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    • 4. 发明授权
    • Diamond heat sink including microchannel therein and methods for
manufacturing diamond heat sinks
    • 金刚石散热器,其中包括微通道及其制造金刚石散热器的方法
    • US5874775A
    • 1999-02-23
    • US840161
    • 1997-04-14
    • Hiromu ShiomiHideaki NakahataYoshiki NishibayashiShin-ichi Shikata
    • Hiromu ShiomiHideaki NakahataYoshiki NishibayashiShin-ichi Shikata
    • H01L23/373H01L23/38H01L23/34H01L23/06
    • H01L23/38H01L23/3732H01L2924/0002Y10S257/93
    • A diamond heat sink of the present invention comprises: a support layer consisting of substantially undoped diamond; a heat sensitive layer consisting of doped diamond, disposed on the surface of the support layer; an insulation layer consisting of substantially undoped diamond, disposed on a predetermined region in the surface of the heat sensitive layer; electrodes disposed on the heat sensitive layer, wherein an exothermal device is placed on the surface of the insulation layer; and a cooling structure disposed on the backside of the support layer, the cooling structure having at least one microchannel, the microchannel being defined by a diamond, wherein an exothermal device is to be placed on the surface of the insulation layer; and wherein the heat sensitive layer and the electrodes form a thermistor, the electrical resistivity of the thermistor being capable of varying corresponding to heat generated from the exothermal device and transferred through the insulation layer to the thermistor.
    • 本发明的金刚石散热器包括:由基本上未掺杂的金刚石构成的支撑层; 由掺杂金刚石构成的热敏层,设置在支撑层的表面上; 由基本上未掺杂的金刚石构成的绝缘层,设置在热敏层表面的预定区域上; 设置在热敏层上的电极,其中放热装置放置在绝缘层的表面上; 以及设置在所述支撑层的背面上的冷却结构,所述冷却结构具有至少一个微通道,所述微通道由金刚石限定,其中放热装置将被放置在所述绝缘层的表面上; 并且其中所述热敏层和所述电极形成热敏电阻,所述热敏电阻的电阻率能够相应于从所述放热器件产生的热量而变化并通过所述绝缘层传递到所述热敏电阻器。
    • 7. 发明授权
    • Ohmic electrode and method for forming it
    • 欧姆电极及其形成方法
    • US5668382A
    • 1997-09-16
    • US668525
    • 1996-06-28
    • Naohiro TodaYoshiki NishibayashiTadashi TomikawaShin-ichi Shikata
    • Naohiro TodaYoshiki NishibayashiTadashi TomikawaShin-ichi Shikata
    • H01L21/28H01L21/04H01L21/285H01L21/324H01L29/45H01L33/34H01L33/40H01L31/0312H01L23/48H01L23/52H01L29/40
    • H01L33/40H01L21/043H01L29/45H01L33/34H01L2924/0002
    • An ohmic electorde of the present invention comprises a contact electrode layer formed on a p-type diamond semiconductor layer formed on a substrate so as to be in ohmic contact with the p-type diamond semiconductor layer and to have low contact resistance and high heat resistance, and a lead electrode layer formed on the contact electrode layer so as to have low lead wire resistance and high heat resistance. Specifically, the contact electrode layer is made of either a carbide of at least one metal selected from a metal group comprising Ti, Zr, and Hf, or a carbide of an alloy containing at least one metal selected from the metal group. Since the carbide of the metal or alloy forming the contact electrode layer is stabler in respect of energy because of reduced formation enthalpy than the metal or alloy itself, it is very unlikely to diffuse. Therefore, little metal or alloy forming the contact electrode layer precipitates on the surface of the lead electrode layer formed on the contact electrode layer, thus improving the device performance, based on the reduced lead wire resistance.
    • 本发明的欧姆电极包括形成在基板上的与p型金刚石半导体层欧姆接触并且具有低接触电阻和高耐热性的p型金刚石半导体层上的接触电极层 以及形成在接触电极层上的引线电极层,以便具有低引线电阻和高耐热性。 具体地,接触电极层由选自由Ti,Zr和Hf的金属组成的至少一种金属的碳化物或含有选自金属中的至少一种金属的合金的碳化物制成。 由于形成接触电极层的金属或合金的碳化物相对于能量而言更稳定,因为与金属或合金本身相比,形成焓降低,所以不可能扩散。 因此,形成接触电极层的少量金属或合金在形成在接触电极层上的引线电极层的表面析出,从​​而基于降低的引线电阻提高器件性能。