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    • 4. 发明授权
    • Wafer and method of producing same
    • 晶圆及其制造方法
    • US5964942A
    • 1999-10-12
    • US494719
    • 1995-06-26
    • Keiichiro TanabeYuichiro SekiAkihiko IkegayaNaoji FujimoriTakashi Tsuno
    • Keiichiro TanabeYuichiro SekiAkihiko IkegayaNaoji FujimoriTakashi Tsuno
    • C30B25/02C30B29/04
    • C30B25/02C30B29/04
    • No wide bulk diamond wafer exists at present. A wide diamond-coated wafer is proposed instead of the bulk diamond wafer. Diamond is heteroepitaxially deposited on a convex-distorted non-diamond single crystal substrate by a vapor phase deposition method. In an early step, a negative bias is applied to the substrate. In the case of a Si substrate, an intermediate layer of .beta.-SiC is first deposited on the Si substrate by supplying a low carbon concentration material gas. Then the carbon concentration is raised for making a diamond film. The convex-distorted wafer is stuck to a holder having a shaft which is capable of inclining to the holder. The wafer is pushed to a turn-table of a polishing machine. The convex diamond wafer can fully be polished by inclining the holder to the shaft. A wide distorted mirror wafer of diamond is produced. Fine wire patterns can be made on the diamond mirror wafer by the photolithography.
    • 目前没有宽的大块金刚石晶圆。 提出了宽金刚石涂层的晶片代替块状金刚石晶片。 通过气相沉积方法将金刚石异质外延沉积在凸变形的非金刚石单晶衬底上。 在早期的步骤中,向衬底施加负偏压。 在Si衬底的情况下,通过提供低碳浓度的材料气体,首先在Si衬底上沉积β-SiC的中间层。 然后提高碳浓度以制备金刚石膜。 凸起变形的晶片粘附到具有能够倾斜到保持器的轴的保持器上。 将晶片推到抛光机的转台上。 通过将支架倾斜到轴上,可以完全抛光凸面金刚石晶片。 产生了一个宽扭曲的金刚石镜面晶圆。 可以通过光刻在金刚石镜晶片上形成细线图案。