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    • 1. 发明授权
    • Process window compliant corrections of design layout
    • 过程窗口符合设计布局校正
    • US07313508B2
    • 2007-12-25
    • US10330929
    • 2002-12-27
    • Ebo CroffieColin YatesNicholas EibChristopher NevilleMario GarzaNeal Callan
    • Ebo CroffieColin YatesNicholas EibChristopher NevilleMario GarzaNeal Callan
    • G06F17/50
    • G03F1/36
    • The invention provides a method of performing process window compliant corrections of a design layout. The invention includes an operator performing the following steps: (1) simulating Develop Inspect Critical Dimension (DI CD) at best exposure conditions using the provided original layout pattern; (2) simulating DI CD at predefined boundary exposure conditions using the provided original layout pattern; (3) if the DI CD from step (1) meets the target DI CD definition, and the DI CD from step (2) meets process window specifications, convergence takes place; and (4) modifying the layout pattern and repeating steps (2) through (3) until DI CD from step (2) reaches the specification limit if any portion of step (3) is not achieved.
    • 本发明提供了一种执行设计布局的兼容过程窗口校正的方法。 本发明包括一个操作员执行以下步骤:(1)使用提供的原始布局模式在最佳曝光条件下模拟发现检查临界尺寸(DI CD); (2)使用提供的原始布局图案在预定边界曝光条件下模拟DI CD; (3)如果来自步骤(1)的DI CD符合目标DI CD定义,并且步骤(2)的DI CD符合过程窗口规范,则会发生收敛; (4)如果没有实现步骤(3)的任何部分,则修改布局图案并重复步骤(2)至(3),直到来自步骤(2)的DI CD达到规格极限。
    • 8. 发明申请
    • Attenuated film with etched quartz phase shift mask
    • 具有蚀刻石英相移掩模的衰减薄膜
    • US20050019673A1
    • 2005-01-27
    • US10624662
    • 2003-07-22
    • Kunal TaravadeEbo CroffieNeal Callan
    • Kunal TaravadeEbo CroffieNeal Callan
    • G03F1/00G03F9/00
    • G03F1/32
    • A phase shift mask which includes an etched quartz region that provides a 180 degree phase shift, and an attenuated film which provides a 0 (or 360) degree phase shift. The phase shift mask provides performance comparable to CPL, while at the same time, avoiding the problems and manufacturability issues associated with EDA. The phase shift mask has better contrast than CPL, and a process window that is comparable to both CPL and alternating phase shift masks. The phase shift mask that does not require a second critical write, as is the case with CPL, does not need a second mask to eliminate unwanted patterns resulting from phase edges, and does not need a complicated EDA solution (like CPL). Finally, the phase shift mask is simple to manufacture, requiring only a single write step if employed with the back-side exposure technique which is well known in the mask-making industry.
    • 包括提供180度相移的蚀刻石英区域和提供0(或360度)相移的衰减膜的相移掩模。 相移掩码提供与CPL相当的性能,同时避免与EDA相关的问题和可制造性问题。 相移掩模具有比CPL更好的对比度,以及与CPL和交替相移掩模相当的处理窗口。 与CPL的情况一样,不需要第二次临界写入的相移掩模不需要第二个掩模来消除由相位边缘产生的不必要的图形,并且不需要复杂的EDA解决方案(如CPL)。 最后,相位掩模制造简单,如果采用掩模制造行业所熟知的背面曝光技术,则仅需要一个写入步骤。
    • 9. 发明授权
    • Optimized mirror design for optical direct write
    • 优化的镜面设计,用于光学直写
    • US07270942B2
    • 2007-09-18
    • US10825342
    • 2004-04-14
    • Nicholas K. EibEbo CroffieNeal Callan
    • Nicholas K. EibEbo CroffieNeal Callan
    • G03B27/54
    • G03F7/70291G02B26/001G02B26/0833G03F7/70283
    • The present invention provides an optimized direct write lithography system using optical mirrors. That is, a maskless lithography system is provided. The maskless direct-write lithography system provided uses an array of mirrors configured to operate in a tilting mode, a piston-displacement mode, or both in combination. The controlled mirror array is used as a substitute for the traditional chrome on glass masks. In order to avoid constraining the system to forming edges of patterns aligned with the array of mirrors, gray-scale techniques are used for subpixel feature placement. The direct-writing of a pattern portion may rely on a single mirror mode or a combination of modes.
    • 本发明提供使用光学镜的优化的直写光刻系统。 也就是说,提供无掩模光刻系统。 所提供的无掩模直写光刻系统使用配置成以倾斜模式,活塞位移模式或两者组合地操作的反射镜阵列。 受控反射镜阵列用作传统镀铬玻璃面罩的替代品。 为了避免将系统约束以形成与反射镜阵列对准的图案的边缘,使用灰度技术用于子像素特征放置。 图案部分的直接写入可以依赖于单一镜像模式或模式的组合。