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    • 1. 发明授权
    • Semiconductor memory circuit device and method for fabricating same
    • 半导体存储器电路器件及其制造方法
    • US5237187A
    • 1993-08-17
    • US799541
    • 1991-11-27
    • Naokatsu SuwanaiHiroyuki MiyazawaAtushi OgishimaMasaki NagaoKyoichiro AsayamaHiroyuki UchiyamaYoshiyuki KanekoTakashi YoneokaKozo WatanabeKazuya EndoHiroki Soeda
    • Naokatsu SuwanaiHiroyuki MiyazawaAtushi OgishimaMasaki NagaoKyoichiro AsayamaHiroyuki UchiyamaYoshiyuki KanekoTakashi YoneokaKozo WatanabeKazuya EndoHiroki Soeda
    • H01L21/8242H01L27/108
    • H01L27/10844H01L27/10805H01L27/10808
    • In a semiconductor memory circuit device wherein each memory cell is constituted by a series circuit of a memory cell selecting MISFET and an information storing capacitor of a stacked structure, there are present in a first region, which is a memory cell array region, a first MISFET having a gate electrode and source and drain regions; first and second capacitor electrodes and a dielectric film extended over a first insulating film and over the gate electrode; a second insulating film disposed on the second capacitor electrode; a third insulating film interposed between the first insulating film and first capacitor electrode; and a first wiring positioned on the second insulating film. In a second region of the device, which is a peripheral circuit region, there are present a second MISFET having a gate electrode and source and drain regions; a first insulating film on the gate electrode; a second insulating film on a third insulating film, the third insulating film being interposed between the first and second insulating films; and a second wiring on the second insulating film. The second wiring is formed by the same level conductor layer as that forming the first wiring. Similarly, the first through third insulating films of the first region are correspondingly associated with the first through third insulating films of the second region, respectively.
    • 在其中每个存储单元由存储单元选择MISFET的串联电路和层叠结构的信息存储电容器构成的半导体存储器电路器件中,存在作为存储单元阵列区域的第一区域,第一 MISFET具有栅极电极和源极和漏极区域; 第一和第二电容器电极以及在第一绝缘膜上并在栅电极上方延伸的电介质膜; 设置在所述第二电容器电极上的第二绝缘膜; 介于所述第一绝缘膜和所述第一电容器电极之间的第三绝缘膜; 以及位于第二绝缘膜上的第一布线。 在作为外围电路区域的器件的第二区域中,存在具有栅极电极和源极和漏极区域的第二MISFET, 栅电极上的第一绝缘膜; 在第三绝缘膜上的第二绝缘膜,所述第三绝缘膜介于所述第一和第二绝缘膜之间; 以及在第二绝缘膜上的第二布线。 第二布线由与形成第一布线的层相同的导体层形成。 类似地,第一区域的第一至第三绝缘膜分别与第二区域的第一至第三绝缘膜相关联。
    • 6. 发明授权
    • Semiconductor integrated circuit device including a dielectric breakdown
prevention circuit
    • 包括绝缘击穿防止电路的半导体集成电路装置
    • US5268587A
    • 1993-12-07
    • US786750
    • 1991-11-01
    • Jun MurataHideyuki MiyazawaKyoichiro AsayamaAkihiro TambaSeigou YukutakeHiroyuki MiyazawaYutaka KobayashiTomoyuki Someya
    • Jun MurataHideyuki MiyazawaKyoichiro AsayamaAkihiro TambaSeigou YukutakeHiroyuki MiyazawaYutaka KobayashiTomoyuki Someya
    • H01L27/105H01L27/108H01L29/06H01L29/78
    • H01L27/10805H01L27/105
    • A semiconductor integrated circuit device includes a dielectric breakdown prevention circuit coupled to an external terminal for protecting an input stage circuit. The prevention circuit has bipolar transistors and complementary MISFETs including a first MISFET of a first conductivity type and a second MISFET of a second conductivity type. A first semiconductor region of the first conductivity type is formed by the same layer as a well region in which the second MISFET is formed. A second semiconductor region of the second conductivity type is formed in said first semiconductor region by the same layer as source and drain regions of the second MISFET. These first and second semiconductor regions form a first PN junction diode. The external terminal is electrically coupled to one end portion of said second semiconductor region. A high impurity conductivity type buried third semiconductor region underlies the said second semiconductor region, and is formed by the same layer as a region isolating the bipolar transistors. This third region is disposed at the bottom surface of said first semiconductor region. A fourth semiconductor region of the second conductivity type is also formed in said first semiconductor region by the same layer used for collector contact regions of the bipolar transistors, and is connected with another end portion of said second semiconductor region, in contact with the third semiconductor region. The fourth semiconductor region is coupled to the input stage circuit, and the third and fourth semiconductor regions form a second PN junction diode.
    • 半导体集成电路器件包括耦合到外部端子的绝缘击穿防止电路,用于保护输入级电路。 防止电路具有双极晶体管和互补MISFET,其包括第一导电类型的第一MISFET和第二导电类型的第二MISFET。 第一导电类型的第一半导体区域由与其中形成第二MISFET的阱区相同的层形成。 第二导电类型的第二半导体区域通过与第二MISFET的源极和漏极区域相同的层在所述第一半导体区域中形成。 这些第一和第二半导体区域形成第一PN结二极管。 外部端子电耦合到所述第二半导体区域的一个端部。 高杂质导电型掩埋的第三半导体区域位于所述第二半导体区域的下方,并且由与隔离双极晶体管的区域相同的层形成。 该第三区域设置在所述第一半导体区域的底表面。 第二导电类型的第四半导体区域也通过与用于双极晶体管的集电极接触区域的相同的层形成在所述第一半导体区域中,并且与所述第二半导体区域的与第三半导体接触的另一个端部连接 地区。 第四半导体区域耦合到输入级电路,并且第三和第四半导体区域形成第二PN结二极管。