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    • 5. 发明授权
    • Method and device of inspecting three-dimensional shape defect
    • 检查三维形状缺陷的方法和装置
    • US06072899A
    • 2000-06-06
    • US12739
    • 1998-01-23
    • Yoko IrieHideaki DoiHiroya KoshishibaMineo Nomoto
    • Yoko IrieHideaki DoiHiroya KoshishibaMineo Nomoto
    • G01B11/24G06T1/00G06T7/00H05K3/00H05K3/06G06K9/00
    • G01B11/24G06T7/0008G06T2207/10028G06T2207/10064G06T2207/30141
    • A three-dimensional shaped defect inspecting method including a three-dimensional shape detection region selecting step for detecting a two-dimensional picture signal by taking a two-dimensional optical picture fluorescence emitted from a detection object and selecting a three-dimensional shape detection region in respect of the detection object based on the detected two-dimensional picture signal, and a three-dimensional shape determining step for detecting a picture signal by taking an optical picture in accordance with a height by reflected light from the detection object and sampling height information with a desired two-dimensional pixel size in respect of the selected three-dimensional shape inspection region with respect to the detected picture signal, thereby calculating and determining a three-dimensional shape, whereby a defect caused by a deficiency in thickness or the like on a wiring pattern of a solid shape, formed on a detection object of a circuit board or the like, can be detected in a short period of time, and its device.
    • 一种三维形缺陷检查方法,包括:三维形状检测区域选择步骤,用于通过从检测对象发出的二维光学图像荧光检测二维图像信号,并选择三维形状检测区域 基于检测到的二维图像信号对检测对象的尊重;以及三维形状确定步骤,用于通过根据来自检测对象的反射光和高度信息采集光学图像来检测图像信号,并且具有采样高度信息 相对于检测到的图像信号,对于所选择的三维形状检查区域的期望的二维像素尺寸,由此计算和确定三维形状,由此由于厚度等不足导致的缺陷 可以形成在电路板等的检测对象上的实心形状的布线图案 在短时间内被检测到,其设备。
    • 7. 发明授权
    • Method and system for manufacturing semiconductor devices, and method
and system for inspecting semiconductor devices
    • 用于制造半导体器件的方法和系统以及用于检查半导体器件的方法和系统
    • US5801965A
    • 1998-09-01
    • US362763
    • 1994-12-22
    • Yuji TakagiHideaki DoiMakoto Ono
    • Yuji TakagiHideaki DoiMakoto Ono
    • G01B11/24G01N21/94G01R31/26H01L21/66G06F19/00
    • G01N21/94
    • The present invention relates to a method and system of inspecting a product, including extracting defects from the product, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects for inspection. The method and system is characterized in that the extracted feature data of the defects is fed back for inspecting the product. The present invention also relates to a method of manufacturing a semiconductor electric or electronic device, including extracting defects from the semiconductor electric or electronic device, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects to an apparatus for manufacturing the semiconductor electric or electronic device.
    • 本发明涉及一种检查产品的方法和系统,包括从产品中提取缺陷,基于代表缺陷类比的提取缺陷的信息对缺陷进行分类,基于缺陷提取缺陷的特征数据 的缺陷分类结果,并将提取的缺陷的特征数据反馈进行检查。 该方法和系统的特征在于反馈所提取的缺陷特征数据以检查产品。 本发明还涉及一种制造半导体电气或电子设备的方法,包括从半导体电子或电子设备中提取缺陷,基于关于表示类似于缺陷的提取缺陷的信息来分类缺陷,提取特征 基于缺陷分类的结果的缺陷的数据,并将提取的缺陷的特征数据反馈到用于制造半导体电子或电子设备的装置。