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1. 发明专利

JP2007019297A Electronic component mounting device and method therefor 有权
标题翻译：电子元件安装设备及其方法
公开(公告)号：JP2007019297A
公开(公告)日：2007-01-25
申请号：JP2005199877
申请日：2005-07-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ENDO TADASHI , TSUTSUMI TAKUYA , NODA TAKAHIRO , MARUYAMA YUJI
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting device and a method for accurately determining identity of electronic component before and after exchange of tape in a tape feeder, and acquiring mounting accuracy and mounting quality of electronic component even after exchange of tape. SOLUTION: Identity of an electronic component before and after exchange of tape is collated by detecting electric characteristics of an electronic component with detectors 31a, 31b, and 31c. Moreover, difference in height of an electronic component before and after exchange of a tape is detected by measuring height of an electronic component with sensors 21, 22. When identity with an electronic component before and after exchange of the tape is verified, mounting is conducted with adequate pressing force by compensating, on the basis of difference in height of an electronic component before and after exchange of the tape, for amount of height control of a nozzle 11 when mounting an electronic component before and after exchange of the tape. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子部件安装装置和用于在带式馈送器中更换带之前和之后准确地确定电子部件的身份的方法，并且即使在交换之后也获得电子部件的安装精度和安装质量胶带。解决方案：通过用检测器31a，31b和31c检测电子部件的电特性来整理磁带交换之前和之后的电子部件的标识。此外，通过测量具有传感器21,22的电子部件的高度来检测电子部件在磁带交换之前和之后的高度差异。当验证与电子部件在与磁带交换之前和之后的标识时，进行安装通过基于在更换带之前和之后的电子部件的高度差来补偿在更换带之前和之后安装电子部件时喷嘴11的高度控制量的足够的按压力。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2004103893A Method for correcting position of suction nozzle in electronic part mounting apparatus 有权
标题翻译：在电子部件安装装置中校正吸附喷嘴的位置的方法
公开(公告)号：JP2004103893A
公开(公告)日：2004-04-02
申请号：JP2002265093
申请日：2002-09-11
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUMI HIDEKI , NODA TAKAHIRO
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide a method for correcting the position of a suction nozzle in an electronic part mounting apparatus which can acquire a parameter for correcting the position by a simple method. SOLUTION: In order to acquire the parameter for correcting the position to correct the positional deviation generated in association with a θ direction rotation of the suction nozzle in an electronic part mounting apparatus for mounting to rotate the nozzle in the θ direction around a nozzle axis, a marker is mounted on a substrate at each specific angle by conducting a normal mounting operation at a transfer head, and positional deviations Δx, Δy of each specific rotation angle obtained by recognizing the position of the placed marker are used as position correcting parameters at the rotary angle. Thus, the parameter for correcting the position can be acquired by the simple method. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于校正电子部件安装装置中的吸嘴的位置的方法，其可以通过简单的方法获取用于校正位置的参数。解决方案：为了获得用于校正位置的参数，以校正与用于安装的电子部件安装装置中的吸嘴的θ方向旋转相关联产生的位置偏差，以使喷嘴沿θ方向旋转喷嘴轴，通过在转印头进行正常的安装操作，以每个特定角度将标记安装在基板上，并且通过识别放置的标记的位置而获得的每个特定旋转角度的位置偏差Δx，Δy被用作位置校正参数在旋转角度。因此，可以通过简单的方法获得用于校正位置的参数。版权所有（C）2004，JPO

3. 发明专利

JP2007053271A Method of mounting electronic component 有权
标题翻译：安装电子元件的方法
公开(公告)号：JP2007053271A
公开(公告)日：2007-03-01
申请号：JP2005238166
申请日：2005-08-19
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUMI HIDEKI , NODA TAKAHIRO
IPC分类号： H05K13/04
CPC分类号： H05K13/0452 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178
摘要： PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component capable of efficiently mounting electronic components on substrates on the same mounting stage by a plurality of mounting heads. SOLUTION: In the method of mounting the electronic component, electronic components are picked up by transfer heads 8A, 8B provided corresponding to each of component feeding sections from the plurality of component feeding sections for feeding electronic components, and are transferred and mounted on a substrate 3 in the same mounting stage. In the method, during the component transfer/mounting operation, head interference areas Ai(A), Ai(B), Aj(A) and Aj(B) are set as exclusive operation regions to which only a specified mounting head is permitted to access, for each mounting turn. Thus, a region to which one transfer head can access without causing interference with another transfer head can be rationally set in the component mounting operation, and a useless standby time of each of transfer heads is eliminated, thereby shortening a mounting tact time. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种安装能够通过多个安装头在同一安装台上将电子部件有效地安装在基板上的电子部件的安装方法。解决方案：在安装电子部件的方法中，电子部件由用于馈送电子部件的多个部件供给部分对应于每个部件供给部分设置的传送头8A，8B拾取，并被传送和安装在同一安装阶段的基板3上。在该方法中，在部件传送/安装操作期间，将头部干涉区域Ai（A），Ai（B），Aj（A）和Aj（B）设定为只允许指定的安装头部的专用操作区域进入，每个安装转弯。因此，可以在部件安装操作中合理地设置一个传送头可以访问而不会与另一传送头相干扰的区域，并且消除每个传送头的无用的待机时间，从而缩短安装时间。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2004128245A Electronic part mounting equipment and electronic part mounting method 有权
标题翻译：电子部件安装设备和电子部件安装方法
公开(公告)号：JP2004128245A
公开(公告)日：2004-04-22
申请号：JP2002290927
申请日：2002-10-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUMI HIDEKI , NODA TAKAHIRO
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide electronic part mounting equipment and a method, which are capable of improving the productivity coping with various kinds of mounting. SOLUTION: The electronic part mounting equipment is equipped with a plurality of rows of transfer paths 2A and 2B, the transfer direction of the transfer paths 2A is set opposite to that of the transfer paths 2B, and electronic parts are mounted on the first surface of a double-sided mounting board 3 through mounting stages S1 and S2 set up on the transfer paths 2A. The board 3 with the electronic parts mounted on its first surface is subjected to a reflow process through a reflow unit 8a, then turned upside down and moved to the transfer paths 2B by a board reversing/moving unit 8b. Thereafter, electronic parts are mounted on the second surface of the board 3 through mounting stages S3 and S4 set up on the transfer paths 2B, and the second surface of the board 3 is subjected to a reflow process through a reflow unit 9. By this setup, the boards 3 can be recovered on the same side where the boards are delivered, so that the mounting equipment and method are capable of improving productivity coping with the various mounting configurations including a double-sided mounting board. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供能够提高应对各种安装的生产率的电子部件安装设备和方法。
解决方案：电子部件安装设备配备有多行传送路径2A和2B，传送路径2A的传送方向与传送路径2B的传送路径相对设置，电子部件安装在通过设置在传送路径2A上的安装台S1和S2，双面安装板3的第一表面。安装在其第一表面上的电子部件的板3经由回流单元8a进行回流处理，然后通过板反转/移动单元8b上下颠倒并移动到传送路径2B。此后，通过设置在传送路径2B上的安装台S3和S4将电子部件安装在板3的第二表面上，并且通过回流单元9对板3的第二表面进行回流处理。由此可以在板的交付的同一侧回收板3，使得安装设备和方法能够提高应对各种安装配置的生产率，包括双面安装板。版权所有（C）2004，JPO

5. 发明专利

JP2007324482A Mounting method of components 有权
标题翻译：组件安装方法
公开(公告)号：JP2007324482A
公开(公告)日：2007-12-13
申请号：JP2006155184
申请日：2006-06-02
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUMI HIDEKI , NODA TAKAHIRO
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a mounting method of components for improving versatility of a substrate which is usable, and reliability in component mounting precision. SOLUTION: The mounting method of components includes: a bad block specification step (S200) of specifying the bad block from two or more block substrates contained in a substrate 3; a position recognizing step (S206) of recognizing the position of a block mark of each block substrate except the bad block; a data formation step (step S208) of forming the position data, which indicates a relative position of two or more block marks; a mounting step of specifying the mounting position for each block substrate other than the bad block according to the position of the block mark formed on the block substrate and mounting the part on the mounting position; and a data transmission step of transmitting the position data to the down-stream mounting unit. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于提高可用的基板的多功能性的部件的安装方法以及部件安装精度的可靠性。解决方案：组件的安装方法包括：从包含在基板3中的两个或更多个块基板指定坏块的坏块指定步骤（S200）; 识别除了坏块之外的每个块基板的块标记的位置的位置识别步骤（S206）; 形成表示两个以上块标记的相对位置的位置数据的数据形成步骤（步骤S208）安装步骤，根据形成在块基板上的块标记的位置指定除了坏块之外的每个块基板的安装位置，并将该零件安装在安装位置; 以及将位置数据发送到下游安装单元的数据发送步骤。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007059654A Electronic component packaging method 有权
标题翻译：电子元件包装方法
公开(公告)号：JP2007059654A
公开(公告)日：2007-03-08
申请号：JP2005243868
申请日：2005-08-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUMI HIDEKI , NODA TAKAHIRO
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic component packaging method in which precision of suction position can be stabilized when tape splicing for joining carrier tapes is employed. SOLUTION: In the electronic component packaging method for picking up an electronic component from a tape feeder equipped with a tape feed mechanism for feeding the electronic component held on a carrier tape to a position for sucking the component through the suction nozzle of a mounting head and then mounting the electronic component on a substrate by means of the mounting head, when the joint of a carrier tape set in the tape feeder already and a carrier tape to be set anew is detected, component suction position data, i.e. position correction data when the electronic component is sucked by means of the suction nozzle, is updated for the tape feeder where the joint is detected. Consequently, impact of an error incident to tape splicing is eliminated and precision of suction position can be stabilized. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子部件包装方法，其中采用用于连接载带的带子拼接时可以使吸引位置的精度稳定。解决方案：在用于从装有带进给机构的带式进料机构拾取电子部件的电子部件包装方法中，用于将保持在载带上的电子部件供给到通过吸嘴的吸嘴吸附部件的位置安装头，然后通过安装头将电子部件安装在基板上，当检测到设置在带式送料器中的载带的接头和要重新设置的载带时，部件吸入位置数据即位置校正当通过吸嘴吸引电子部件时的数据被更新为检测到接头的带式给料器。因此，消除了对带子拼接的错误事件的影响，并且可以使吸引位置的精度稳定。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005116598A Electronic part mounting method 有权
标题翻译：电子部件安装方法
公开(公告)号：JP2005116598A
公开(公告)日：2005-04-28
申请号：JP2003345412
申请日：2003-10-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUMI HIDEKI , NODA TAKAHIRO
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic part mounting method which is capable of improving a mounting head equipped with a plurality of suction nozzles in mounting efficiency. SOLUTION: A process picks up the electronic parts by the mounting head 8 from part feeders 5 that enable the suction nozzles to hold the electronic parts respectively travelling the shortest traveling distance, selects a combination of mounting points which enables the mounting head 8 to mount the electronic parts held by the mounting head 8 on the board travelling the shortest travelling distance, and is determined on the basis of mounting position data. The electronic parts are successively mounted at the selected mounting points in a part holding process of holding the electronic parts by the mounting head 8 when the electronic parts are picked up by the mounting head 8 equipped with the suction nozzles from the part feeding unit 4 where the part feeders 5 are arranged and mounted on a board. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种电子部件安装方法，其能够改善装配有安装效率的多个吸嘴的安装头。解决方案：一个工艺通过安装头8从部件馈送器5拾取电子部件，使得吸嘴能够分别保持沿着最短行进距离行进的电子部件，选择能够将安装头8 将由安装头8保持的电子部件安装在行进最短行驶距离的板上，并且基于安装位置数据来确定。当电子部件被配备有来自部件供给单元4的吸嘴的安装头8拾取时，电子部件依次安装在所选择的安装点处，通过安装头8保持电子部件的部件保持过程，部件馈送器5布置并安装在板上。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2004031726A Electronic component mounting method 有权
公开(公告)号：JP2004031726A
公开(公告)日：2004-01-29
申请号：JP2002187205
申请日：2002-06-27
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： AZUMA MASAYUKI , SUMI HIDEKI , NODA TAKAHIRO
IPC分类号： H05K13/04
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting method whereby the accuracy of the mounting position of an electronic component can be improved. SOLUTION: The electronic component mounting method-comprises a mounting operation wherein an electronic component P is picked up by a sucking nozzle 10 to make the sucking nozzle move in X-, Y-, and Z-directions, and further rotate around its axis in a θ-direction that the electronic component is transferred to and mounted on a board. Further, this method enables the position of a component recognizing camera present in the rotational center of the sucking nozzle 10 (a rotational-axis center C1 of a θ-rotational mechanism) to be measured and stored previously in an optical coordinate system. Moreover, when the electronic component P held is rotated on an image by the sucking nozzle 10 to determine its aligning quantity, an image operation which enables the image of the electronic component P to be rotated around the stored rotational-axis center C1 is performed. Thereby, the aligning quantity can be determined accurately. COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2007173553A Substrate transport device 审中-公开
标题翻译：基板运输装置
公开(公告)号：JP2007173553A
公开(公告)日：2007-07-05
申请号：JP2005369654
申请日：2005-12-22
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANAKA YOICHI , KITAGAWA TAKAYUKI , NODA TAKAHIRO , OGATA HIROSHI , OTA HIROSHI , NAKAI NOBUHIRO
IPC分类号： H05K13/02
摘要： PROBLEM TO BE SOLVED: To provide a substrate transport device which can transport a substrate efficiently without requiring an extra sensor leading to cost increase and deterioration in reliability. SOLUTION: The substrate transport device comprises a mechanism 21 for conveying a substrate 3 from a first position via a second position, first detection means 22 and 31 for detecting the arrival of the substrate 3 at the first position and passage thereof through the first position, second detection means 23 and 31 for detecting the arrival of the substrate 3 at the second position, and a control unit 30 for regulating conveyance speed of the substrate 3 by controlling driving of the conveyance mechanism 21. Driving of the conveyance mechanism 21 is reduced when the first detection means 22 and 31 detect the passage of the substrate 3 through the first position, and the driving of the conveyance mechanism 21 is stopped when the second detection means 23 and 31 detect the arrival of the substrate 3 at the second position. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够有效地输送基板的基板输送装置，而不需要额外的传感器，导致成本增加和可靠性的劣化。解决方案：基板输送装置包括用于经由第二位置从第一位置输送基板3的机构21，用于检测基板3到达第一位置并通过其的第一检测装置22和31 第一位置，用于检测基板3到达第二位置的第二检测装置23和31;以及控制单元30，用于通过控制传送机构21的驱动来调节基板3的传送速度。驱动传送机构21 当第一检测装置22和31检测到基板3经过第一位置的通过时，减少，并且当第二检测装置23和31检测到第二基板3的到达时，输送机构21的驱动停止位置。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2007027213A Component extracting method 有权
标题翻译：组分提取方法
公开(公告)号：JP2007027213A
公开(公告)日：2007-02-01
申请号：JP2005203572
申请日：2005-07-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TANAKA TOMIO , NODA TAKAHIRO
IPC分类号： H05K13/04 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To provide a component extracting method for converging a suction shift amount to a small value. SOLUTION: In the component extracting method, a conveyance means for extracting a component from a component supply device by suction, holding it and conveying the held component is made as an object. The method comprises a shift amount calculation step (step S55) for calculating the shift amount from a suction reference part of a part sucked by the conveyance means of the component, a correction amount calculation step (step S56) for calculating a correction amount by using the calculated shift amount and a real number which is larger than "0" and smaller than "1", an extraction position change step (step S57) for shifting the extraction position of the component by the conveyance means by the correction amount, and an extraction step (step S58) for extracting the component from the component supply part at the extraction position shifted by the correction amount. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于将吸力偏移量收敛到小值的部件提取方法。解决方案：在部件提取方法中，将用于通过抽吸从部件供给装置中抽取部件并将其保持并输送保持部件的输送装置作为对象。该方法包括：偏移量计算步骤（步骤S55），用于从由部件的输送装置吸入的部分的吸引基准部分计算偏移量;校正量计算步骤（步骤S56），用于通过使用计算校正量计算出的移动量和大于“0”且小于“1”的实数，提取位置改变步骤（步骤S57），用于将输送装置的部件的提取位置移动修正量，以及提取步骤（步骤S58），用于从偏移了校正量的提取位置处的部件供给部分提取组件。版权所有（C）2007，JPO＆INPIT

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