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    • 3. 发明申请
    • RECESSED GATE FOR A CMOS IMAGE SENSOR
    • CMOS图像传感器的接收门
    • US20070184614A1
    • 2007-08-09
    • US11735223
    • 2007-04-13
    • James AdkissonJohn Ellis-MonaghanMark JaffeJerome Lasky
    • James AdkissonJohn Ellis-MonaghanMark JaffeJerome Lasky
    • H01L21/336
    • H01L27/14603H01L27/14601H01L27/14689H01L29/66621
    • A novel CMOS image sensor cell structure and method of manufacture. The imaging sensor comprises a substrate having an upper surface, a gate comprising a dielectric layer formed on the substrate and a gate conductor formed on the gate dielectric layer, a collection well layer of a first conductivity type formed below a surface of the substrate adjacent a first side of the gate conductor, a pinning layer of a second conductivity type formed atop the collection well at the substrate surface, and a diffusion region of a first conductivity type formed adjacent a second side of the gate conductor, the gate conductor forming a channel region between the collection well layer and the diffusion region. A portion of the bottom of the gate conductor is recessed below the surface of the substrate. Preferably, a portion of the gate conductor is recessed at or below a bottom surface of the pinning layer to a depth such that the collection well intersects the channel region thereby eliminating any potential barrier interference caused by the pinning layer.
    • 一种新颖的CMOS图像传感器单元结构及其制造方法。 成像传感器包括具有上表面的基板,包括形成在基板上的电介质层的栅极和形成在栅极电介质层上的栅极导体,形成在基板表面附近的第一导电类型的集合阱层 栅极导体的第一侧,形成在基板表面上的集电阱顶部的第二导电类型的钉扎层,以及邻近栅极导体的第二侧形成的第一导电类型的扩散区域,栅极导体形成沟道 收集阱层和扩散区域之间的区域。 栅极导体的底部的一部分在衬底的表面下方凹进。 优选地,栅极导体的一部分在钉扎层的底表面处或下方凹陷到深度,使得收集阱与沟道区相交,从而消除由钉扎层引起的任何潜在的屏障干扰。
    • 4. 发明申请
    • RECESSED GATE FOR AN IMAGE SENSOR
    • 图像传感器的门
    • US20060124976A1
    • 2006-06-15
    • US10905097
    • 2004-12-15
    • James AdkissonJohn Ellis-MonaghanMark JaffeJerome Lasky
    • James AdkissonJohn Ellis-MonaghanMark JaffeJerome Lasky
    • H01L31/113H01L29/76H01L29/94
    • H01L27/14603H01L27/14601H01L27/14689H01L29/66621
    • A novel image sensor cell structure and method of manufacture. The imaging sensor comprises a substrate, a gate comprising a dielectric layer and gate conductor formed on the dielectric layer, a collection well layer of a first conductivity type formed below a surface of the substrate adjacent a first side of the gate conductor, a pinning layer of a second conductivity type formed atop the collection well at the substrate surface, and a diffusion region of a first conductivity type formed adjacent a second side of the gate conductor, the gate conductor forming a channel region between the collection well layer and the diffusion region. Part of the gate conductor bottom is recessed below the surface of the substrate. Preferably, a portion of the gate conductor is recessed at or below a bottom surface of the pinning layer to a depth such that the collection well intersects the channel region.
    • 一种新颖的图像传感器单元结构及其制造方法。 成像传感器包括基板,包括电介质层和形成在电介质层上的栅极导体的栅极,形成在与栅极导体的第一侧相邻的基板的表面下面的第一导电类型的收集阱层,钉扎层 在基板表面上形成在集合阱顶部的第二导电类型的第一导电类型的扩散区和在栅极导体的第二侧附近形成的第一导电类型的扩散区,栅极导体在集电阱层和扩散区之间形成沟道区 。 栅极导体底部的一部分凹陷在基板的表面下方。 优选地,栅极导体的一部分在钉扎层的底表面处或下方凹陷到使得收集阱与沟道区相交的深度。
    • 6. 发明申请
    • PIXEL SENSOR CELL FOR COLLECTING ELECTRONS AND HOLES
    • 用于收集电子和孔的像素传感器单元
    • US20070029581A1
    • 2007-02-08
    • US11161535
    • 2005-08-08
    • James AdkissonAndres BryantJohn Ellis-MonaghanMark JaffeJeffrey JohnsonAlain Loiseau
    • James AdkissonAndres BryantJohn Ellis-MonaghanMark JaffeJeffrey JohnsonAlain Loiseau
    • H01L27/148
    • H01L27/14603H01L27/14609H01L27/14689H01L31/035281
    • The present invention is a pixel sensor cell and method of making the same. The pixel sensor cell approximately doubles the available signal for a given quanta of light. The device of the present invention utilizes the holes produced by impinging photons in a pixel sensor cell circuit. A pixel sensor cell having reduced complexity includes an n-type collection well region formed beneath a surface of a substrate for collecting electrons generated by electromagnetic radiation impinging on the pixel sensor cell and a p-type collection well region formed beneath the surface of the substrate for collecting holes generated by the impinging photons. A circuit structure having a first input is coupled to the n-type collection well region and a second input is coupled to the p-type collection well region, wherein an output signal of the pixel sensor cell is the magnitude of the difference of a signal of the first input and a signal of the second input.
    • 本发明是像素传感器单元及其制造方法。 像素传感器单元对于给定的光量大约使可用信号加倍。 本发明的器件利用通过在像素传感器单元电路中照射光子而产生的空穴。 具有降低的复杂度的像素传感器单元包括形成在基板的表面下面的n型收集阱区域,用于收集由电子辐射照射在像素传感器单元上​​产生的电子以及形成在基板表面下方的p型收集阱区域 用于收集由撞击光子产生的孔。 具有第一输入的电路结构耦合到n型收集阱区域,而第二输入端耦合到p型收集阱区域,其中像素传感器单元的输出信号是信号的差值的大小 的第一输入和第二输入的信号。
    • 9. 发明申请
    • IMAGE SENSOR CELLS
    • 图像传感器细胞
    • US20070108485A1
    • 2007-05-17
    • US11619024
    • 2007-01-02
    • James AdkissonJohn Ellis-MonaghanJeffrey GambinoMark JaffeRichard Rassel
    • James AdkissonJohn Ellis-MonaghanJeffrey GambinoMark JaffeRichard Rassel
    • H01L31/113H01L21/00
    • H01L27/14609H01L27/1463H01L27/14641H01L27/14643H01L31/035281
    • A structure (and method for forming the same) for an image sensor cell. The method includes providing a semiconductor substrate. Then, a charge collection well is formed in the semiconductor substrate, the charge collection well comprising dopants of a first doping polarity. Next, a surface pinning layer is formed in the charge collection well, the surface pinning layer comprising dopants of a second doping polarity opposite to the first doping polarity. Then, an electrically conductive push electrode is formed in direct physical contact with the surface pinning layer but not in direct physical contact with the charge collection well. Then, a transfer transistor is formed on the semiconductor substrate. The transfer transistor includes first and second source/drain regions and a channel region. The first and second source/drain regions comprise dopants of the first doping polarity. The first source/drain region is in direct physical contact with the charge collection well.
    • 用于图像传感器单元的结构(及其形成方法)。 该方法包括提供半导体衬底。 然后,在半导体衬底中形成电荷收集阱,电荷收集阱包含第一掺杂极性的掺杂剂。 接下来,在电荷收集阱中形成表面钉扎层,表面钉扎层包括与第一掺杂极性相反的第二掺杂极性的掺杂剂。 然后,导电的推动电极形成为与表面钉扎层直接物理接触,但不与电荷收集阱直接物理接触。 然后,在半导体衬底上形成传输晶体管。 传输晶体管包括第一和第二源极/漏极区域和沟道区域。 第一和第二源/漏区包括第一掺杂极性的掺杂剂。 第一源极/漏极区域与电荷收集阱直接物理接触。