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1. 发明申请

US20090207880A1 AUTOMATED CONTROL OF ROTATIONAL VELOCITY OF AN AIR-MOVING DEVICE OF AN ELECTRONICS RACK RESPONSIVE TO AN EVENT 有权
标题翻译：对事件响应的电子机架的空气移动装置的旋转速度的自动控制
公开(公告)号：US20090207880A1
公开(公告)日：2009-08-20
申请号：US12031952
申请日：2008-02-15
申请人： Steven J. AHLADAS , Gary N. GOTH , Robert P. MAKOWICKI , Katie L. PIZZOLATO
发明人： Steven J. AHLADAS , Gary N. GOTH , Robert P. MAKOWICKI , Katie L. PIZZOLATO
IPC分类号： G01K13/00
CPC分类号： G01K13/00 , G06F1/206
摘要： Automated control is provided of rotational velocity of an air-moving device cooling an electronics subsystem of an electronics rack. The automated control includes: automatically responding to a failure event associated with the electronics subsystem of the rack by setting rotational velocity of the air-moving device to a first upper limit (RPM1) above a normal operating limit; sensing motor temperature of a motor of the air-moving device; automatically increasing rotational velocity of the air-moving device to a second upper limit (RPM2) if the sensed motor temperature is below a first predefined temperature threshold (T1), wherein RPM2>RPM 1; maintaining rotational velocity of the air-moving device at the second upper limit while the sensed motor temperature is below a second predefined temperature threshold (T2), wherein T2>T1; and returning to normal operating rotational velocity of the air-moving device subsequent to servicing of the electronics rack responsive to the event.
摘要翻译：提供了冷却电子机架的电子子系统的空气移动装置的旋转速度的自动控制。自动控制包括：通过将空气移动装置的旋转速度设定在高于正常操作极限的第一上限（RPM1）来自动响应与机架的电子子系统相关联的故障事件; 感测气动装置的电机的电机温度; 如果感测到的电动机温度低于第一预定温度阈值（T1），则将空气移动装置的旋转速度自动增加到第二上限（RPM2），其中RPM2> RPM1; 在感测到的电动机温度低于第二预定温度阈值（T2）的同时保持空气移动装置的旋转速度处于第二上限，其中T2> T1; 并且响应于该事件，在对电子机架进行维修之后，返回到空气移动装置的正常操作旋转速度。

2. 发明授权

US07768222B2 Automated control of rotational velocity of an air-moving device of an electronics rack responsive to an event 有权
标题翻译：自动控制响应于事件的电子机架的空气移动装置的旋转速度
公开(公告)号：US07768222B2
公开(公告)日：2010-08-03
申请号：US12031952
申请日：2008-02-15
申请人： Steven J. Ahladas , Gary N. Goth , Robert P. Makowicki , Katie L. Pizzolato
发明人： Steven J. Ahladas , Gary N. Goth , Robert P. Makowicki , Katie L. Pizzolato
IPC分类号： H02P7/00 , H02P31/00
CPC分类号： G01K13/00 , G06F1/206
摘要： Automated control is provided of rotational velocity of an air-moving device cooling an electronics subsystem of an electronics rack. The automated control includes: automatically responding to a failure event associated with the electronics subsystem of the rack by setting rotational velocity of the air-moving device to a first upper limit (RPM1) above a normal operating limit; sensing motor temperature of a motor of the air-moving device; automatically increasing rotational velocity of the air-moving device to a second upper limit (RPM2) if the sensed motor temperature is below a first predefined temperature threshold (T1), wherein RPM2>RPM 1; maintaining rotational velocity of the air-moving device at the second upper limit while the sensed motor temperature is below a second predefined temperature threshold (T2), wherein T2>T1; and returning to normal operating rotational velocity of the air-moving device subsequent to servicing of the electronics rack responsive to the event.
摘要翻译：提供了冷却电子机架的电子子系统的空气移动装置的旋转速度的自动控制。自动控制包括：通过将空气移动装置的旋转速度设定在高于正常操作极限的第一上限（RPM1）来自动响应与机架的电子子系统相关联的故障事件; 感测气动装置的电机的电机温度; 如果感测到的电动机温度低于第一预定温度阈值（T1），则将空气移动装置的旋转速度自动增加到第二上限（RPM2），其中RPM2> RPM1; 在感测到的电动机温度低于第二预定温度阈值（T2）的同时保持空气移动装置的旋转速度处于第二上限，其中T2> T1; 并且响应于该事件，在对电子机架进行维修之后，返回到空气移动装置的正常操作旋转速度。

3. 发明授权

US09053223B2 Modular refrigeration unit health monitoring 有权
标题翻译：模块化制冷机组健康监测
公开(公告)号：US09053223B2
公开(公告)日：2015-06-09
申请号：US13355063
申请日：2012-01-20
申请人： Scott Hadderman , Timothy R. Marchini , K. Paul Muller , Katie L. Pizzolato , Andrew H. Vogel
发明人： Scott Hadderman , Timothy R. Marchini , K. Paul Muller , Katie L. Pizzolato , Andrew H. Vogel
IPC分类号： G21C17/00 , G06F15/00 , G06F11/34 , G06F11/30
CPC分类号： G06F11/3476 , F25B49/005 , G06F1/206 , G06F11/3058 , G06F11/3072
摘要： A method for modular refrigeration unit (MRU) health monitoring includes receiving log data on a log data input from the MRU by a MRU health monitor, the log data comprising a plurality of datapoints, each of the plurality of datapoints comprising a position of a control valve of the MRU and a corresponding time; determining by the MRU health monitor a plurality of MRU parameters from the log data; determining a plurality of MRU health flags based on the MRU parameters; adding the plurality of MRU health flags to determine an MRU health score; determining whether the MRU health score is higher than a replacement threshold; and indicating replacement of the MRU in the event the MRU health score is higher than the replacement threshold.
摘要翻译：一种用于模块化制冷单元（MRU）健康监测的方法包括：通过MRU健康监视器接收来自MRU的日志数据的日志数据，所述日志数据包括多个数据点，所述多个数据点中的每一个包括控制的位置 MRU的阀门和相应的时间; 由MRU健康监视器根据对数数据确定多个MRU参数; 基于MRU参数确定多个MRU健康标志; 添加多个MRU健康标志以确定MRU健康评分; 确定MRU健康评分是否高于置换阈值; 并且在MRU健康评分高于替换阈值的情况下指示MRU的替换。

4. 发明授权

US08936443B2 Dynamic compensation of airflow in electronics enclosures with failed fans 有权
标题翻译：动态补偿风扇失效的电子机柜中的气流
公开(公告)号：US08936443B2
公开(公告)日：2015-01-20
申请号：US13562597
申请日：2012-07-31
申请人： Benjamin William Mashak , Arden Lot Moore , Katie L. Pizzolato
发明人： Benjamin William Mashak , Arden Lot Moore , Katie L. Pizzolato
IPC分类号： F04B41/06 , F04B49/22 , H05K5/00
CPC分类号： F04D27/001 , F04D25/166 , F04D27/002
摘要： An approach is provided in which a cooling manager detects a failed fan included in an electronic enclosure. The electronic enclosure includes multiple fans that each cool different component areas in the electronic enclosure. The cooling manager selects an airflow compensator that corresponds to a functioning fan included in the electronic enclosure, which includes a fixed perforated member and a movable perforated member. In turn, the cooling manager adjusts the selected airflow compensator to redirect a portion of airflow generated by the functioning fan to the component area corresponding to the failed fan.
摘要翻译：提供了一种方法，其中冷却管理器检测包括在电子外壳中的故障风扇。电子机箱包括多个风扇，每个风扇都可以冷却电子机箱中的不同组件区域。冷却管理器选择对应于包括在电子外壳中的功能风扇的气流补偿器，其包括固定的穿孔构件和可移动的穿孔构件。反过来，冷却管理器调整所选择的气流补偿器，以将由功能风扇产生的气流的一部分重定向到与故障风扇对应的部件区域。

5. 发明申请

US20130191072A1 MODULAR REFRIGERATION UNIT HEALTH MONITORING 有权
标题翻译：模块化制冷单元卫生监测
公开(公告)号：US20130191072A1
公开(公告)日：2013-07-25
申请号：US13355063
申请日：2012-01-20
申请人： Scott Hadderman , Timothy R. Marchini , K. Paul Muller , Katie L. Pizzolato , Andrew H. Vogel
发明人： Scott Hadderman , Timothy R. Marchini , K. Paul Muller , Katie L. Pizzolato , Andrew H. Vogel
IPC分类号： G21C17/00 , G06F15/00
CPC分类号： G06F11/3476 , F25B49/005 , G06F1/206 , G06F11/3058 , G06F11/3072
摘要： A method for modular refrigeration unit (MRU) health monitoring includes receiving log data on a log data input from the MRU by a MRU health monitor, the log data comprising a plurality of datapoints, each of the plurality of datapoints comprising a position of a control valve of the MRU and a corresponding time; determining by the MRU health monitor a plurality of MRU parameters from the log data; determining a plurality of MRU health flags based on the MRU parameters; adding the plurality of MRU health flags to determine an MRU health score; determining whether the MRU health score is higher than a replacement threshold; and indicating replacement of the MRU in the event the MRU health score is higher than the replacement threshold.
摘要翻译：一种用于模块化制冷单元（MRU）健康监测的方法包括：通过MRU健康监视器接收来自MRU的日志数据的日志数据，所述日志数据包括多个数据点，所述多个数据点中的每一个包括控制的位置 MRU的阀门和相应的时间; 由MRU健康监视器根据对数数据确定多个MRU参数; 基于MRU参数确定多个MRU健康标志; 添加多个MRU健康标志以确定MRU健康评分; 确定MRU健康评分是否高于置换阈值; 并且在MRU健康评分高于替换阈值的情况下指示MRU的替换。

6. 发明申请

US20120199333A1 CUSTOMIZED THERMAL INTERFACE TO OPTIMIZE MECHANICAL LOADING AND THERMAL CONDUCTIVITY CHARACTERISTICS 有权
标题翻译：定制的热接口优化机械负载和热导率特性
公开(公告)号：US20120199333A1
公开(公告)日：2012-08-09
申请号：US13020102
申请日：2011-02-03
申请人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
发明人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
IPC分类号： F28F7/00 , B23P11/00
CPC分类号： F28F13/00 , B23P2700/10 , F28F2013/006 , H01L23/433 , H01L2924/0002 , H05K7/20509 , Y10T29/49826 , H01L2924/00
摘要： A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.
摘要翻译：一种通过冷却板冷却一个或多个设备的方法，系统和装置。示例性系统包括耦合到冷却板的多个热产生装置，每个通过单独的热接口单元。热接口单元包括具有至少一个表面的可压缩固体垫，该表面具有承载可流动材料的多个突起。热接口单元在发热装置和冷却板之间被按压，使得可流动的材料被完全封闭。

7. 发明申请

US20120120605A1 IN-LINE MEMORY AND CIRCUIT BOARD COOLING SYSTEM 有权
标题翻译：在线存储器和电路板冷却系统
公开(公告)号：US20120120605A1
公开(公告)日：2012-05-17
申请号：US12944680
申请日：2010-11-11
申请人： Amilcar Arvelo , Jason R. Eagle , Eric A. Eckberg , Gary F. Goth , Katie L. Pizzolato , Scott A. Shurson
发明人： Amilcar Arvelo , Jason R. Eagle , Eric A. Eckberg , Gary F. Goth , Katie L. Pizzolato , Scott A. Shurson
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , G06F1/20
摘要： A system to remove heat from an in-line memory module and/or circuit board may include a cold-rail to engage each end of an in-line memory module adjacent to where the in-line memory module is attachable to a circuit board, the cold-rail to remove heat from the in-line memory module. The system may also include a cold-plate connected to the cold-rail with the circuit board between the cold-plate and the cold-rail, the cold-plate to remove heat from the circuit board.
摘要翻译：从串行存储器模块和/或电路板去除热量的系统可以包括一个冷轨，用于接合直列式存储器模块可连接到电路板的位置的直列式存储器模块的每一端，用于从串行内存模块中移除热量的冷轨。该系统还可以包括连接到冷轨的冷板，电路板在冷板和冷轨之间，冷板用于从电路板去除热量。

8. 发明授权

US08582297B2 Customized thermal interface to optimize mechanical loading and thermal conductivity characteristics 有权
标题翻译：定制热界面，优化机械负载和导热特性
公开(公告)号：US08582297B2
公开(公告)日：2013-11-12
申请号：US13020102
申请日：2011-02-03
申请人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
发明人： David L. Edwards , Randall G. Kemink , David C. Olson , Katie L. Pizzolato , John G. Torok
IPC分类号： H05K7/20
CPC分类号： F28F13/00 , B23P2700/10 , F28F2013/006 , H01L23/433 , H01L2924/0002 , H05K7/20509 , Y10T29/49826 , H01L2924/00
摘要： A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.
摘要翻译：一种通过冷却板冷却一个或多个设备的方法，系统和装置。示例性系统包括耦合到冷却板的多个热产生装置，每个通过单独的热接口单元。热接口单元包括具有至少一个表面的可压缩固体垫，该表面具有承载可流动材料的多个突起。热接口单元在发热装置和冷却板之间被按压，使得可流动的材料被完全封闭。

9. 发明授权

US08385067B2 In-line memory and circuit board cooling system 有权
标题翻译：在线记忆和电路板冷却系统
公开(公告)号：US08385067B2
公开(公告)日：2013-02-26
申请号：US12944680
申请日：2010-11-11
申请人： Amilcar Arvelo , Jason R. Eagle , Eric A. Eckberg , Gary F. Goth , Katie L. Pizzolato , Scott A. Shurson
发明人： Amilcar Arvelo , Jason R. Eagle , Eric A. Eckberg , Gary F. Goth , Katie L. Pizzolato , Scott A. Shurson
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H05K7/20772 , G06F1/20
摘要： A system to remove heat from an in-line memory module and/or circuit board may include a cold-rail to engage each end of an in-line memory module adjacent to where the in-line memory module is attachable to a circuit board, the cold-rail to remove heat from the in-line memory module. The system may also include a cold-plate connected to the cold-rail with the circuit board between the cold-plate and the cold-rail, the cold-plate to remove heat from the circuit board.
摘要翻译：从串行存储器模块和/或电路板去除热量的系统可以包括一个冷轨，用于接合直列式存储器模块可连接到电路板的位置的直列式存储器模块的每一端，用于从串行内存模块中移除热量的冷轨。该系统还可以包括连接到冷轨的冷板，电路板在冷板和冷轨之间，冷板用于从电路板去除热量。

10. 发明授权

US08125780B2 In-line memory module cooling system 失效
标题翻译：在线内存模块冷却系统
公开(公告)号：US08125780B2
公开(公告)日：2012-02-28
申请号：US12645400
申请日：2009-12-22
申请人： Gary F. Goth , Randall G. Kemink , Katie L. Pizzolato
发明人： Gary F. Goth , Randall G. Kemink , Katie L. Pizzolato
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A system to aid in cooling an in-line memory module may include a thermal interface material adjacent the in-line memory module. The system may also include a heat spreader adjacent the thermal interface material. The system may further include a cold-plate adjacent the heat spreader, the cold-plate, heat spreader, and thermal interface material to aid in cooling the in-line memory module.
摘要翻译：有助于冷却在线存储器模块的系统可以包括与在线存储器模块相邻的热界面材料。该系统还可以包括邻近热界面材料的散热器。该系统还可以包括邻近散热器，冷板，散热器和热界面材料的冷板，以帮助冷却直列存储器模块。

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