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    • 1. 发明授权
    • Method of end point detection using a sinusoidal interference signal for
a wet etch process
    • 使用用于湿式蚀刻工艺的正弦干涉信号的端点检测方法
    • US5956142A
    • 1999-09-21
    • US937572
    • 1997-09-25
    • K. Paul MullerKlaus Dieter Penner
    • K. Paul MullerKlaus Dieter Penner
    • C23F1/00G01B11/06H01L21/306G01B9/02
    • G01B11/0683
    • A process for monitoring and determining the end point of a wet etch process for removing a thin solid film 116 from a substrate by directing a light beam onto the substrate and monitoring the intensity of reflected beams, including the step of selecting a coherence length of the incoming beam 120 so that it is small enough so that no interference occurs in the liquid layer and large enough so that interference can occur in the thin solid film, i.e., light reflected from the interface between the liquid 118 and the top of the thin film, and light reflected from the interface between the bottom of the thin solid film and the substrate interferes. If the liquid layer is about 100 micrometers thick, and the thin film is about 1 micrometer thick, a coherence length of about 10 micrometers is suitable. Such coherence length can be provided with a suitable bandpass filter.
    • 一种用于监测和确定湿式蚀刻工艺的终点的方法,用于通过将光束引导到衬底上并监测反射光束的强度来从衬底去除薄的固体膜116,包括选择相干长度的步骤 进入光束120使其足够小,使得在液体层中不会发生干扰并且足够大,使得在薄的固体膜中可能发生干扰,即从液体118和薄膜的顶部之间的界面反射的光 并且从薄固体膜的底部与基板之间的界面反射的光干涉。 如果液体层的厚度约为100微米,薄膜的厚度约为1微米,则约10微米的相干长度是合适的。 这种相干长度可以提供合适的带通滤波器。
    • 4. 发明申请
    • REDUCED SOFT ERROR RATE THROUGH METAL FILL AND PLACEMENT
    • 通过金属填充和放置减少软错误率
    • US20100301463A1
    • 2010-12-02
    • US12473435
    • 2009-05-28
    • K. Paul MullerAlicia Wang
    • K. Paul MullerAlicia Wang
    • H01L23/556H01L21/71
    • H01L23/556H01L23/522H01L2924/0002H01L2924/00
    • A method for reducing single event upsets in an integrated circuit includes the step of providing a plurality of levels within the integrated circuit, wherein the plurality of levels within the integrated circuit are in a stacked arrangement. The method also includes the step of providing a plurality of metal fill patterns within each of the plurality of levels within the integrated circuit. The method further includes the step of placing the plurality of metal fill patterns within at least one of the plurality of levels in a pattern such that a line of sight towards an active silicon layer does not exist within the stacked arrangement of the plurality of levels, thereby increasingly absorbing ionizing radiation particles, and thereby reducing single event upsets in the integrated circuit.
    • 一种用于减少集成电路中的单事件扰乱的方法包括在集成电路内提供多个电平的步骤,其中集成电路内的多个电平处于堆叠布置。 该方法还包括在集成电路内的多个电平的每一个内提供多个金属填充图案的步骤。 该方法还包括将多个金属填充图案放置在多个层中的至少一个层中的图案的步骤,使得朝向有源硅层的视线不存在于多个层次的堆叠布置中, 从而越来越多地吸收电离辐射颗粒,从而减少集成电路中的单个事件的不适。
    • 5. 发明授权
    • Alignment insensitive D-cache cell
    • 对齐不敏感的D缓存单元
    • US07304352B2
    • 2007-12-04
    • US11111454
    • 2005-04-21
    • K. Paul MullerKevin A. BatsonMichael J. Lee
    • K. Paul MullerKevin A. BatsonMichael J. Lee
    • H01L29/76H01L29/94
    • G11C11/412H01L27/11H01L27/1104Y10S257/903Y10S257/904
    • A D-Cache SRAM cell having a modified design in schematic and layout that exhibits increased symmetry from the circuit schematic and the physical cell layout perspectives. That is, the SRAM cell includes two read ports and minimizes asymmetry by provisioning one read port on a true side and one on the complement side. Asymmetry is additionally minimized in layout as cross coupling on both the true and complement sides rises up one level by providing from the local interconnect level a via connection to a M1 or metallization level. Moreover, the distance between the local interconnect (MC) and the gate conductor structure (PC) has been enlarged and equalized for each of the pFETs in the cross-latched SRAM cell. As a result, the SRAM cell has been rendered insensitive to overlay (local interconnect processing too close) by maximizing this MC-PC distance.
    • 具有改进的示意图和布局设计的D缓存SRAM单元,其显示出来自电路原理图和物理单元布局视角的增加的对称性。 也就是说,SRAM单元包括两个读取端口,并且通过在真实侧提供一个读取端口和在补充端上提供一个读取端口来最小化不对称性。 通过从本地互连级别提供通向M1或金属化级别的通孔连接,通过从真实和补偿侧两者的交叉耦合上升到一个级别,不对称性在布局中另外最小化。 此外,局部互连(MC)和栅极导体结构(PC)之间的距离已经在交叉锁存SRAM单元中的每个pFET被放大和均衡。 因此,通过最大化这个MC-PC距离,SRAM单元已经对覆盖(局部互连处理太近)变得不敏感。