号： H01L21/304 , C09J7/02 , C09J133/00
CPC分类号： H01L21/6836 , C09J7/385 , C09J2201/622 , C09J2203/326 , H01L2221/6834 , Y10T428/264
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for holding and protecting a semiconductor wafer, the adhesive sheet effectively preventing adhesive deposit caused by unevenness on a formation surface of a circuit pattern or the like of a semiconductor wafer of late years, and to provide a method for grinding the back of a semiconductor wafer. SOLUTION: In this adhesive sheet 10 for holding and protecting a semiconductor wafer 20 by being stuck to a surface of the semiconductor wafer 20, an adhesive layer 11 is arranged on one side of a base film 12; the adhesive layer 11 has a thickness of 4-42 μm; and an elastic modulus thereof at 25°C is 0.5-9 MPa. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决问题：为了提供一种用于保持和保护半导体晶片的粘合片，该粘合片有效地防止了由于近年来半导体晶片的电路图案等的形成表面上的不均匀性引起的粘合剂沉积，并提供一种研磨半导体晶片背面的方法。解决方案：在用于通过粘附到半导体晶片20的表面来保持和保护半导体晶片20的粘合片10中，在基膜12的一侧上设置粘合层11; 粘合剂层11的厚度为4-42μm; 其在25℃下的弹性模量为0.5-9MPa。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2015010099A 粘着シート有权
标题翻译：压力敏感胶粘剂
公开(公告)号：JP2015010099A
公开(公告)日：2015-01-19
申请号：JP2013133795
申请日：2013-06-26
申请人：日東電工株式会社 , Nitto Denko Corp
发明人： MIZUNO KOJI , TAKAHASHI TOMOKAZU
IPC分类号： C09J7/02 , C09J7/00 , C09J133/04 , C09J201/00 , C09J201/06 , H01L21/301
摘要：【課題】超音波洗浄に供される部品材料を固定および/または保護するため、ならびに超音波洗浄において部品材料からの剥離を防止するために十分な粘着力を有し、かつ、適度な剥離性を有する粘着シートを提供すること。【解決手段】本発明の粘着シートは、超音波洗浄に供される部品用の粘着シートであって、活性エネルギー線硬化型ポリマーと、水酸基価が300以上の樹脂から構成される粘着付与剤とを含む粘着剤層を備える。【選択図】図1
摘要翻译：要解决的问题：提供一种压敏粘合片，其具有足以固定和/或保护要进行超声波清洗的部件材料并且足够防止在超声波清洗时与部件材料分离的粘合力，并且还具有适当的分离性。解决方案：压敏粘合片是用于进行超声波清洗的部件的压敏粘合片，并且包括含有活性能量射线固化性聚合物和羟基值为300以上的树脂的粘合剂层。

6. 发明专利

JP2014135469A Adhesive sheet, dicing tape integrated adhesive sheet, method for manufacturing semiconductor device, and semiconductor device 审中-公开
标题翻译：粘合片，带状集成粘合片，制造半导体器件的方法和半导体器件
公开(公告)号：JP2014135469A
公开(公告)日：2014-07-24
申请号：JP2013088568
申请日：2013-04-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIGA GOSHI , TAKAMOTO HISAHIDE , MIZUNO KOJI
IPC分类号： H01L21/301 , C09J7/02 , C09J11/08 , C09J201/00 , H01L23/00 , H01L23/28
CPC分类号： H01L2224/16 , H01L2224/48453
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of preventing a circuit on a semiconductor chip from being destructed in a manufacturing process of a semiconductor device.SOLUTION: In a dicing tape integrated adhesive sheet 1 which is used for manufacture of a semiconductor device in order to prevent a semiconductor element from being destructed by peeling electrification at the time of pickup, the adhesive sheet 1 is used in which a polymer type antistatic agent is contained. As a result, after being peeled off from the dicing tape, decline in an antistatic function can be suppressed and improvement in reliability as a device is made possible.
摘要翻译：要解决的问题：提供能够防止半导体芯片的电路在半导体器件的制造工艺中被破坏的粘合片。解决方案：在用于制造半导体器件的切割带集成粘合片1中为了防止半导体元件在拾取时剥离带电而被破坏，使用其中包含聚合物型抗静电剂的粘合片1。结果，在从切割带剥离之后，可以抑制抗静电功能的下降，并且作为器件的可靠性的提高成为可能。

7. 发明专利

JP2014135468A Dicing tape integrated adhesive sheet and method for manufacturing semiconductor device using dicing tape integrated adhesive sheet 审中-公开
标题翻译：带状集成粘合片及其制造方法使用带状集成粘合片制造半导体器件
公开(公告)号：JP2014135468A
公开(公告)日：2014-07-24
申请号：JP2013088565
申请日：2013-04-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIGA GOSHI , MIZUNO KOJI , TAKAMOTO HISAHIDE
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a dicing tape integrated adhesive sheet capable of preventing a circuit on a semiconductor chip from being destructed in a manufacturing process of a semiconductor device.SOLUTION: Disclosed is a dicing tape integrated adhesive sheet which includes a dicing tape formed by laminating an adhesive layer on a substrate, and an adhesive sheet formed on the adhesive layer. A surface specific resistance value on the surface of at least one of the substrate or the adhesive layer is 1.0×10Ω or less.
摘要翻译：要解决的问题：提供一种能够防止半导体芯片的电路在半导体器件的制造工艺中被破坏的切割带一体的粘合片。解决方案：公开了一种切割带一体式粘合片，其包括形成的切割带通过在基材上层叠粘合剂层和在粘合剂层上形成的粘合片。基材或粘合剂层中的至少一个表面的表面电阻率值为1.0×10

8. 发明专利

JP2014133859A Adhesive sheet, dicing tape integrated adhesive sheet, manufacturing method of semiconductor device, and semiconductor device 有权
标题翻译：粘合片，导电胶带集成胶粘片，半导体器件的制造方法和半导体器件
公开(公告)号：JP2014133859A
公开(公告)日：2014-07-24
申请号：JP2013088567
申请日：2013-04-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIGA GOSHI , TAKAMOTO HISAHIDE , MIZUNO KOJI
IPC分类号： C09J7/00 , C09J7/02 , C09J11/06 , C09J201/00 , H01L21/301 , H01L23/00
CPC分类号： H01L2224/16 , H01L2224/48453
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet that can prevent breakdown of a circuit on a semiconductor chip in a production process of a semiconductor device.SOLUTION: In order to prevent breakdown of a semiconductor element caused by peeling electrification during pickup, a dicing tape integrated adhesive sheet 1 used in the production of a semiconductor device has a multilayered structure. In the adhesive sheet 1, the surface of any one outermost layer containing an antistatic agent has a surface specific resistance of 1.0×10Ω or less.
摘要翻译：要解决的问题：提供一种能够防止在半导体器件的制造过程中半导体芯片上的电路的破坏的粘合片。解决方案：为了防止在拾取期间由剥离电气引起的半导体元件的破坏，切割用于制造半导体器件的胶带一体粘合片1具有多层结构。在粘合片1中，含有抗静电剂的任一个最外层的表面的表面电阻率为1.0×10＆OHgr; 或更少。

9. 发明专利

JP2014133858A Dicing tape integrated adhesive sheet, and manufacturing method of semiconductor device using dicing tape integrated adhesive sheet 有权
标题翻译：带状集成粘合片，以及使用带状集成粘合片的半导体器件的制造方法
公开(公告)号：JP2014133858A
公开(公告)日：2014-07-24
申请号：JP2013088566
申请日：2013-04-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIGA GOSHI , MIZUNO KOJI , TAKAMOTO HISAHIDE
IPC分类号： C09J7/02 , C09J11/08 , C09J201/00 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a dicing tape integrated adhesive sheet that can prevent breakdown of a circuit on a semiconductor chip in a production process of a semiconductor device.SOLUTION: A dicing tape integrated adhesive sheet includes a dicing tape in which an adhesive layer is laminated on a substrate, and an adhesive sheet formed on the adhesive layer, wherein at least one of the substrate and the adhesive layer contains a polymeric antistatic agent.
摘要翻译：要解决的问题：提供一种可以防止在半导体器件的制造过程中半导体芯片上的电路的破坏的切割带一体的粘合片。解决方案：切割带一体粘合片包括切割带，其中粘合层层压在基材上，以及形成在粘合剂层上的粘合片，其中基材和粘合剂层中的至少一个含有聚合抗静电剂。

10. 发明专利

JP2013021105A Adhesive sheet for dicing, and semiconductor device manufacturing method using adhesive sheet for dicing 审中-公开
标题翻译：用于印刷的粘合片和使用粘合片进行切割的半导体器件制造方法
公开(公告)号：JP2013021105A
公开(公告)日：2013-01-31
申请号：JP2011152769
申请日：2011-07-11
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SASAKI TAKATOSHI , MIZUNO KOJI , ASAI FUMITERU , SHIGA GOSHI
IPC分类号： H01L21/301 , C09J7/02
CPC分类号： H01L21/78 , C08K5/005 , C09J7/38 , C09J11/06 , C09J2201/622 , C09J2203/326 , C09J2205/102 , H01L21/6836 , H01L2221/68336 , Y10T428/28 , Y10T428/2848
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for dicing which can prevent a suction stage from being scratched when laser-scribing a semiconductor wafer.SOLUTION: Provided is an adhesive sheet for dicing, which has a base material and an adhesive layer that is provided on the base material. The adhesive layer contains 0.02-5 parts by weight of an ultraviolet absorbing agent with respect to 100 parts by weight of a resin solid content, and the adhesive sheet for dicing has a light transmission rate of 30-80% with respect to light having a wavelength of 355 nm.

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