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    • 2. 发明授权
    • Forming of contoured irradiated regions in materials such as
semiconductor bodies by nuclear radiation
    • 通过核辐射在诸如半导体物质的材料中形成轮廓照射区域
    • US4278475A
    • 1981-07-14
    • US936
    • 1979-01-04
    • John BartkoEarl S. Schlegel
    • John BartkoEarl S. Schlegel
    • H01L21/322H01L21/263H01L29/32H01L7/54H01L21/22
    • H01L21/263H01L29/32Y10S438/961
    • Irradiated regions are formed in materials such as semiconductor bodies by nuclear radiation where the irradiated regions are of a desired thickness, dosage and dosage gradient, a desired distance from a selected surface of the material. A nuclear radiation beam from a given radiation source radiating particles with molecular weight of at least one (1) is provided that can penetrate the material through a selected surface to a depth greater than the maximum depth of the irradiated region from the selected surface. A beam modifier is formed of a given material and non-uniform shape to modify the energy of the radiation beam on transmission therethrough to form a transmitted radiation beam capable of forming an irradiated region of a desired thickness and dosage gradient in the material a given distance from the selected surface on irradiation of the material through the selected surface with the transmitted radiation beam. The material in which the desired irradiated region is to be formed is positioned with the selected surface thereof to be exposed to the radiation beam from the radiation source on transmission through the beam modifier. The material is thereafter irradiated through the beam modifier and through the selected surface with the radiation beam, preferably while the beam modifier and material are moved relative to each other through a predetermined motion, to form in the material an irradiated region of desired thickness, dosage and dosage gradient, a desired distance from the selected surface. The irradiated region thus formed in semiconductor bodies are particularly of value in changing the electrical characteristics without substantial change of other electrical characteristics.
    • 照射区域通过核辐射在诸如半导体物质的材料中形成,其中照射区域具有期望的厚度,剂量和剂量梯度,与材料的选定表面的期望距离。 提供了辐射分子量为至少一个(1)的分子量的给定辐射源的核辐射束,其能够穿过选定表面的深度大于被选择表面的照射区域的最大深度的深度。 光束修改器由给定的材料和不均匀的形状形成,以改变辐射束在其中穿过其中的能量,以形成能够在材料中形成给定距离的期望厚度和剂量梯度的辐射区域的透射辐射束 通过所述透射的辐射束通过所选择的表面照射材料从所选择的表面。 将要形成所需照射区域的材料定位成使其选择的表面暴露于通过光束改性剂透射时来自辐射源的辐射束。 然后,材料通过光束调节剂并通过所选择的表面用辐射束照射,优选地,当光束调节剂和材料通过预定的运动相对于彼此移动时,在材料中形成所需厚度的照射区域,剂量 和剂量梯度,与所选表面的期望距离。 由此形成在半导体本体中的照射区域在改变电特性而没有其他电特性的实质变化的情况下特别有价值。
    • 7. 发明授权
    • Measuring nuclear fuel burnup
    • 测量核燃料燃耗
    • US4881247A
    • 1989-11-14
    • US325016
    • 1989-03-16
    • Richard C. SmithJohn BartkoArnold H. Fero
    • Richard C. SmithJohn BartkoArnold H. Fero
    • G21C17/06
    • G21C17/063
    • Disclosed is a method and apparatus for measuring the burnup of nuclear fuel. A curve giving the calculated relationship between the fast neutron emission rate and the burnup of fuel is prepared. The fast neutron counting rate from a sample of nuclear fuel of known burnup is measured and the proportionality ratio between that measurement and the fast neutron emission given by the curve for the same burnup is determined. The fast neutron counting rate of nuclear fuel of unknown burnup is then measured and multiplied by the proportionality ratio to determine the fast neutron emission rate, from which the unknown burnup is then determined by means of the curve.
    • 公开了一种用于测量核燃料燃耗的方法和装置。 给出了快中子排放速率和燃料燃耗之间计算关系的曲线。 测量已知燃耗的核燃料样品的快中子计数率,并确定该测量与同一燃耗曲线给出的快中子发射之间的比例比。 然后测量未知燃耗的核燃料的快中子计数率并乘以比例比,以确定快中子排放速率,然后通过曲线确定未知燃耗。
    • 8. 发明授权
    • High resolution lithography using protons or alpha particles
    • 使用质子或α粒子的高分辨率光刻技术
    • US4357417A
    • 1982-11-02
    • US251648
    • 1981-04-06
    • John BartkoPatrick E. FelicePhillip D. Blais
    • John BartkoPatrick E. FelicePhillip D. Blais
    • G03F1/00G03F7/20A61K27/02G03F5/00
    • G03F7/2037G03F1/20
    • A method of lithographically forming a pattern on a surface is disclosed. The surface on which the pattern is to be formed is first coated with a resist layer. A mask preferably consisting of a beryllium of foil and a pattern gold layer affixed thereto is then positioned in overlying relationship to the resist layer. The thickness of the beryllium foil is selected such that it is transparent to high energy particles of a preselected energy while the combination of the pattern gold areas and the beryllium foil is impervious to these particles. A flood beam of high energy particles is directed such that it impinges on the beryllium foil thereby exposing the resist in areas not protected by the combination of the beryllium foil and the gold. The resist layer is processed to produce a patterned layer.
    • 公开了一种在表面上光刻形成图案的方法。 首先将其上形成图案的表面涂覆有抗蚀剂层。 优选由箔的铍和附着于其上的图案金层组成的掩模以与抗蚀剂层的重叠关系定位。 选择铍箔的厚度,使得其对预定能量的高能粒子是透明的,而图案金区域和铍箔片的组合对于这些颗粒是不渗透的。 引导高能粒子的泛光束使其撞击在铍箔上,从而在未被铍箔和金的组合保护的区域中露出抗蚀剂。 处理抗蚀剂层以产生图案化层。
    • 9. 发明授权
    • Reducing the reverse recovery charge of thyristors by nuclear irradiation
    • 通过核辐射降低晶闸管的反向恢复电荷
    • US4311534A
    • 1982-01-19
    • US163548
    • 1980-06-27
    • John BartkoKrishan S. TarnejaChang K. ChuEarl S. Schlegel
    • John BartkoKrishan S. TarnejaChang K. ChuEarl S. Schlegel
    • H01L21/322H01L21/263H01L29/167H01L29/74H01L7/54
    • H01L29/167H01L21/263Y10S148/084
    • A method of reducing the reverse recovery charge of thyristors without substantially increasing forward voltage drop by first determining the depth of the anode PN junction from a major surface adjoining a cathode emitter region. The depth of maximum defect generation in thyristor on irradiation through the major surface with a given radiation source radiating particles with molecular weight greater than one, preferably proton or alpha particles, and adjusting the energy level at the major surface of the thyristor from the radiation source to provide the depth of maximum defect generation adjacent the anode PN junction and preferably in the anode base region within 20 micrometers of the anode PN junction or in the anode emitter region within 15 micrometers of the anode PN junction. Thereafter the thyristor is irradiated through said major surface with the adjusted energy level from the radiation source to a given dosage to reduce the reverse recovery stored charge of the thyristor without substantially increasing the forward voltage drop.
    • 一种减少晶闸管的反向恢复电荷的方法,而不会通过首先确定来自邻接阴极发射极区的主表面的阳极PN结的深度而基本上增加正向压降。 通过具有给定辐射源的主表面照射的晶闸管中的最大缺陷产生的深度辐射分子量大于1的颗粒,优选质子或α粒子,并且从辐射源调节晶闸管的主表面处的能级 以提供邻近阳极PN结的最佳缺陷产生的深度,优选在阳极PN结的20微米内的阳极基极区域或阳极PN结的15微米内的阳极发射极区域中提供最大缺陷产生的深度。 此后,晶闸管通过所述主表面照射具有从辐射源到给定剂量的调节能级,以减少晶闸管的反向恢复存储电荷,而不会基本上增加正向压降。