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1. 发明授权

US06635962B2 Chip on chip semiconductor device 有权
标题翻译：片上半导体器件
公开(公告)号：US06635962B2
公开(公告)日：2003-10-21
申请号：US09950058
申请日：2001-09-12
申请人： Kazutaka Shibata , Shigeyuki Ueda , Toshio Enami
发明人： Kazutaka Shibata , Shigeyuki Ueda , Toshio Enami
IPC分类号： H01L2348
CPC分类号： H01L25/0652 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/05124 , H01L2224/05184 , H01L2224/05571 , H01L2224/05572 , H01L2224/05644 , H01L2224/16145 , H01L2224/45144 , H01L2924/01322 , H01L2924/00 , H01L2224/05139 , H01L2924/00014 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05169 , H01L2224/05171
摘要： In the case where a plurality of second semiconductor chips (2a and 2b) are bonded to the surface side of a first semiconductor chip (1) via bump electrodes (11 and 21), an interconnection (9) for directly connecting electrode terminals (22a and 22b) of the two second semiconductor chips (2a and 2b) is formed on the surface of a passivation film (17) of the first semiconductor chip (1). As a result, a semiconductor device of a COC type in which a plurality of second semiconductor chips are mounted, while obtaining generalization of the first semiconductor chip, a signal can be transmitted/received between the second semiconductor chips without changing the design of the semiconductor device in the first semiconductor chip and a method for manufacturing the semiconductor device can be provided.
摘要翻译：在通过凸块电极（11和21）将多个第二半导体芯片（2a和2b）接合到第一半导体芯片（1）的表面侧的情况下，用于直接连接电极端子（22a）的互连和第二半导体芯片（2a和2b）的表面形成在第一半导体芯片（1）的钝化膜（17）的表面上。结果，在获得第一半导体芯片的泛化的同时，在安装了多个第二半导体芯片的COC型半导体器件中，可以在不改变半导体的设计的情况下在第二半导体芯片之间发送/接收信号可以提供第一半导体芯片中的器件和半导体器件的制造方法。

2. 发明授权

US07645514B2 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body 有权
标题翻译：固化树脂组合物，粘合剂环氧树脂糊，粘合剂环氧树脂片，导电连接膏，导电连接片和电子部件接合体
公开(公告)号：US07645514B2
公开(公告)日：2010-01-12
申请号：US10541586
申请日：2003-12-26
申请人： Koji Watanabe , Toshio Enami , Yoshiyuki Takebe , Tatsuo Suzuki
发明人： Koji Watanabe , Toshio Enami , Yoshiyuki Takebe , Tatsuo Suzuki
IPC分类号： B32B27/38 , C09J163/00 , C08L63/00
CPC分类号： C09J9/02 , C08L63/00 , C08L2666/22 , C09J7/10 , C09J7/22 , C09J7/35 , C09J163/00 , C09J2201/602 , C09J2463/00 , Y10T428/31511 , Y10T428/31515 , Y10T428/31518 , Y10T428/31522 , Y10T428/31525 , Y10T428/31529
摘要： It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.
摘要翻译：本发明的目的是提供一种在固化后机械强度，耐热性，耐湿性，柔韧性，耐热循环性，耐回焊性，尺寸稳定性等优异的粘合可靠性和高粘合性的固化性树脂组合物，导电可靠性和粘合剂环氧树脂糊，粘合环氧树脂片，导电连接膏和使用该固化树脂组合物的导电连接片和电子部件接合体。本发明涉及含有环氧树脂，具有与环氧基反应的官能团的固体聚合物和环氧树脂固化剂的固化性树脂组合物，在树脂基体中没有观察到相分离结构，固化产物用重金属染色并用透射电子显微镜观察。

3. 发明授权

US08119323B2 Process for producing patterned film and photosensitive resin composition 有权
标题翻译：图案化膜和感光性树脂组合物的制造方法
公开(公告)号：US08119323B2
公开(公告)日：2012-02-21
申请号：US12304262
申请日：2006-10-19
申请人： Hiroji Fukui , Kenichi Aoki , Kunihiro Ichimura , Minoru Suezaki , Toshio Enami , Hideaki Ishizawa , Takao Unate , Hiroshi Kobayashi
发明人： Hiroji Fukui , Kenichi Aoki , Kunihiro Ichimura , Minoru Suezaki , Toshio Enami , Hideaki Ishizawa , Takao Unate , Hiroshi Kobayashi
IPC分类号： G03F7/00 , G03F7/004
CPC分类号： G03F7/36 , G03F7/0045 , G03F7/038
摘要： A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern. There is provided a process for producing a patterned film, comprising the steps of preparing a photosensitive resin composition that upon light irradiation, generates an acid or a base and is hardened; coating substrate (2) with the photosensitive resin composition to thereby form photosensitive resin composition layer (1) of given thickness; and exposing the photosensitive resin composition layer (1) selectively through mask (3) to light so as to travel at least portion of the photosensitive resin composition at unexposed regions toward the exposed regions and further effect hardening thereof, thereby obtaining patterned film (1A) furnished on its surface with protrusion/depression pattern.
摘要翻译：一种薄膜图案的制造方法，其中在基板上形成感光性树脂组合物层，并且通过掩模选择性地曝光于光，从而获得在其表面上设置有突起和凹陷的膜图案，而不需要去除层感光性树脂组合物在未曝光区域或曝光区域的显影; 以及用于上述制造薄膜图案的方法的感光性树脂组合物。提供一种图案化膜的制造方法，包括以下步骤：制备在光照射时产生酸或碱并被硬化的感光性树脂组合物; 用感光性树脂组合物涂布基材（2），形成规定厚度的感光性树脂组合物层（1）通过掩模（3）选择性地使感光性树脂组合物层（1）发光，使未曝光区域的感光性树脂组合物的至少一部分向露出区域移动，进一步进行硬化，得到图案化膜（1A）其表面上具有突起/凹陷图案。

4. 发明授权

US07591921B2 Heat-decaying materials, transfer sheet using the same, and patterning method 失效
标题翻译：热衰减材料，使用其的转印片和图案化方法
公开(公告)号：US07591921B2
公开(公告)日：2009-09-22
申请号：US10532747
申请日：2003-11-26
申请人： Hiroji Fukui , Toshio Enami
发明人： Hiroji Fukui , Toshio Enami
IPC分类号： B29C63/00 , B41M5/00 , B44C1/17 , G03G7/00
CPC分类号： C08G65/329 , C08G65/336 , C08J9/26 , C08J11/06 , C08J2300/30 , C08J2367/02 , C08L71/02 , H01L21/6835 , H01L21/7682 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/0101 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01054 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/3025 , H05K1/0373 , H05K3/048 , H05K3/20 , H05K3/3478 , H05K2201/0116 , H05K2201/0212 , H05K2201/10424 , H05K2203/041 , H05K2203/083 , H05K2203/1105 , Y02W30/701 , Y10T156/1153 , Y10T428/24802 , Y10T428/28 , H01L2924/00 , H01L2224/05099
摘要： Provided is a heat-decaying material that hardly deteriorates and decomposed at ordinary service temperatures, but decays within a short period of time when heated at relatively low temperatures. This comprises a polyoxyalkylene resin as the principal ingredient thereof, and has an oxygen atom content of from 15 to 55% by mass. When heated at a predetermined temperature falling between 150 and 350° C., at least 95% by mass of the material decays within 10 minutes. The heat-decaying material has many applications for production of porous materials, conductive particles transfer sheets, transfer sheets for circuit formation, pattern formation, etc.
摘要翻译：提供一种在一般使用温度下几乎不劣化和分解的热衰减材料，但在较低温度下加热时在短时间内衰减。这是以聚氧化烯树脂为主要成分，氧原子含量为15〜55质量％。当在150-350℃的预定温度下加热时，至少95质量％的材料在10分钟内衰变。热衰减材料有许多用于生产多孔材料，导电颗粒转印片，电路形成转印片，图案形成等的应用。

5. 发明申请

US20090202942A1 PROCESS FOR PRODUCING PATTERNED FILM AND PHOTOSENSITIVE RESIN COMPOSITION 有权
标题翻译：生产图案薄膜和感光树脂组合物的方法
公开(公告)号：US20090202942A1
公开(公告)日：2009-08-13
申请号：US12304262
申请日：2006-10-19
申请人： Hiroji Fukui , Kenichi Aoki , Kunihiro Ichimura , Minoru Suezaki , Toshio Enami , Hideaki Ishizawa , Takao Unate , Hiroshi Kobayashi
发明人： Hiroji Fukui , Kenichi Aoki , Kunihiro Ichimura , Minoru Suezaki , Toshio Enami , Hideaki Ishizawa , Takao Unate , Hiroshi Kobayashi
IPC分类号： G03F7/20 , G03F7/004
CPC分类号： G03F7/36 , G03F7/0045 , G03F7/038
摘要： A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern. There is provided a process for producing a patterned film, comprising the steps of preparing a photosensitive resin composition that upon light irradiation, generates an acid or a base and is hardened; coating substrate (2) with the photosensitive resin composition to thereby form photosensitive resin composition layer (1) of given thickness; and exposing the photosensitive resin composition layer (1) selectively through mask (3) to light so as to travel at least portion of the photosensitive resin composition at unexposed regions toward the exposed regions and further effect hardening thereof, thereby obtaining patterned film (1A) furnished on its surface with protrusion/depression pattern.
摘要翻译：一种薄膜图案的制造方法，其中在基板上形成感光性树脂组合物层，并通过掩模选择性地曝光于光，从而获得在其表面上设置有突起和凹陷的膜图案，而不需要去除层感光性树脂组合物在未曝光区域或曝光区域的显影; 以及用于上述制造薄膜图案的方法的感光性树脂组合物。提供一种图案化膜的制造方法，包括以下步骤：制备在光照射时产生酸或碱并被硬化的感光性树脂组合物; 用感光性树脂组合物涂布基材（2），形成规定厚度的感光性树脂组合物层（1）通过掩模（3）选择性地使感光性树脂组合物层（1）发光，使未曝光区域的感光性树脂组合物的至少一部分向露出区域移动，进一步进行硬化，得到图案化膜（1A）其表面上具有突起/凹陷图案。

6. 发明申请

US20060154078A1 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body 有权
标题翻译：固化树脂组合物，粘合剂环氧树脂糊，粘合剂环氧树脂片，导电连接膏，导电连接片和电子部件接合体
公开(公告)号：US20060154078A1
公开(公告)日：2006-07-13
申请号：US10541586
申请日：2003-12-26
申请人： Koji Watanabe , Toshio Enami , Yoshiyuki Takebe , Tatsuo Suzuki
发明人： Koji Watanabe , Toshio Enami , Yoshiyuki Takebe , Tatsuo Suzuki
IPC分类号： B32B27/38 , C08L63/00
CPC分类号： C09J9/02 , C08L63/00 , C08L2666/22 , C09J7/10 , C09J7/22 , C09J7/35 , C09J163/00 , C09J2201/602 , C09J2463/00 , Y10T428/31511 , Y10T428/31515 , Y10T428/31518 , Y10T428/31522 , Y10T428/31525 , Y10T428/31529
摘要： It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.
摘要翻译：本发明的目的是提供一种在固化后机械强度，耐热性，耐湿性，柔韧性，耐热循环性，耐回焊性，尺寸稳定性等优异的粘合可靠性和高粘合性的固化性树脂组合物，导电可靠性和粘合剂环氧树脂糊，粘合环氧树脂片，导电连接膏和使用该固化树脂组合物的导电连接片和电子部件接合体。本发明涉及含有环氧树脂，具有与环氧基反应的官能团的固体聚合物和环氧树脂固化剂的固化性树脂组合物，在树脂基体中没有观察到相分离结构，固化产物用重金属染色并用透射电子显微镜观察。

7. 发明申请

US20050276934A1 Thermally vanishing material, transfer sheet using the same, and method for forming pattern 失效
标题翻译：热消失材料，使用其的转印片材和形成图案的方法
公开(公告)号：US20050276934A1
公开(公告)日：2005-12-15
申请号：US10532747
申请日：2003-11-26
申请人： Hiroji Fukui , Toshio Enami
发明人： Hiroji Fukui , Toshio Enami
IPC分类号： B32B7/02 , C08G65/329 , C08G65/336 , C08J11/06 , C08K3/22 , C08K5/14 , C08K5/17 , C08K5/23 , C08K5/37 , C08L71/02 , C09J7/02 , C09J11/00 , C09J171/00 , H01B5/14 , H01L21/60 , H01L21/68 , H01L21/768 , H05K1/03 , H05K3/04 , H05K3/20 , H05K3/34 , B41M5/40
CPC分类号： C08G65/329 , C08G65/336 , C08J9/26 , C08J11/06 , C08J2300/30 , C08J2367/02 , C08L71/02 , H01L21/6835 , H01L21/7682 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/05571 , H01L2224/05624 , H01L2224/05647 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/0101 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01054 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01088 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/13091 , H01L2924/14 , H01L2924/3025 , H05K1/0373 , H05K3/048 , H05K3/20 , H05K3/3478 , H05K2201/0116 , H05K2201/0212 , H05K2201/10424 , H05K2203/041 , H05K2203/083 , H05K2203/1105 , Y02W30/701 , Y10T156/1153 , Y10T428/24802 , Y10T428/28 , H01L2924/00 , H01L2224/05099
摘要： Provided is a heat-decaying material that hardly deteriorates and decomposed at ordinary service temperatures, but decays within a short period of time when heated at relatively low temperatures. This comprises a polyoxyalkylene resin as the principal ingredient thereof, and has an oxygen atom content of from 15 to 55% by mass. When heated at a predetermined temperature falling between 150 and 350° C., at least 95% by mass of the material decays within 10 minutes. The heat-decaying material has many applications for production of porous materials, conductive particles transfer sheets, transfer sheets for circuit formation, pattern formation, etc.
摘要翻译：提供一种在一般使用温度下几乎不劣化和分解的热衰减材料，但在较低温度下加热时在短时间内衰减。这是以聚氧化烯树脂为主要成分，氧原子含量为15〜55质量％。当在150-350℃的预定温度下加热时，至少95质量％的材料在10分钟内衰变。热衰减材料有许多用于生产多孔材料，导电颗粒转印片，电路形成转印片，图案形成等的应用。

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