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1. 发明专利

JP2008205227A Illumination apparatus for imaging in electronic component mounter 有权
标题翻译：用于在电子元件安装中成像的照明设备
公开(公告)号：JP2008205227A
公开(公告)日：2008-09-04
申请号：JP2007040233
申请日：2007-02-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKADA KOICHI , ENDO TADASHI , TANAKA HIROKAZU
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an illumination apparatus for imaging for an electronic component mounter, capable of meeting the demands for a making compact apparatus by reducing the dimension of a height direction. SOLUTION: An illumination unit 30, for emitting a light to a substrate as an imaging target with a camera 25 in the electronic component mounter, has a configuration in which a planar illumination substrate 31 is principally used and upper stage illumination light source sections 32a, intermediate stage illumination light source sections 32b and lower stage illumination light source sections 32c are disposed orderly toward the outside around an opening portion 31a for imaging on the surface of the illumination substrate 31 which opposes the substrate, illumination lights are emitted to the surface of the substrate at different illumination angles, wherein the lower stage illumination light source sections 32c having the lowest illumination angle are disposed on only four diagonal positions in a rectangular range A centered about an imaging optical axis a. According to this configuration, bulging dimension of each of the light source sections 32c can be suppressed, as much as possible, to reduce the planar occupied dimension, and thereby can meet the demands of compact. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电子部件安装机成像的照明装置，能够通过减小高度方向的尺寸来满足制造小型装置的要求。解决方案：用于在电子部件安装机中用相机25将作为成像目标的基板作为成像目标发光的照明单元30具有其中主要使用平面照明基板31和上级照明光源部分32a，中间级照明光源部分32b和下级照明光源部分32c有序地朝着外部围绕开口部分31a设置，用于在与基板相对的照明基板31的表面上成像，照明光发射到在不同照明角度下的基板的表面，其中具有最低照明角度的下级照明光源部分32c仅以围绕成像光轴a为中心的矩形范围A中的四个对角位置设置。根据该结构，能够尽可能地抑制每个光源部32c的凸出尺寸，以减小平面占有面积，从而能够满足紧凑的要求。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2008130872A Component holder 审中-公开
标题翻译：组件架
公开(公告)号：JP2008130872A
公开(公告)日：2008-06-05
申请号：JP2006315236
申请日：2006-11-22
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NOUDO AKIRA , ENDO TADASHI , OGATA YUJI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component holder into which an RF tag for storing individual information including individual ID information to be read and written freely can be incorporated and operated certainly. SOLUTION: In a nozzle 14 attached removably to a mounting head in an electronic component mounting apparatus and holding an electronic component to be mounted, such an arrangement as an RF tag sheet 15 for storing information and performing contactless information reading/writing is stuck to a flange 14b composed of a conductor such as metal through an electromagnetic wave absorbing sheet 20 is employed. Consequently, an eddy current is not generated at the fixing portion by an electromagnetic wave, and an RF tag for storing individual information including individual ID information to be read and written freely can be incorporated and operated certainly. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种组件保持器，其中可以包含并操作用于存储包括要读取和写入的个人ID信息的个人信息的RF标签。解决方案：在可拆卸地附接到电子部件安装装置中的安装头并保持要安装的电子部件的喷嘴14中，作为用于存储信息和执行非接触式信息读取/写入的RF标签片15的这种布置是采用通过电磁波吸收片20粘附在由诸如金属的导体构成的凸缘14b上。因此，通过电磁波在固定部分不产生涡流，并且可以适当地并入和操作用于存储包括要被自由读取和写入的个人ID信息的个人信息的RF标签。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008130871A Component holder 有权
标题翻译：组件架
公开(公告)号：JP2008130871A
公开(公告)日：2008-06-05
申请号：JP2006315235
申请日：2006-11-22
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NOUDO AKIRA , ENDO TADASHI , OGATA YUJI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component holder into which an RF tag for storing individual information including individual ID information to be read and written freely can be incorporated and operated certainly. SOLUTION: In a nozzle 14 attached removably to a mounting head in an electronic component mounting apparatus and holding an electronic component to be mounted, such an arrangement as an RF tag sheet 15 for storing information and performing contactless information reading/writing is stuck to a base 14c engaged with a nozzle attaching portion provided in the mounting head through a flange 14b composed of a nonconductor such as ceramic is employed. Consequently, an eddy current is not generated at the fixing portion by an electromagnetic wave, and an RF tag for storing individual information including individual ID information to be read and written freely can be incorporated and operated certainly. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种组件保持器，其中可以包含并操作用于存储包括要读取和写入的个人ID信息的个人信息的RF标签。解决方案：在可拆卸地附接到电子部件安装装置中的安装头并保持要安装的电子部件的喷嘴14中，作为用于存储信息和执行非接触式信息读取/写入的RF标签片15的这种布置是通过由诸如陶瓷之类的非导体组成的凸缘14b粘附到与设置在安装头中的喷嘴附接部分接合的底座14c。因此，通过电磁波在固定部分不产生涡流，并且可以适当地并入和操作用于存储包括要被自由读取和写入的个人ID信息的个人信息的RF标签。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2007019297A Electronic component mounting device and method therefor 有权
标题翻译：电子元件安装设备及其方法
公开(公告)号：JP2007019297A
公开(公告)日：2007-01-25
申请号：JP2005199877
申请日：2005-07-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ENDO TADASHI , TSUTSUMI TAKUYA , NODA TAKAHIRO , MARUYAMA YUJI
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting device and a method for accurately determining identity of electronic component before and after exchange of tape in a tape feeder, and acquiring mounting accuracy and mounting quality of electronic component even after exchange of tape. SOLUTION: Identity of an electronic component before and after exchange of tape is collated by detecting electric characteristics of an electronic component with detectors 31a, 31b, and 31c. Moreover, difference in height of an electronic component before and after exchange of a tape is detected by measuring height of an electronic component with sensors 21, 22. When identity with an electronic component before and after exchange of the tape is verified, mounting is conducted with adequate pressing force by compensating, on the basis of difference in height of an electronic component before and after exchange of the tape, for amount of height control of a nozzle 11 when mounting an electronic component before and after exchange of the tape. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子部件安装装置和用于在带式馈送器中更换带之前和之后准确地确定电子部件的身份的方法，并且即使在交换之后也获得电子部件的安装精度和安装质量胶带。解决方案：通过用检测器31a，31b和31c检测电子部件的电特性来整理磁带交换之前和之后的电子部件的标识。此外，通过测量具有传感器21,22的电子部件的高度来检测电子部件在磁带交换之前和之后的高度差异。当验证与电子部件在与磁带交换之前和之后的标识时，进行安装通过基于在更换带之前和之后的电子部件的高度差来补偿在更换带之前和之后安装电子部件时喷嘴11的高度控制量的足够的按压力。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2004342680A Component feeding device and component mounting device using it 有权
标题翻译：组件进料装置和使用它的组件安装装置
公开(公告)号：JP2004342680A
公开(公告)日：2004-12-02
申请号：JP2003134632
申请日：2003-05-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ENDO TADASHI , KIDO KAZUO , UCHIDA HIDEKI , OKUDA OSAMU
IPC分类号： B65G1/00 , H05K13/02
摘要： PROBLEM TO BE SOLVED: To obtain a component feeding device for which tray plates can be put in and out by means of one driving source and the pulling-out means of which can be constituted simply by using a small number of components, and to obtain a component mounting device. SOLUTION: The component feeding device 200 is provided with a loading means 45 which elevates a plurality of tray plates containing components to a prescribed taking-out height and the pulling-out means 47 which pulls out the tray plates. The pulling-out means 47 comprises a moving body 59 which is linearly moved in the pulling-out direction, a freely slidable slider installed on the moving body 59, and an energizing means which energizes the slider in the direction in which the slider approaches the tray plates. The means 47 also comprises a stopper which slides the slider against the energizing force, and a pair of clamping pawls which are installed on the slider in a freely swingable state, closed when the slider slides and opened when the slider is in a non-sliding state. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得能够通过一个驱动源将托盘板放入和取出的部件供给装置，并且其简单地通过使用少量部件构成其拉出装置，并获得部件安装装置。解决方案：部件供给装置200设置有加载装置45，其将包含部件的多个托盘板提升到规定的取出高度，以及拉出托盘的拉出装置47。拉出装置47包括在拉出方向上直线移动的移动体59，安装在移动体59上的可自由滑动的滑动件，以及使滑动件沿滑块接近的方向通电的激励装置托板盘。装置47还包括使滑块抵抗能量力滑动的止动件，并且一对夹紧爪以可自由摆动的状态安装在滑块上，当滑块滑动并且当滑块处于非滑动状态时打开州。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2004327898A Device and method for collecting tape or the like for component supply, and device and method for mounting component 审中-公开
标题翻译：用于收集胶带或类似用于组件供应的装置和方法，以及用于安装组件的装置和方法
公开(公告)号：JP2004327898A
公开(公告)日：2004-11-18
申请号：JP2003123476
申请日：2003-04-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KANAI KAZUNORI , OBARA HIROSHI , ENDO TADASHI , FUJIWARA MUNEYOSHI , MORI KAZUO
IPC分类号： H05K13/02 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for collecting a tape etc., for component supply after use by which collection processing is made efficient and the collection processing can be performed at any time in mounting operation. SOLUTION: The collection device (40) for tapes etc., which guides and cuts a tape etc., (23) for component supply after use to a size less than a fixed length and then collects it in a collection box (44) enables the tape etc., (23) to smoothly be guided by performing sticking preventive processing for the surface of a chute (41) guiding the tape etc., (23) after use, and avoids an operator's injury and entry of foreign matter by arranging shutters (51, 52) and/or duct covers (81, 85) which can associate with the operation of a cutter (42) before and behind the cutter (42); and a duct (43) is provided with conveying mechanisms (48, 71, 72, 74, 75) which convey the tape etc., (23) having been cut to a position that an operator can access. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于收集带子的装置和方法，用于使用后的部件供应，通过该装置和收集处理有效地进行收集处理，并且可以在安装操作中随时进行收集处理。
解决方案：用于引导和切割胶带等的胶带等的收集装置（40）（23），用于使用后的部件供给尺寸小于固定长度，然后将其收集在收集箱（ 44）通过对引导带等（23）的滑槽（41）的表面进行防粘附处理，（23）使用后能够使胶带等（23）平滑地引导，并避免操作者受伤和进入外部（51,52）和/或可以与切割器（42）之前和之后的切割器（42）的操作相关联的通道盖（81,85）; 并且管道（43）设置有传送机构（48,71,72,74,75），其将已经被切割的带等（23）传送到操作者可以访问的位置。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2008218538A System and method for mounting electronic component 有权
标题翻译：用于安装电子元件的系统和方法
公开(公告)号：JP2008218538A
公开(公告)日：2008-09-18
申请号：JP2007050974
申请日：2007-03-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ENDO TADASHI , YAGI SHUZO
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a system and method for mounting an electronic component capable of improving versatility in production facilities without any need for adding a recognition mark in advance even if a substrate exceeding a standard size is to be produced. SOLUTION: The information of a substrate that has been carried in is confirmed by the upstream side device of a mounting machine; it is determined whether substrate marks A, B on the substrate concerned can be imaged after being included in an imaging travel range 13S of a camera 13; through holes and circuit wiring in the substrate 3 are used as substitution marks A1, B1 in place of a substrate mark that cannot include the imaging travel range 13S as a mount position in the substrate marks A, B for a substrate of which it has been determined to be impossible to perform imaging; the substrate mark A, the substitution mark B1 and the substrate mark B, and the substitution mark A1 are combined in pairs for use as position recognition marks; and the position recognition marks are imaged by the camera to recognize the position of the substrate 3. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于安装能够提高生产设备的多功能性的电子部件的系统和方法，而不需要预先添加识别标记，即使是要生产超过标准尺寸的基板。解决方案：已经承载的基板的信息由安装机的上游侧装置确认; 确定在被包括在照相机13的成像行进范围13S之后是否可以对所涉及的衬底上的衬底标记A，B进行成像; 基板3中的通孔和电路布线用作替代标记A1，B1，代替不能包括成像行程范围13S的基板标记作为其已经在其中的基板的基板标记A，B中的安装位置决定不可能进行成像; 基板标记A，取代标记B1和基板标记B以及替代标记A1成对组合用作位置识别标记; 并且通过相机对位置识别标记进行成像以识别基板3的位置。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008218537A Device for mounting electronic component, and method of reading information code in the same 有权
标题翻译：用于安装电子元件的装置，以及在其中读取信息代码的方法
公开(公告)号：JP2008218537A
公开(公告)日：2008-09-18
申请号：JP2007050973
申请日：2007-03-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ENDO TADASHI , OKADA KOICHI
IPC分类号： H05K13/04 , G06T3/00 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a device for mounting an electronic component capable of reading information codes at low costs with a simple mechanism, and to provide a method of reading information codes in the electronic component mounting device. SOLUTION: When reading the information code 22 where a size applied to a substrate in advance is larger than the size of an imaging visual field 20a of a camera, the information code 22 is captured for a plurality of times and a divided imaging pattern for acquiring a plurality of divided images G1-G4 is set, the camera and an imaging moving means for moving the camera are controlled according to the divided imaging pattern to composite the plurality of divided images G1-G4, a single image in the information code is generated, and information is read from the composited single image, thus reading the information code at low costs with a simple mechanism without requiring any expensive imaging means having a large visual field and exclusive imaging means. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于安装能够以简单的机构以低成本读取信息代码的电子部件的装置，并且提供一种在电子部件安装装置中读取信息代码的方法。解决方案：当读取预先施加到基板的尺寸大于相机的成像视域20a的尺寸的信息代码22时，信息代码22被捕获多次，并且分割成像设置用于获取多个分割图像G1-G4的图案，根据分割的成像图案控制相机和用于移动相机的成像移动装置，以将多个分割图像G1-G4合成，信息中的单个图像生成代码，并且从合成的单个图像中读取信息，从而以简单的机制以低成本读取信息代码，而不需要具有大视野和独占成像装置的任何昂贵的成像装置。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2007081369A Packaging apparatus and packaging method of electronic component 有权
标题翻译：电子元件的包装设备和包装方法
公开(公告)号：JP2007081369A
公开(公告)日：2007-03-29
申请号：JP2006162005
申请日：2006-06-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KAWASE TAKEYUKI , ENDO TADASHI , OGATA HIROSHI
IPC分类号： H05K13/08 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method which enables the correct and efficient recognition of the thickness of an electronic component which is chucked by a nozzle. SOLUTION: A method of measuring the thickness of the electronic component having a transfer head for the nozzle 21 which chucks a component P applied to a component packaging apparatus which conveys the component P with the transfer head and equips a substrate with the component P includes a falling step of falling the component P to the precise part of a first line sensor 13 for measuring the thickness of the component P, and a measuring step of measuring the thickness of the component P by the first line sensor 13. COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2005279741A Joining device and joining method 审中-公开
标题翻译：加工设备和接合方法
公开(公告)号：JP2005279741A
公开(公告)日：2005-10-13
申请号：JP2004098955
申请日：2004-03-30
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ENDO TADASHI
IPC分类号： B23K11/00 , B23K11/24
摘要： PROBLEM TO BE SOLVED: To provide a joining device and joining method which efficiently and selectively carry out the sequential full and fraction forward joining operations in a joining direction by input of a total number of placement of a plurality of objects to be joined which are placed on pallets.
SOLUTION: The joining device is provided with the pallets 2a for sequentially placing a plurality of the objects 1a to be joined in an X-axis direction or a Y-axis direction, a total number of placement input section 12 for the objects 1a to be joined, a perpendicularly ascending and descending electrode 4 disposed in a Z-axis lifting section 7, and a driving section 8 and a controlling section 9 for driving and controlling the pallets 2a and the electrode 4 and is provided with a joining direction selecting section 14 for selecting Y-axis joining direction of the objects 1a to be joined and an operation controlling section 11 by the number of placement for carrying out the sequential full and fraction forward joining operations.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种接合装置和接合方法，其通过输入要连接的多个物体的总数来有效地和选择性地执行连续方向上的连续完整和分段前进接合操作它们放在托盘上。
解决方案：接合装置设置有用于在X轴方向或Y轴方向上依次放置多个被接合物体1a的托盘2a，用于物体的放置输入部12的总数 1a，设置在Z轴提升部7中的垂直升降电极4，以及用于驱动和控制托盘2a和电极4的驱动部8和控制部9，并且设置有接合方向选择部分14，用于选择要接合的对象1a的Y轴接合方向和操作控制部分11，用于执行连续的完整和分段前进连接操作的位置数。版权所有（C）2006，JPO＆NCIPI

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