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1. 发明授权

US4628531A Pattern checking apparatus 失效
标题翻译：图案检查装置
公开(公告)号：US4628531A
公开(公告)日：1986-12-09
申请号：US583867
申请日：1984-02-27
申请人： Keiichi Okamoto , Kozo Nakahata , Yukio Matsuyama , Hideaki Doi , Susumu Aiuchi , Mineo Nomoto
发明人： Keiichi Okamoto , Kozo Nakahata , Yukio Matsuyama , Hideaki Doi , Susumu Aiuchi , Mineo Nomoto
IPC分类号： G01B11/24 , G01N21/88 , G01N21/956 , G06T7/00 , G06K9/00
CPC分类号： G06T7/001 , G01N21/956 , G06T2207/10056 , G06T2207/30148
摘要： A pattern checking apparatus carries out the detection of candidate defects through a primary selection with a sensitivity high enough to detect any existing defect, and then carries out a detailed analysis by a controlling processor for a pattern including the periphery of the detected candidate defect through a secondary selection in which a candidate defect which is not a defect in a practical sense is removed from candidates, so that only real defects are detected.
摘要翻译：模式检查装置通过具有足够高的灵敏度的主要选择来执行候选缺陷的检测，以检测任何现有缺陷，然后通过控制处理器对包括检测到的候选缺陷的外围的图案进行详细分析，通过从候选者中删除不是实际意义上的缺陷的候选缺陷的次要选择，从而仅检测到真实的缺陷。

2. 发明授权

US06072899A Method and device of inspecting three-dimensional shape defect 失效
标题翻译：检查三维形状缺陷的方法和装置
公开(公告)号：US06072899A
公开(公告)日：2000-06-06
申请号：US12739
申请日：1998-01-23
申请人： Yoko Irie , Hideaki Doi , Hiroya Koshishiba , Mineo Nomoto
发明人： Yoko Irie , Hideaki Doi , Hiroya Koshishiba , Mineo Nomoto
IPC分类号： G01B11/24 , G06T1/00 , G06T7/00 , H05K3/00 , H05K3/06 , G06K9/00
CPC分类号： G01B11/24 , G06T7/0008 , G06T2207/10028 , G06T2207/10064 , G06T2207/30141
摘要： A three-dimensional shaped defect inspecting method including a three-dimensional shape detection region selecting step for detecting a two-dimensional picture signal by taking a two-dimensional optical picture fluorescence emitted from a detection object and selecting a three-dimensional shape detection region in respect of the detection object based on the detected two-dimensional picture signal, and a three-dimensional shape determining step for detecting a picture signal by taking an optical picture in accordance with a height by reflected light from the detection object and sampling height information with a desired two-dimensional pixel size in respect of the selected three-dimensional shape inspection region with respect to the detected picture signal, thereby calculating and determining a three-dimensional shape, whereby a defect caused by a deficiency in thickness or the like on a wiring pattern of a solid shape, formed on a detection object of a circuit board or the like, can be detected in a short period of time, and its device.
摘要翻译：一种三维形缺陷检查方法，包括：三维形状检测区域选择步骤，用于通过从检测对象发出的二维光学图像荧光检测二维图像信号，并选择三维形状检测区域基于检测到的二维图像信号对检测对象的尊重;以及三维形状确定步骤，用于通过根据来自检测对象的反射光和高度信息采集光学图像来检测图像信号，并且具有采样高度信息相对于检测到的图像信号，对于所选择的三维形状检查区域的期望的二维像素尺寸，由此计算和确定三维形状，由此由于厚度等不足导致的缺陷可以形成在电路板等的检测对象上的实心形状的布线图案在短时间内被检测到，其设备。

3. 发明授权

US5930382A Wiring pattern inspecting method and system for carrying out the same 失效
标题翻译：接线方式检查方法和系统进行
公开(公告)号：US5930382A
公开(公告)日：1999-07-27
申请号：US645475
申请日：1996-05-13
申请人： Yoko Irie , Hideaki Doi , Yasuhiko Hara , Tadashi Iida , Yasuhiro Fujishita , Yasuo Nakagawa , Takanori Ninomiya
发明人： Yoko Irie , Hideaki Doi , Yasuhiko Hara , Tadashi Iida , Yasuhiro Fujishita , Yasuo Nakagawa , Takanori Ninomiya
IPC分类号： G01N23/04 , G01N21/88 , G01N21/956 , G01N29/04 , G01R31/02 , G06T7/00 , H05K3/00 , G06K9/00 , G06K9/32 , G06K9/42
CPC分类号： G06T7/0004 , G06T2207/10116 , G06T2207/20044 , G06T2207/30141
摘要： A wiring pattern inspecting method comprises irradiating a test object provided with wiring patterns formed in a plurality of layers with x-rays, obtaining a variable-density image signal corresponding to the thickness of the wiring patterns superposed in a plurality of layers including superposed sections of the wiring patterns, extracting a plurality of image signals, the number of which corresponding to that of the superposed wiring patterns, from the variable-density image signal, and comparing end point information or isolated point information about the wiring patterns obtained from image signal representing a larger number of superposed wiring patterns, and branch information about the end points or the isolated points on the wiring points, obtained from the extracted image signal representing a smaller number of superposed wiring patterns to inspect the wiring patterns for defects in the wiring patterns. The wiring pattern inspecting method is carried out by a wiring pattern inspecting system.
摘要翻译：布线图案检查方法包括用X射线照射设置有多层的布线图案的测试对象，获得与叠加在多个层中的布线图案的厚度相对应的可变密度图像信号，所述多个层包括叠加部分布线图案，从可变密度图像信号中提取与叠加布线图案的数量相对应的多个图像信号的数量，以及比较从表示的图像信号获得的布线图案的终点信息或孤立点信息从提取的图像信号中获得的表示较少数量的叠加布线图案以检查布线图案中的布线图案中的缺陷的叠加布线图案的数量以及关于布线点上的端点或隔离点的分支信息。布线图形检查方法由布线图形检查系统进行。

4. 发明授权

US5801965A Method and system for manufacturing semiconductor devices, and method and system for inspecting semiconductor devices 失效
标题翻译：用于制造半导体器件的方法和系统以及用于检查半导体器件的方法和系统
公开(公告)号：US5801965A
公开(公告)日：1998-09-01
申请号：US362763
申请日：1994-12-22
申请人： Yuji Takagi , Hideaki Doi , Makoto Ono
发明人： Yuji Takagi , Hideaki Doi , Makoto Ono
IPC分类号： G01B11/24 , G01N21/94 , G01R31/26 , H01L21/66 , G06F19/00
CPC分类号： G01N21/94
摘要： The present invention relates to a method and system of inspecting a product, including extracting defects from the product, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects for inspection. The method and system is characterized in that the extracted feature data of the defects is fed back for inspecting the product. The present invention also relates to a method of manufacturing a semiconductor electric or electronic device, including extracting defects from the semiconductor electric or electronic device, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects to an apparatus for manufacturing the semiconductor electric or electronic device.
摘要翻译：本发明涉及一种检查产品的方法和系统，包括从产品中提取缺陷，基于代表缺陷类比的提取缺陷的信息对缺陷进行分类，基于缺陷提取缺陷的特征数据的缺陷分类结果，并将提取的缺陷的特征数据反馈进行检查。该方法和系统的特征在于反馈所提取的缺陷特征数据以检查产品。本发明还涉及一种制造半导体电气或电子设备的方法，包括从半导体电子或电子设备中提取缺陷，基于关于表示类似于缺陷的提取缺陷的信息来分类缺陷，提取特征基于缺陷分类的结果的缺陷的数据，并将提取的缺陷的特征数据反馈到用于制造半导体电子或电子设备的装置。

5. 发明授权

US4341837A Laminar thermoplastic resin structure 失效
标题翻译：层状热塑性树脂结构
公开(公告)号：US4341837A
公开(公告)日：1982-07-27
申请号：US64626
申请日：1979-08-07
申请人： Takayuki Katsuto , Shunzo Endo , Hideaki Doi , Naohiro Murayama
发明人： Takayuki Katsuto , Shunzo Endo , Hideaki Doi , Naohiro Murayama
IPC分类号： B32B27/08 , C08F8/00 , C08J5/12 , C09J151/00 , B32B27/36
CPC分类号： C09J151/006 , B32B27/08 , C08F8/00 , C08J5/128 , Y10T428/265 , Y10T428/2852 , Y10T428/2883 , Y10T428/31507 , Y10T428/31746 , Y10T428/31797 , Y10T428/3192 , Y10T428/31924 , Y10T428/31931
摘要： A laminar thermoplastic resin structure comprising a plurality of thermoplastic resin layers is obtained by bonding thermoplastic resin layers with a layer, or layers, of a maleic acid-modified block copolymer of a conjugated diene and an aromatic vinyl monomer interposed therebetween.The laminar structure thus obtained possesses a high bonding strength at elevated temperatures, and also excellent processability since the bonding layer per se is of thermoplastic nature. Thus, this laminar structure is particularly suitable as a material for use at elevated temperatures, for example, a packaging material for retort sterilization or a pipe for conducting hot fluids.
摘要翻译：通过将热塑性树脂层与介于其间的共轭二烯和芳香族乙烯基单体的马来酸改性嵌段共聚物的层或多层结合而获得包含多个热塑性树脂层的层状热塑性树脂结构。由此获得的层状结构在高温下具有高的结合强度，并且由于粘结层本身具有热塑性，因此也具有优异的加工性。因此，这种层状结构特别适用于在高温下使用的材料，例如用于蒸煮灭菌的包装材料或用于传导热流体的管道。

6. 发明授权

US06236057B1 Method of inspecting pattern and apparatus thereof with a differential brightness image detection 有权
标题翻译：用差分亮度图像检测来检查图案及其装置的方法
公开(公告)号：US06236057B1
公开(公告)日：2001-05-22
申请号：US09610954
申请日：2000-07-06
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N2188
CPC分类号： G01N21/95607
摘要： A method and apparatus for inspecting a pattern, a first image of a first area on a sample is acquired by imaging the first area formed as a first pattern, and the first image is memorized. A second image of a second area on the sample is acquired by imaging the second area formed as a second pattern which is to be the same as the first pattern. A defect of the first pattern is detected by acquiring a differential image between the first image and the second image. The detection of the defect includes processing the differential image by using information of brightness corresponding to both of the first image and the second image.
摘要翻译：通过对形成为第一图案的第一区域进行成像，并记录第一图像来获取用于检查图案的样品的第一区域的第一图像的方法和装置。通过对形成为与第一图案相同的第二图案的第二区域成像来获取样品上的第二区域的第二图像。通过获取第一图像和第二图像之间的差分图像来检测第一图案的缺陷。缺陷的检测包括通过使用与第一图像和第二图像两者相对应的亮度的信息来处理差分图像。

7. 发明授权

US6087673A Method of inspecting pattern and apparatus thereof 失效
标题翻译：检查图案及其装置的方法
公开(公告)号：US6087673A
公开(公告)日：2000-07-11
申请号：US81636
申请日：1998-05-20
申请人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
发明人： Chie Shishido , Takashi Hiroi , Haruo Yoda , Masahiro Watanabe , Asahiro Kuni , Maki Tanaka , Takanori Ninomiya , Hideaki Doi , Shunji Maeda , Mari Nozoe , Hiroyuki Shinoda , Atsuko Takafuji , Aritoshi Sugimoto , Yasutsugu Usami
IPC分类号： G01N23/20 , G01N21/88 , G01N21/956 , G01N23/225 , G06T1/00 , H01L21/66
CPC分类号： G01N21/95607
摘要： In a method of inspecting a defect and an apparatus thereof, an allowable range for a gradation value of a difference image is determined for each pixel from one pixel or less of position shift quantity between two images to be compared, a variation rate in a local gradation value of an image, and a representative value of the local gradation value. Then, by comparing the gradation value of the difference image with the allowable range determined for each pixel, a pixel, on which the gradation value of the difference image is within the allowable range, is judged to be an non-defective candidate and a pixel, on which the gradation value of the difference image is beyond the allowable range, is judged to be a defective candidate. This reduces the number of false information caused by mismatches attributed to an object to be inspected and an image detecting system, such as an infinitesimal difference in pattern configuration, a difference in the gradation value, a distortion of a pattern, and a position shift, thus making it possible to detect a more minute defect.
摘要翻译：在检查缺陷的方法和装置中，针对要比较的两个图像之间的位置偏移量的一个像素或更少的像素，针对每个像素确定差分图像的灰度值的允许范围，局部变化率图像的灰度值和局部灰度值的代表值。然后，通过将差分图像的灰度值与对于每个像素确定的容许范围进行比较，将差分图像的灰度值在允许范围内的像素判断为无缺陷候选和像素，其中差分图像的灰度值超出允许范围，被判断为缺陷候选。这减少了归因于待检查对象的失配和图像检测系统引起的错误信息的数量，例如图案配置中的无穷小差异，灰度值的差异，图案的失真和位置偏移，从而可以检测到更小的缺陷。

8. 发明授权

US5754621A X-ray inspection method and apparatus, prepreg inspecting method, and method for fabricating multi-layer printed circuit board 失效
标题翻译： X射线检查方法和装置，预浸料检查方法和制造多层印刷电路板的方法
公开(公告)号：US5754621A
公开(公告)日：1998-05-19
申请号：US769218
申请日：1996-12-18
申请人： Yoko Suzuki , Hideaki Doi , Yasuhiko Hara , Koichi Karasaki , Tadashi Iida
发明人： Yoko Suzuki , Hideaki Doi , Yasuhiko Hara , Koichi Karasaki , Tadashi Iida
IPC分类号： G01N23/04 , G01R31/304 , H05K3/00 , H05K3/46
CPC分类号： H05K3/4638 , G01N23/04 , G01R31/304 , H05K3/0008
摘要： An X-ray inspection apparatus and method in which an object to be inspected is irradiated with characteristic X-rays containing at least one wavelength which affords a high X-ray absorbance in the object to be inspected. A transmitted X-ray image which has passed through the object to be inspected is detected, and the object to be inspected is inspected on the basis of the transmitted X-ray image. The method and apparatus are utilized to fabricate a multi-layer printed circuit board.
摘要翻译：一种X射线检查装置和方法，其中被检查物体用包含至少一个波长的特征X射线照射，所述波长在被检测物体中提供高X射线吸光度。检测已经通过待检查对象的透射X射线图像，并且根据透射的X射线图像来检查被检查物体。该方法和装置用于制造多层印刷电路板。

9. 发明授权

US4504631A Photoresist material 失效
标题翻译：光刻胶材料
公开(公告)号：US4504631A
公开(公告)日：1985-03-12
申请号：US499486
申请日：1983-05-31
申请人： Hideaki Doi , Kenichi Kokubun , Teruo Sakagami , Naohiro Murayama
发明人： Hideaki Doi , Kenichi Kokubun , Teruo Sakagami , Naohiro Murayama
IPC分类号： C08F2/46 , C08F8/24
CPC分类号： C08F8/24
摘要： The photoresist material comprises a polymer having chloromethyl groups introduced therein and containing 2-isopropenylnaphthalene as one component, an average substitution degree of the chloromethyl groups based on the polymer is within a range of 0.2 to 5.The photoresist material has a high glass transition point, a high sensitivity to radiation and an excellent dry etching resistance, whereby it is suitably used for the manufacture of a semiconductor element using radiation and provides a good resolution on etching.
摘要翻译：光致抗蚀剂材料包括其中引入了氯甲基并含有2-异丙烯基萘作为一种组分的聚合物，基于聚合物的氯甲基的平均取代度在0.2至5的范围内。光致抗蚀剂材料具有高玻璃化转变点，对辐射的高灵敏度和优异的耐干蚀刻性，由此适用于制造使用辐射的半导体元件，并且在蚀刻时提供良好的分辨率。

10. 发明授权

US07263216B2 Pattern inspecting method and apparatus thereof, and pattern inspecting method on basis of electron beam images and apparatus thereof 有权
标题翻译：图案检查方法和装置，以及基于电子束图像的图案检查方法及其装置
公开(公告)号：US07263216B2
公开(公告)日：2007-08-28
申请号：US10637488
申请日：2003-08-11
申请人： Chie Shishido , Yuji Takagi , Shuji Maeda , Takanori Ninomiya , Takashi Hiroi , Masahiro Watanabe , Hideaki Doi
发明人： Chie Shishido , Yuji Takagi , Shuji Maeda , Takanori Ninomiya , Takashi Hiroi , Masahiro Watanabe , Hideaki Doi
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T5/006 , G06T2207/10061 , G06T2207/30148 , H01J37/226 , H01J37/28 , H01J2237/2448 , H01J2237/24592 , H01J2237/2482 , H01J2237/2806 , H01J2237/2817
摘要： A pattern inspecting method and apparatus for inspecting a defect or defective candidate of patterns on a sample includes picking up an image of a sample by shifting a sampling position on the sample, measuring geometric distortion in an image of a standard sample, beforehand, and defining a size for which the measured geometric distortion is neglectable, obtaining a first image of the sample and a second image to be compared with the first image, dividing the first image and the second stage into images of a division unit having a size not greater than the defined size, comparing a divided image of the first image with a divided image of the second image, and for calculating a difference in gradation values between both of the divided images. The defect or the defect candidate of the sample is extracted in accordance with the difference in the gradation values.
摘要翻译：用于检查样本上的图案的缺陷或缺陷候选的图案检查方法和装置包括：通过移动样本上的采样位置，预先测量标准样本的图像中的几何失真，并定义测量的几何失真可忽略的尺寸，获得样本的第一图像和要与第一图像比较的第二图像，将第一图像和第二阶段划分为尺寸不大于的尺寸的分割单元的图像定义的尺寸，将第一图像的分割图像与第二图像的分割图像进行比较，并且用于计算两个分割图像之间的灰度值差。根据灰度值的差异提取样本的缺陷或缺陷候选。

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