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    • 2. 发明授权
    • Surface acoustic wave device
    • 表面声波装置
    • US06469416B1
    • 2002-10-22
    • US09959954
    • 2001-11-13
    • Katsuhiro ItakuraAkihiro HachigoHideaki NakahataSatoshi FujiiShinichi Shikata
    • Katsuhiro ItakuraAkihiro HachigoHideaki NakahataSatoshi FujiiShinichi Shikata
    • H03H925
    • H03H9/02984H03H9/02574H03H9/02582
    • A surface acoustic wave (SAW) device is provided that is suitable for mass production and that has excellent operational performance at the superhigh-frequency range. The SAW device comprises (a) a diamond layer 3; (b) a ZnO layer 4, with a thickness of tz, formed on the diamond layer 3; (c) interdigital transducers (IDTs) 5, which excite and receive a SAW, formed on the ZnO layer 4; and (d) an SiO2 layer 6, with a thickness of ts, formed on the ZnO layer 4 so that the SiO2 layer can cover the IDTs 5. The structure of the SAW device is determined by specific numeric ranges of the parameters kh1 and kh2, which are given in equations kh1=5·2&pgr;·(tz/&lgr;) and kh2=5·2&pgr;(ts/&lgr;), where &lgr; signifies the wavelength of the fundamental wave of the second mode of the SAW. The SAW device uses the fifth harmonic of the second mode of the SAW.
    • 提供了适用于批量生产并且在超高频范围内具有优异的操作性能的表面声波(SAW)装置。 SAW器件包括(a)金刚石层3; (b)在金刚石层3上形成厚度为tz的ZnO层4; (c)在ZnO层4上形成的用于激发和接收SAW的叉指换能器(IDT)5; 和(d)在ZnO层4上形成厚度为ts的SiO 2层6,使得SiO 2层可以覆盖IDT 5. SAW器件的结构由参数kh1和kh2的特定数值范围确定 ,其方程式为kh1 = 5.2pi(tz / lambd)和kh2 = 5.2pi(ts / lambd),其中lambd表示SAW的第二模式的基波的波长。 SAW器件使用SAW的第二模式的第五谐波。
    • 4. 发明授权
    • Surface acoustic wave element
    • 表面声波元件
    • US06713941B2
    • 2004-03-30
    • US10204454
    • 2002-08-21
    • Katsuhiro ItakuraAkihiro HachigoHideaki NakahataSatoshi FujiiShinichi Shikata
    • Katsuhiro ItakuraAkihiro HachigoHideaki NakahataSatoshi FujiiShinichi Shikata
    • H03H925
    • H03H9/02582
    • A surface acoustic wave (SAW) device that is suitable for mass production and that has excellent operational performance at the superhigh-frequency range. The SAW device comprises (a) a diamond layer 3; (b) a ZnO layer 4, with a thickness of tz, formed on the diamond layer 3; (c) interdigital transducers (IDTs) 5, which excite and receive a SAW, formed on the ZnO layer 4; and (d) an SiO2 layer 6, with a thickness of ts, formed on the ZnO layer 4 so that the SiO2 layer can cover the IDTs 5. The structure of the SAW device is determined by specific numeric ranges of the parameters kh1 and kh2, which are given in equations kh1=3·2&pgr;·(tz/&lgr;) and kh2=3·2&pgr;·(ts/&lgr;), where &lgr; signifies the wavelength of the fundamental wave of the second Sezawa mode of the SAW. The SAW device uses the third harmonic of the second Sezawa mode of the SAW excited.
    • 一种适用于大规模生产且在超高频范围内具有出色的运行性能的表面声波(SAW)器件。 SAW器件包括(a)金刚石层3; (b)在金刚石层3上形成厚度为tz的ZnO层4; (c)在ZnO层4上形成的用于激发和接收SAW的叉指换能器(IDT)5; 和(d)在ZnO层4上形成厚度为ts的SiO 2层6,使得SiO 2层可以覆盖IDT 5. SAW器件的结构由参数kh1和kh2的特定数值范围确定 ,其方程式为kh1 = 3.2pi(tz /λ)和kh2 = 3.2pi(ts / lambda),其中λ表示SAW的第二Sezawa模式的基波的波长。 SAW器件使用SAW激励的第二Sezawa模式的三次谐波。
    • 9. 发明授权
    • Method of manufacturing a surface acoustic wave element
    • 声表面波元件的制造方法
    • US5497726A
    • 1996-03-12
    • US240826
    • 1994-05-11
    • Shinichi ShikataAkihiro HachigoHideaki NakahataKenjiro Higaki
    • Shinichi ShikataAkihiro HachigoHideaki NakahataKenjiro Higaki
    • H03H3/08H03H9/02H03H9/25C30B23/04C30B29/02C30B29/04
    • H03H9/02582H03H3/08
    • A surface acoustic wave element has a diamond layer, a piezoelectric thin film formed on the diamond layer, and a pair of electrodes for generating a surface acoustic wave having a specific wavelength and extracting the surface acoustic wave, wherein at least one electrode is a copper electrode epitaxially grown on the surface of the diamond layer. To manufacture this surface acoustic wave element, after the diamond layer is formed on a substrate by epitaxial growth, the copper electrodes each having the predetermined shape are formed on the surface of the diamond layer by epitaxial growth. Since the copper electrodes formed on the diamond layer consist of high-quality single crystal copper, resistances to electromigration and stress migrations can be increased. As a result, there is provided an excellent surface acoustic wave element free from electrical defects caused by degradation and failure of the copper electrodes or free from degradation of the electrical characteristics.
    • 表面声波元件具有金刚石层,形成在金刚石层上的压电薄膜,以及一对电极,用于产生具有特定波长并提取表面声波的表面声波,其中至少一个电极是铜 在金刚石层的表面上外延生长的电极。 为了制造该声表面波元件,在通过外延生长在基板上形成金刚石层之后,通过外延生长在金刚石层的表面上形成各具有预定形状的铜电极。 由于形成在金刚石层上的铜电极由高质量的单晶铜组成,所以可以提高电迁移和应力迁移的电阻。 结果,提供了由于铜电极的劣化和故障而导致的不受电特性降低的电缺陷的优异的表面声波元件。
    • 10. 发明授权
    • Surface acoustic wave element
    • 表面声波元件
    • US5446329A
    • 1995-08-29
    • US118976
    • 1993-09-09
    • Hideaki NakahataAkihiro HachigoKenjiro HigakiShinichi Shikata
    • Hideaki NakahataAkihiro HachigoKenjiro HigakiShinichi Shikata
    • H03H9/145H03H9/02H03H9/25H01L41/08
    • H03H9/02582
    • A surface acoustic wave element includes a hard layer containing a composition component essentially consisting of at least one of diamond and a diamond-like carbon film, a piezoelectric layer formed on the hard layer, a silicon dioxide (SiO.sub.2) layer formed on the piezoelectric layer, and electrodes combined with the piezoelectric layer to perform electro-mechanical conversion. The surface acoustic wave element has a larger electro-mechanical coupling coefficient and a higher surface acoustic wave propagation velocity than does a conventional surface acoustic wave element having no silicon dioxide layer, thereby obtaining a surface acoustic wave element that can operate in a high-frequency range. In particular, the electro-mechanical coupling coefficient is increased. The SiO.sub.2 layer is an electric insulator and rarely reacts with moisture or acids. The SiO.sub.2 layer protects the piezoelectric layer and the electrodes from effects of the external environment, thereby providing a surface acoustic wave element having good high-frequency characteristics and a high resistance to adverse environments.
    • 表面声波元件包括含有基本上由金刚石和类金刚石碳膜中的至少一种组成的组成成分的硬质层,形成在硬质层上的压电层,形成在压电层上的二氧化硅(SiO 2)层 和与压电层结合的电极进行机电转换。 表面声波元件比没有二氧化硅层的常规表面声波元件具有更大的机电耦合系数和更高的表面声波传播速度,从而获得可以在高频下工作的表面声波元件 范围。 特别地,机电耦合系数增加。 SiO2层是电绝缘体,很少与水分或酸反应。 SiO 2层保护压电层和电极免受外部环境的影响,从而提供具有良好的高频特性和对不利环境的高抗性的表面声波元件。