会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Optimized mirror design for optical direct write
    • 优化的镜面设计,用于光学直写
    • US07270942B2
    • 2007-09-18
    • US10825342
    • 2004-04-14
    • Nicholas K. EibEbo CroffieNeal Callan
    • Nicholas K. EibEbo CroffieNeal Callan
    • G03B27/54
    • G03F7/70291G02B26/001G02B26/0833G03F7/70283
    • The present invention provides an optimized direct write lithography system using optical mirrors. That is, a maskless lithography system is provided. The maskless direct-write lithography system provided uses an array of mirrors configured to operate in a tilting mode, a piston-displacement mode, or both in combination. The controlled mirror array is used as a substitute for the traditional chrome on glass masks. In order to avoid constraining the system to forming edges of patterns aligned with the array of mirrors, gray-scale techniques are used for subpixel feature placement. The direct-writing of a pattern portion may rely on a single mirror mode or a combination of modes.
    • 本发明提供使用光学镜的优化的直写光刻系统。 也就是说,提供无掩模光刻系统。 所提供的无掩模直写光刻系统使用配置成以倾斜模式,活塞位移模式或两者组合地操作的反射镜阵列。 受控反射镜阵列用作传统镀铬玻璃面罩的替代品。 为了避免将系统约束以形成与反射镜阵列对准的图案的边缘,使用灰度技术用于子像素特征放置。 图案部分的直接写入可以依赖于单一镜像模式或模式的组合。
    • 6. 发明授权
    • Process window compliant corrections of design layout
    • 过程窗口符合设计布局校正
    • US07313508B2
    • 2007-12-25
    • US10330929
    • 2002-12-27
    • Ebo CroffieColin YatesNicholas EibChristopher NevilleMario GarzaNeal Callan
    • Ebo CroffieColin YatesNicholas EibChristopher NevilleMario GarzaNeal Callan
    • G06F17/50
    • G03F1/36
    • The invention provides a method of performing process window compliant corrections of a design layout. The invention includes an operator performing the following steps: (1) simulating Develop Inspect Critical Dimension (DI CD) at best exposure conditions using the provided original layout pattern; (2) simulating DI CD at predefined boundary exposure conditions using the provided original layout pattern; (3) if the DI CD from step (1) meets the target DI CD definition, and the DI CD from step (2) meets process window specifications, convergence takes place; and (4) modifying the layout pattern and repeating steps (2) through (3) until DI CD from step (2) reaches the specification limit if any portion of step (3) is not achieved.
    • 本发明提供了一种执行设计布局的兼容过程窗口校正的方法。 本发明包括一个操作员执行以下步骤:(1)使用提供的原始布局模式在最佳曝光条件下模拟发现检查临界尺寸(DI CD); (2)使用提供的原始布局图案在预定边界曝光条件下模拟DI CD; (3)如果来自步骤(1)的DI CD符合目标DI CD定义,并且步骤(2)的DI CD符合过程窗口规范,则会发生收敛; (4)如果没有实现步骤(3)的任何部分,则修改布局图案并重复步骤(2)至(3),直到来自步骤(2)的DI CD达到规格极限。
    • 7. 发明授权
    • Mask defect analysis for both horizontal and vertical processing effects
    • 水平和垂直处理效果的掩模缺陷分析
    • US07149340B2
    • 2006-12-12
    • US10251082
    • 2002-09-20
    • Paul FilsethNeal CallanKunal TaravadeMario Garza
    • Paul FilsethNeal CallanKunal TaravadeMario Garza
    • G06K9/00
    • G03F1/84G06K9/48G06K9/6206G06T7/001G06T2207/30148
    • A method and system for detecting defects in a physical mask used for fabricating a semiconductor device having multiple layers is disclosed, where each layer has a corresponding mask. The method and system include receiving a digital image of the mask, and automatically detecting edges of the mask in the image using pattern recognition. The detected edges, which are stored in a standard format, are imported along with processing parameters into a process simulator that generates an estimated aerial image of the silicon layout that would be produced by a scanner using the mask and the parameters. The estimated aerial image is then compared to an intended aerial image of the same layer, and any differences found that are greater than predefined tolerances are determined to horizontal defects. In addition, effects that the horizontal defects may have on adjacent layers are analyzed to discover vertical defects.
    • 公开了一种用于检测用于制造具有多层的半导体器件的物理掩模中的缺陷的方法和系统,其中每层具有相应的掩模。 该方法和系统包括接收掩模的数字图像,并使用模式识别自动检测图像中的掩模的边缘。 以标准格式存储的检测到的边缘与处理参数一起导入到生成由扫描仪使用掩模和参数产生的硅布局的估计空间图像的过程模拟器中。 然后将估计的空中图像与同一层的预期空间图像进行比较,并且发现大于预定公差的任何差异被确定为水平缺陷。 此外,分析水平缺陷可能对相邻层产生的影响以发现垂直缺陷。