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    • 8. 发明申请
    • Nitride semiconductor light emitting device and method of manufacturing the same
    • 氮化物半导体发光器件及其制造方法
    • US20050221521A1
    • 2005-10-06
    • US10983637
    • 2004-11-09
    • Jae LeeJeong LeeHyun KimYong Kim
    • Jae LeeJeong LeeHyun KimYong Kim
    • H01L21/00H01L29/22H01L33/22H01L33/32H01L33/38H01L33/62H01L33/00
    • H01L33/32H01L33/007H01L33/22Y10S257/918
    • Disclosed herein is a nitride semiconductor light emitting device having patterns formed on the upper and lower surfaces of a substrate from which light is emitted in a flip chip bonding structure wherein the patterns are capable of changing light inclination at the upper and lower surfaces of the substrate to decrease total reflection at the interfaces, thereby improving light emitting efficiency. The nitride semiconductor light emitting device comprises a substrate having upper and lower surfaces on which predetermined patterns are formed such that light can be incident within a critical angle, the substrate allowing a gallium nitride-based semiconductor material to be grown thereon, an n-type nitride semiconductor layer formed on the upper surface of the substrate, an active layer formed on the upper surface of the n-type nitride semiconductor layer such that the n-type nitride semiconductor layer is partially exposed, a p-type nitride semiconductor layer formed on the upper surface of the active layer, a p-electrode formed on the upper surface of the p-type nitride semiconductor layer, and an n-side electrode formed on the partially exposed n-type nitride semiconductor layer.
    • 本文公开了一种氮化物半导体发光器件,其具有形成在衬底的上表面和下表面上的图案,其中以倒装芯片接合结构发射光,其中图案能够改变衬底的上表面和下表面处的光倾斜度 以减少界面处的全反射,从而提高发光效率。 氮化物半导体发光器件包括具有上表面和下表面的衬底,在衬底上形成预定图案,使得光可以临界角入射,所述衬底允许在其上生长氮化镓基半导体材料,n型 形成在所述衬底的上表面上的氮化物半导体层,形成在所述n型氮化物半导体层的上表面上以使得所述n型氮化物半导体层部分暴露的有源层,形成在所述n型氮化物半导体层上的p型氮化物半导体层 有源层的上表面,形成在p型氮化物半导体层的上表面上的p电极和形成在部分暴露的n型氮化物半导体层上的n侧电极。
    • 10. 发明申请
    • Flip-chip type nitride semiconductor light emitting diode
    • 倒装型氮化物半导体发光二极管
    • US20060192206A1
    • 2006-08-31
    • US11150288
    • 2005-06-13
    • Moon KongYong KimJae LeeHyung Back
    • Moon KongYong KimJae LeeHyung Back
    • H01L33/00
    • H01L33/38H01L33/08H01L33/20H01L33/405H01L2224/0554H01L2224/05568H01L2224/05573H01L2224/16225H01L2924/00014H01L2224/05599H01L2224/0555H01L2224/0556
    • Disclosed herein is a flip-chip type nitride semiconductor light emitting diode. The light emitting diode comprises an n-type nitride semiconductor layer formed on a transparent substrate and having a substantially rectangular upper surface, an n-side electrode which comprises at least one bonding pad adjacent to at least one corner of the upper surface of the n-type nitride semiconductor layer, extended electrodes formed in a band from the bonding pad along four sides of the upper surface of the n-type nitride semiconductor layer and one or more fingers extended in a diagonal direction of the upper surface from the bonding pad and/or the extended electrodes, an active layer and a p-type nitride semiconductor layer sequentially stacked on a region of the n-type nitride semiconductor layer where the n-side electrode is not formed, and a highly reflective ohmic contact layer formed on the p-type nitride semiconductor layer.
    • 本文公开了倒装芯片型氮化物半导体发光二极管。 发光二极管包括形成在透明基板上并具有基本上矩形的上表面的n型氮化物半导体层,n侧电极包括与n的上表面的至少一个角相邻的至少一个焊盘 型氮化物半导体层,从接合焊盘沿着n型氮化物半导体层的上表面的四边形成的带状的延伸电极和从接合焊盘沿上表面的对角线方向延伸的一个或多个指状物, 或者在n型氮化物半导体层的未形成n侧电极的区域上依次堆叠的延伸电极,有源层和p型氮化物半导体层以及形成在该n型氮化物半导体层上的高反射欧姆接触层 p型氮化物半导体层。