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1. 发明专利

JP2008218537A Device for mounting electronic component, and method of reading information code in the same 有权
标题翻译：用于安装电子元件的装置，以及在其中读取信息代码的方法
公开(公告)号：JP2008218537A
公开(公告)日：2008-09-18
申请号：JP2007050973
申请日：2007-03-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ENDO TADASHI , OKADA KOICHI
IPC分类号： H05K13/04 , G06T3/00 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a device for mounting an electronic component capable of reading information codes at low costs with a simple mechanism, and to provide a method of reading information codes in the electronic component mounting device. SOLUTION: When reading the information code 22 where a size applied to a substrate in advance is larger than the size of an imaging visual field 20a of a camera, the information code 22 is captured for a plurality of times and a divided imaging pattern for acquiring a plurality of divided images G1-G4 is set, the camera and an imaging moving means for moving the camera are controlled according to the divided imaging pattern to composite the plurality of divided images G1-G4, a single image in the information code is generated, and information is read from the composited single image, thus reading the information code at low costs with a simple mechanism without requiring any expensive imaging means having a large visual field and exclusive imaging means. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于安装能够以简单的机构以低成本读取信息代码的电子部件的装置，并且提供一种在电子部件安装装置中读取信息代码的方法。解决方案：当读取预先施加到基板的尺寸大于相机的成像视域20a的尺寸的信息代码22时，信息代码22被捕获多次，并且分割成像设置用于获取多个分割图像G1-G4的图案，根据分割的成像图案控制相机和用于移动相机的成像移动装置，以将多个分割图像G1-G4合成，信息中的单个图像生成代码，并且从合成的单个图像中读取信息，从而以简单的机制以低成本读取信息代码，而不需要具有大视野和独占成像装置的任何昂贵的成像装置。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2006214859A Imaging apparatus 有权
标题翻译：成像设备
公开(公告)号：JP2006214859A
公开(公告)日：2006-08-17
申请号：JP2005027598
申请日：2005-02-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANAKA HIROKAZU , OKADA KOICHI
IPC分类号： G01N21/84 , G01N21/956 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of easily replacing an LED that is used as the light source of a illumination system and that is superior in maintenability. SOLUTION: In the luminarie for irradiating an object with light from an illumination direction, forming a predetermined angle with respect to the imaging direction due to a camera, an LED substrate 24 having LED light sources 26 arranged thereon is mounted in a housing 20 in a freely detachable manner of being held to an LED-holding member 22, which is provided with first and second mounting surfaces B and C that mutually cross the LED substrate 24 at right angles, via a shaft member 23 and the first and second mounting surfaces B and C are respectively brought into close contact with the first and second reference surfaces D and E provided to the inner surface of the housing 20, to adopt a constitution, where the direction of the lights emitted from the LED light sources 26 coincides with the expected direction of illumination. With this constitution, the imaging apparatus, capable of easily replacing the LED and superior in maintenability, can be realized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种成像装置，其能够容易地替代用作照明系统的光源并且具有优异的可维护性的LED。解决方案：在用于从照明方向的光照射物体的发光体中，由于照相机而相对于成像方向形成预定角度，将其上布置有LED光源26的LED基板24安装在壳体 20以可自由拆卸的方式被保持在LED保持构件22上，LED保持构件22经由轴构件23设置有以直角相互穿过LED基板24的第一和第二安装表面B和C，第一和第二安装面B和C分别与设置在壳体20的内表面上的第一和第二参考表面D和E紧密接触，采用其中从LED光源26发射的光的方向一致的结构与预期的照明方向。利用这种结构，可以实现能够容易地更换LED并且具有优异的可维护性的成像装置。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2004336631A Image reader and image reading method 有权
公开(公告)号：JP2004336631A
公开(公告)日：2004-11-25
申请号：JP2003133097
申请日：2003-05-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANAKA HIROKAZU , HATASE TAKAYUKI , YANO KEIJI , KATO HIDEAKI , OKADA KOICHI , OGATA KENICHI
IPC分类号： G06T1/00 , H04N5/225 , H04N5/238 , H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide an image reader capable of shortening an image reading time and obtaining an image with uniform image quality with a simple/inexpensive method, and to provide an image reading method. SOLUTION: In this image reader for reading an optical image of an electronic component which is an imaging object by scanning the component held by a suction nozzle 8a of a transfer head 8 with respect to a camera 9 provided with a line sensor 14, a light quantity control pattern in controlling, by an illumination control part 11, the quantity of light of a lighting device 10 for emitting illuminating light to the electronic component is set in advance in accordance with a head moving pattern of the transfer head 8 in a scanning operation. In reading an image, the light quantity of the illuminating light from the lighting device 10 is controlled according to the light quantity control pattern. COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004335940A Method and device for electronic component packaging 有权
公开(公告)号：JP2004335940A
公开(公告)日：2004-11-25
申请号：JP2003133096
申请日：2003-05-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KATO HIDEAKI , YANO KEIJI , HATASE TAKAYUKI , OKADA KOICHI , TANAKA HIROKAZU , OGATA KENICHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic component packaging device and an electronic component packaging method which can reduce a tact time by eliminating a dead time in image picking-up operation by a line camera. SOLUTION: In packaging an electronic component packaged in a substrate 3 by moving a transfer head 8 wherein an electronic component is unloaded from a component supply part 4, recognition operation data comprising position data of operation starting points PS1, PS2 and operation end points PE1, PE2 of movement operation for image picking-up are operated based on size data of the electronic component for each component kind in the image picking-up of the electronic component by a line camera 9, and a transfer head movement mechanism is controlled based on the recognition operation data in image picking-up. Consequently, a tact time can be reduced by eliminating a dead time in image picking-up operation by the line camera 9 by minimizing scan distances D1, D2. COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

JP2004264025A Image recognition device and method 有权
公开(公告)号：JP2004264025A
公开(公告)日：2004-09-24
申请号：JP2003003032
申请日：2003-01-09
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKADA KOICHI , YAMAZAKI MASAYUKI , KIHARA MASAHIRO
IPC分类号： G01B11/28 , G01N21/956 , G06T1/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To enhance recognition precision.
SOLUTION: In this image recognition method for discriminating cream solder 9 by picking up an image of the cream solder 9 printed on a rectangular electrode 16 formed with a solder leveler to be recognition-processed, white illumination light is emitted from an irradiation direction having 45° or less of angle θ1 formed with respect to a horizontal face within a vertical face, and having 75° or less of angle θ3 formed with respect to a boundary line of the electrode 16 within the horizontal face, using a lighting unit arranged radially with white light source parts 35W along a direction inclined diagonally by 45°. Regular reflection light from a glossy solder leveler forming face 16a is thereby prevented from being received by an upper side camera, and a solder surface 9a is discriminated precisely from the solder leveler forming face 16a.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2008218539A Method of mounting camera for recognizing substrate in electronic component mounting device 有权
标题翻译：电子元件安装装置中用于识别基板的安装方法
公开(公告)号：JP2008218539A
公开(公告)日：2008-09-18
申请号：JP2007050975
申请日：2007-03-01
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ENDO TADASHI , OKADA KOICHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting a camera for recognizing a substrate in an electronic component mounting device capable of mounting the camera for recognizing the substrate with a simple method. SOLUTION: In the method, while a camera unit 20 is being tentatively mounted on an adjusting tool 40 having an aligning means capable of reproducing an alignment reference when mounting to a camera mount section provided accompanying a mount head for mounting a camera unit 20, camera adjustment work including the adjustment of the focal position of the camera unit 20 and a rotation direction position in an optical coordinates system is performed in advance, and the adjusted camera unit 20 is mounted on the camera mount section of the electronic component mounting device with the alignment reference, thus mounting the camera for recognizing a substrate with a simple method without bothering an experienced worker. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在能够以简单的方法安装用于识别基板的相机的电子部件安装装置中安装用于识别基板的相机的方法。解决方案：在该方法中，当相机单元20被暂时地安装在具有对准装置的调节工具40上时，该对准装置能够在安装到伴随安装头安装相机单元的相机安装部分时再现对准基准如图20所示，预先执行包括调整摄像机单元20的焦点位置和光学坐标系中的旋转方向位置的摄像机调整工作，并且将调整后的照相机单元20安装在电子部件安装具有对准参考的装置，因此以简单的方法安装用于识别基板的相机，而不会困扰有经验的工人。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008205226A Illumination apparatus for imaging in electronic component mounter 审中-公开
标题翻译：用于在电子元件安装中成像的照明设备
公开(公告)号：JP2008205226A
公开(公告)日：2008-09-04
申请号：JP2007040232
申请日：2007-02-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKADA KOICHI , ENDO TADASHI , TANAKA HIROKAZU
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an illumination apparatus for imaging for an electronic component mounter, capable of meeting the demands for compact apparatus by reducing the dimensions of the height direction. SOLUTION: An illumination unit 30, for emitting a light to a substrate as an imaging target with a camera 25 in the electronic component mounter, has a configuration in which a planar illumination plate 31 positioned in parallel to the surface of a substrate between the substrate as an imaging target and the camera 25 is principally provided, and an upper stage illumination light source sections 32a, an intermediate stage illumination light source sections 32b and a lower stage illumination light source section 32c are disposed, in this order starting from the inside to the outside around an opening 31a for image pickup on the surface opposite to the substrate of the illumination substrate 31, and illumination lights are emitted to the surface of the substrate at different illumination angles. According to this configuration, the dimension in the height direction of the planar illumination unit 30 can be reduced to thereby meet the demands for compaction. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于电子部件安装机成像的照明装置，能够通过减小高度方向的尺寸来满足对紧凑装置的要求。解决方案：用于在电子部件安装器中用相机25将作为成像目标的基板作为成像目标发光的照明单元30具有这样的结构，其中平面照明板31平行于基板的表面作为摄像对象的基板和摄像机25之间，主要设置上级照明光源部32a，中间级照明光源部32b和下级照明光源部32c，依次从在与照明基板31的基板相反的表面上用于图像拾取的开口31a周围的内部和外部，并且照明光以不同的照明角度发射到基板的表面。根据该结构，可以减小平面照明单元30的高度方向的尺寸，从而满足压实的要求。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2004327765A Apparatus for packaging electronic component 审中-公开
公开(公告)号：JP2004327765A
公开(公告)日：2004-11-18
申请号：JP2003121196
申请日：2003-04-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KATO HIDEAKI , YANO KEIJI , HATASE TAKAYUKI , OKADA KOICHI , TANAKA HIROKAZU , OGATA KENICHI
IPC分类号： F16H25/20 , F16H25/24 , H05K13/00 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component electronic packaging apparatus capable of realizing compatibility of high-speed driving with high positional accuracy of a transfer head. SOLUTION: In the electronic component packaging apparatus for packaging an electronic component taken out from a part feeding section by the transfer head on a substrate positioned on a substrate positioning section, a feed screw 10A or 10B, used for a direct driving mechanism for moving the transfer head, is provided with first pitch portions A, on which a small pitch p1 is set, according to a high accuracy range needing high-precision positioning of the transfer head and second pitch portions B, on which a feed pitch p2 larger than the feed pitch p1 of the first pitch portions A is set. In this way, the speed of the transfer head can be increased, without increasing the rotational speed of a motor for rotating and driving the feed screw, and high-speed driving of the transfer head can be made compatible with high positioning precision. COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2004327695A Electronic part installing device and method therefor 审中-公开
公开(公告)号：JP2004327695A
公开(公告)日：2004-11-18
申请号：JP2003120006
申请日：2003-04-24
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKADA KOICHI , HATASE TAKAYUKI , YANO KEIJI , KATO HIDEAKI , OGATA KENICHI , TANAKA HIROKAZU
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic part installing device and method therefor wherein productivity is improved by reducing a tact time. SOLUTION: The electronic part installing device is for picking up an electronic part and transferring and mounting it to a board 3 from a part supplying part 4 by a transferring head 8A. A part recognition camera 12A for imaging the electronic part P held by the suction nozzle 11 of the transferring head 8A is movable by an independent camera moving means. In image fetching, moving of the camera 12A by this camera moving means is made to synchronously follow moving of the transferring head 8A. Thus, the transferring head 8A can move to the board 3 speedily without passing through a specific route for part recognition so as to reduce the tact time to improve productivity. COPYRIGHT: (C)2005,JPO&NCIPI

10. 发明专利

JP2004264026A Image recognition device and method 有权
公开(公告)号：JP2004264026A
公开(公告)日：2004-09-24
申请号：JP2003003033
申请日：2003-01-09
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKADA KOICHI , YAMAZAKI MASAYUKI , KIHARA MASAHIRO
IPC分类号： G01B11/00 , G01N21/956 , G06T1/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an image recognition device capable of reducing a recognition tact time and an image recognition method.
SOLUTION: In this image recognition method for discriminating cream solder 9 by picking up an image of the cream solder 9 printed on a rectangular electrode 16 formed with a solder leveler to be recognition-processed, white illumination light and red illumination light are emitted from a periphery at 45° or less of irradiation angle θ1 by a lower stage lighting unit 26, and a color image is acquired by a camera under the condition where red illumination lights are emitted from its upper side by a middle stage lighting unit 27 and an upper stage lighting unit 28. A solder leveler forming face 16a appears thereby in a red color on a recognition face, a solder surface 9a appears thereby in a white color thereon, resultingly the solder surface 9a is surely discriminated from the solder leveler forming face 16a on the same recognition face, and the recognition tact time is shortened.
COPYRIGHT: (C)2004,JPO&NCIPI

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