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1. 发明专利

JP2008066752A Method of supplying component and component mounting system 审中-公开
标题翻译：供应组件和组件安装系统的方法
公开(公告)号：JP2008066752A
公开(公告)日：2008-03-21
申请号：JP2007302183
申请日：2007-11-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YABUKI KOICHI , MORITA KEITA , OKUMURA KAZUMASA , FUJIWARA MUNEYOSHI
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To accurately perform lot management of mounting components on a circuit board without deteriorating an operating rate of component mounting. SOLUTION: With a method of supplying components, a plurality of component supplying devices 3 having a taping component 15 in which electronic components 12 are stored longitudinally in a row are arranged at a component supplying part 2. When electronic components 12 are successively supplied from each taping component 15 of each component supplying device 3, each component supplying device 3 supplements components by connecting an end part of the taping component 15 which is in the course of supplying components with a leader of the taping component 15. After electronic components 12 are supplied from the taping component 15 in use, a component switching timing is detected which is a switching time when electronic components 12 are supplied from taping components 15 for supplement. After that, each electronic component 12 mounted on a circuit board 11 performs lot management of each electronic component 12 mounted on the circuit board 11 by the unit of taping components 15 according to corresponding information that from which taping components 15 it is supplied as component supplying from taping components 15 for supplement. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：在电路板上精确地进行安装部件的批量管理，而不会降低部件安装的工作速度。解决方案：通过提供部件的方法，在部件供应部分2处布置有多个具有电子部件12纵向存储的带状部件15的部件供应装置3。当电子部件12连续每个部件供应装置3的每个胶带部件15提供的每个部件供应装置3通过连接在供给部件的过程中的胶带部件15的端部与带部件15的引导件来连接部件。在电子部件 12由使用中的胶带组件15提供，检测到组件切换定时，该组件切换定时是电子组件12从用于补充的胶带组件15供应的切换时间。之后，安装在电路板11上的每个电子部件12根据作为部件供给的带状部件15的相应信息，通过带部件15单元，对安装在电路基板11上的各电子部件12执行批量管理从胶带组件15补充。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2004327898A Device and method for collecting tape or the like for component supply, and device and method for mounting component 审中-公开
标题翻译：用于收集胶带或类似用于组件供应的装置和方法，以及用于安装组件的装置和方法
公开(公告)号：JP2004327898A
公开(公告)日：2004-11-18
申请号：JP2003123476
申请日：2003-04-28
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KANAI KAZUNORI , OBARA HIROSHI , ENDO TADASHI , FUJIWARA MUNEYOSHI , MORI KAZUO
IPC分类号： H05K13/02 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for collecting a tape etc., for component supply after use by which collection processing is made efficient and the collection processing can be performed at any time in mounting operation. SOLUTION: The collection device (40) for tapes etc., which guides and cuts a tape etc., (23) for component supply after use to a size less than a fixed length and then collects it in a collection box (44) enables the tape etc., (23) to smoothly be guided by performing sticking preventive processing for the surface of a chute (41) guiding the tape etc., (23) after use, and avoids an operator's injury and entry of foreign matter by arranging shutters (51, 52) and/or duct covers (81, 85) which can associate with the operation of a cutter (42) before and behind the cutter (42); and a duct (43) is provided with conveying mechanisms (48, 71, 72, 74, 75) which convey the tape etc., (23) having been cut to a position that an operator can access. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于收集带子的装置和方法，用于使用后的部件供应，通过该装置和收集处理有效地进行收集处理，并且可以在安装操作中随时进行收集处理。
解决方案：用于引导和切割胶带等的胶带等的收集装置（40）（23），用于使用后的部件供给尺寸小于固定长度，然后将其收集在收集箱（ 44）通过对引导带等（23）的滑槽（41）的表面进行防粘附处理，（23）使用后能够使胶带等（23）平滑地引导，并避免操作者受伤和进入外部（51,52）和/或可以与切割器（42）之前和之后的切割器（42）的操作相关联的通道盖（81,85）; 并且管道（43）设置有传送机构（48,71,72,74,75），其将已经被切割的带等（23）传送到操作者可以访问的位置。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2003001411A Method and device for removing flux 有权
标题翻译：用于去除通量的方法和装置
公开(公告)号：JP2003001411A
公开(公告)日：2003-01-08
申请号：JP2001187428
申请日：2001-06-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANIGUCHI MASAHIRO , FUJIWARA MUNEYOSHI , NAGAI KOICHI
IPC分类号： B01D53/46 , B01D53/34 , B01J19/08 , B23K1/00 , B23K3/00 , B23K101/42 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To recover and remove a vaporized flux from the gaseous emissions.
SOLUTION: This device is provided with a corona discharge section 10 for releasing minus ions, by which the vaporized flux 19 in the gaseous emissions is electrified to minus and is attracted to a flux recovering plate 11 electrified to plus. The vaporized flux 19 is thus efficiently recovered and removed from the gaseous emissions.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：从气体排放物中回收和去除蒸发的通量。解决方案：该装置设置有用于释放负离子的电晕放电部分10，通过该负离子将气态发射体中的汽化通量19带电到负极，并被吸入通电加热的通量回收板11。因此，汽化的通量19被有效地回收并从气体排放物中除去。

4. 发明专利

JP2007227963A Parts mounting device and method 有权
标题翻译：部件安装设备和方法
公开(公告)号：JP2007227963A
公开(公告)日：2007-09-06
申请号：JP2007112590
申请日：2007-04-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAKINO YOICHI , FUJIWARA MUNEYOSHI , IGARASHI TSUNETO , IIZUKA KIMIO
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a parts mounting device and method by which a number of parts holding members installed on a parts mounting head is increased, an installed number of the parts holding members per unit area on the parts mounting head is increased simultaneously, when holding and mounting parts on a circuit-forming body, thereby a parts mounting efficiency by the parts mounting head is further improved. SOLUTION: On a first subhead 3 and a second subhead 3 installed on the parts mounting head, the plurality of parts holding members 1 arranged around each of centers of rotations of the respective subheads 3 in possible of rotational transfer are equipped. On the respective subheads 3, the parts holding members 1 can be arranged at arbitrary positions on the circumferences of the respective rotational transfers by the rotational transfers of the respective parts holding members 1 around the centers of rotations of the subheads. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种部件安装装置和方法，通过该部件安装装置和方法，安装在零件安装头上的多个部件保持部件增加，部件安装头上的每单位面积的部件保持部件的安装数量为同时，当将部件保持和安装在电路形成体上时，由于部件安装头的部件安装效率得到进一步提高。解决方案：在安装在零件安装头上的第一副标题3和第二副标题3上，配备有可能转动的各个子标题3的每个旋转中心周围的多个部件保持构件1。在各个子标题3上，通过各部件保持构件1围绕子标题的转动中心的旋转传递，部件保持构件1可以布置在各旋转传递的周边的任意位置。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2004312899A Cable protective device 审中-公开
公开(公告)号：JP2004312899A
公开(公告)日：2004-11-04
申请号：JP2003104188
申请日：2003-04-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KANAI KAZUNORI , FUJIWARA MUNEYOSHI , KITAMURA NAOYUKI , SANO TATSUYA , NAKAYAMA HIROTAKE
IPC分类号： B25J19/00 , F16G13/16 , H02G3/30 , H02G11/00
摘要： PROBLEM TO BE SOLVED: To provide a cable protective device, capable of restraining both of friction and contact noise caused between a cable duct and a guide at the time of a high speed traveling of the cable duct, preventing abrasive powder from sticking, and providing improved resistance and further reduction in noise. SOLUTION: This is a cable protective device 53 which protects the cable connected between a fixed body and a moving body (attachment head 41) traveling in straight. This device has the cable duct 55 which covers the cable and in which an arbitral position can be bent with a constant curvature corresponding to the movement of the moving body, and the guide 57 which supports a lower step portion of the cable duct 55 disposed at the upper/lower steps by using a C-shaped bent portion as a boundary by placing on an upper surface. An elastic body and a resin thin plate (resin tape layer 67) are sequentially layered on the upper surface of the guide 57. COPYRIGHT: (C)2005,JPO&NCIPI

6. 发明专利

JP2000077899A Device and method for mounting electronic component 审中-公开
标题翻译：用于安装电子元件的装置和方法
公开(公告)号：JP2000077899A
公开(公告)日：2000-03-14
申请号：JP24492498
申请日：1998-08-31
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： FUJIWARA MUNEYOSHI , HIRAI WATARU , MOGI SEIICHI , OTA HIROSHI , MOTOKAWA YUICHI
IPC分类号： B23P21/00 , H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To correspond to various electronic components without requiring the scaling-up of a mounting head by controlling the lighting operation of an illumination means and a light-emission means and the open-close operation of a shutter means and changing over an illumination pattern at the time of image recognition. SOLUTION: A desired pattern is selected from a preset illumination pattern in response to the kind of the electronic component 3, and illumination is lit. The lit electronic component 3 is taken into an image pick-up section as an image, and the quantity of positional displacement in the adsorbed posture is calculated. An adsorption nozzle 6 is rotated so that the electronic component 3 is placed at a specified mounting angle on the basis of the quantity of positional displacement, and a mounting head 4 is lowered to the place of the mounting of the electronic component and mounted on a circuit board 8. Consequently, the illumination patterns are changed over in response to the kinds of the electronic components 3 at the time of image recognition, and illumination proper to each electronic component 3 is carried out. Accordingly, there is no possibility of the disturbance of the high-speed processing of the mounting device with the scaling-up of the electronic component as an object.
摘要翻译：要解决的问题：为了对应于各种电子部件，而不需要通过控制照明装置和发光装置的照明操作以及快门装置的打开和关闭操作来改变安装头的放大图像识别时的照明图案。解决方案：响应于电子部件3的种类，从预设的照明图案中选择期望的图案，照明被点亮。将点亮的电子部件3作为图像被摄入图像拾取部，并且计算吸附姿势的位置偏移量。旋转吸附喷嘴6，使得电子部件3基于位置位移量被设置在规定的安装角度，并且安装头4下降到电子部件的安装位置并安装在因此，在图像识别时响应于电子元件3的种类而改变照明图案，并且对每个电子元件3进行适当的照明。因此，作为对象，以电子部件的放大率不会妨碍安装装置的高速处理。

7. 发明专利

JP2003273583A Electronic component mounting device 有权
标题翻译：电子元件安装设备
公开(公告)号：JP2003273583A
公开(公告)日：2003-09-26
申请号：JP2002066797
申请日：2002-03-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： UEMORI HIROSHI , HAMAZAKI KURAYASU , FUJIWARA MUNEYOSHI
IPC分类号： F16H25/12 , H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting device which is capable of mounting electronic components at a high speed without causing mounting misalignment or mounting failure an carrying out high-quality mounting of the components. SOLUTION: The component mounting device is equipped with a cam follower and a cam groove. A second pivoting support member 107 supports a second roller 106 at a second support position O 1 and is mounted on a component holding/mounting unit 101 at a second pivoting center O 2 , and the support position O 1 is set as deviating from the pivoting center O 2 . The second turning support member 107 is provided to the component mounting device, so that the second roller can be pressed against the cam groove constantly with a biasing member 108 giving a smaller biasing force than usual. Therefore, vibrations can be prevented even when the electronic component mounting device operates at a high speed, and as the result, the mounting device is capable of mounting electronic components at a high speed without causing mounting misalignment or mounting failure and carrying out high-quality mounting of the components. COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种能够高速安装电子部件而不引起安装不对准或安装故障的电子部件安装装置，从而进行部件的高质量安装。
解决方案：组件安装装置配有凸轮从动件和凸轮槽。第二枢转支撑构件107在第二支撑位置O 1上支撑第二辊106并且在第二枢转中心O 2上安装在部件保持/安装单元101上。并且支撑位置O 1 被设定为偏离枢转中心O 2 。第二转动支撑构件107被设置到部件安装装置，使得第二辊可以通过偏置构件108恒定地压靠在凸轮槽上，偏压构件108具有比通常更小的偏压力。因此，即使电子部件安装装置高速运转也能够防止振动，结果，安装装置能够高速安装电子部件，而不会引起安装不对准或安装故障，并且执行高质量组件的安装。版权所有（C）2003，JPO

8. 发明专利

JP2003273582A Component mounting head for component mounting device 审中-公开
标题翻译：组件安装头组件安装头
公开(公告)号：JP2003273582A
公开(公告)日：2003-09-26
申请号：JP2002068560
申请日：2002-03-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MAKINO YOICHI , FUJIWARA MUNEYOSHI
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a component mounting head which holds and mounts a component on a circuit-forming body, is capable of increasing component holding members possessed by itself in the number per unit area as increasing the number of the component holding members possessed by itself, and more improved in component mounting efficiency. SOLUTION: The component mounting head is equipped with a first sub- mounting head and a second sub-mounting head, and a plurality of component holding members are provided to each of the sub-mounting heads as being arranged around the center of rotation of the sub-mounting head in a rotatable and movable manner. The component holding members are arranged around each of the sub-mounting heads in a rotatable and movable manner, so that they can be arranged at optional position on a circumference around the center of rotation of the sub-mounting head. COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种将部件保持并安装在电路形成体上的部件安装头，能够增加单位面积数量的自身所具有的部件保持部件，因为增加部件数量自身拥有的组件，以及组件安装效率的提高。
解决方案：部件安装头配备有第一子安装头和第二副安装头，并且将多个部件保持部件设置在每个副安装头周围，副安装头以可旋转和可移动的方式旋转。部件保持部件以可旋转且可移动的方式布置在每个子安装头周围，使得它们可以布置在围绕副安装头的旋转中心的圆周上的可选位置。版权所有（C）2003，JPO

9. 发明专利

DE3785977T2 未知
公开(公告)号：DE3785977T2
公开(公告)日：1993-09-02
申请号：DE3785977
申请日：1987-08-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORITA KOICHI , TAKAICHI SUSUMU , FUJIWARA MUNEYOSHI , SENO MAKITO , MISAWA YOSHIHIKO
IPC分类号： H05K13/04 , H05K13/08
摘要： In an electronic chip placement machine (60) with test function, there is provided a suction nozzle (4) for holding a chip (5), a chip-regulation device (7) for regulating the attitude of the chip by clamping the chip at portions having no electrodes (5a, 5b), probes (l4a, l4b, l5a, l5b) for testing electrical characteristics of the chip. The tip portion (4a) of the suction nozzle is made of an insulating material such as a ceramic or a synthetic resin in order to avoid a short-circuit between electrodes of the chip through the nozzle. Therefore, the electrical characteristics of the chip can be tested without the separation between the nozzle and the chip. Furthermore, since one cycle of the operational process come to short, it is possible to provide chip-test and placement machines whose structure is simple. As a result, productivity and durability can also be increased.

10. 发明专利

DE60024375T2 未知
公开(公告)号：DE60024375T2
公开(公告)日：2006-06-14
申请号：DE60024375
申请日：2000-09-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKANO KEN , FUJIWARA MUNEYOSHI , MOGI SEIICHI , HAMASAKI KURAYASU
IPC分类号： H05K13/04 , H05K13/08
摘要： To provide a method and apparatus for mounting components capable of mounting even such components as having narrow inter-component distances without producing any interference between already mounted components and suction nozzles or components being suction-held by the suction nozzles. The component mounting apparatus for picking up electronic components supplied from a component supply section by suction nozzles attached to a mounting head and mounting the electronic components on a printed circuit board, includes a control section containing information on the components to be mounted and controlling, based on this information, the positions of the suction nozzle, the mounting head and the printed circuit board so that the components to be mounted are mounted in ascending order of height.

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