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1. 发明授权

US06870208B1 Image sensor module 失效
标题翻译：图像传感器模块
公开(公告)号：US06870208B1
公开(公告)日：2005-03-22
申请号：US10671038
申请日：2003-09-24
申请人： Irving You , Jichen Wu , Hsiu Wen Tu , Jason Chang , Figo Hsieh
发明人： Irving You , Jichen Wu , Hsiu Wen Tu , Jason Chang , Figo Hsieh
IPC分类号： H01L21/336 , H01L27/146 , H01L31/0203 , H01L31/062
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening. The lens barrel has a top surface, a bottom surface opposed to the top surface and a transparent region, a external thread formed between the top surface and the bottom surface, the lens barrel being arranged within the chamber of the frame layer, the external thread being screwed on the internal thread of the chamber.
摘要翻译：图像传感器模块包括基板，框架层，感光芯片，透明层和镜筒。基板具有以矩阵形式布置的多个引线框架，以形成形成有开口的上表面和形成有从开口穿入的空腔的下表面。框架层与衬底一体地形成，并且布置在衬底的上表面的周边以与衬底一起限定腔室，内腔形成在腔室的内壁上。感光芯片安装在基板的腔内，并以倒装芯片的方式电耦合每个引线框架。透明层被覆盖在基板的上表面上以覆盖开口。镜筒具有顶表面，与顶表面相对的底表面和透明区域，形成在顶表面和底表面之间的外螺纹，镜筒设置在框架层的腔室内，外螺纹被拧在腔室的内螺纹上。

2. 发明授权

US06646316B2 Package structure of an image sensor and packaging 有权
标题翻译：图像传感器和包装的封装结构
公开(公告)号：US06646316B2
公开(公告)日：2003-11-11
申请号：US09770049
申请日：2001-01-24
申请人： Jichen Wu , Hsiu Wen Tu , Kuo Feng Peng , C. H. Chen , Wen Chuan Chen
发明人： Jichen Wu , Hsiu Wen Tu , Kuo Feng Peng , C. H. Chen , Wen Chuan Chen
IPC分类号： H01L310203
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board. The image sensing chip receives image signals via the transparent layer, transforms the image signals into electrical signals, and transmits the electrical signals from the flexible circuit board to the printed circuit board.
摘要翻译：图像传感器的封装结构的特征在于，通过倒装芯片接合将图像感测芯片直接封装在柔性电路板上。图像传感器的封装结构包括图像感测芯片，柔性电路板和透明层。在图像感测芯片上形成多个电路。每个电路由接合焊盘形成。柔性电路板具有上表面和下表面。信号输入端子分别形成在下表面和对应于图像感测芯片的每个接合焊盘的位置处，用于电连接到图像感测芯片的相应接合焊盘。信号输入端子分别电连接到信号输出端子，用于电连接到印刷电路板。透明层用于覆盖柔性电路板的上表面。图像感测芯片通过透明层接收图像信号，将图像信号转换为电信号，并将电信号从柔性电路板传输到印刷电路板。

3. 发明授权

US06521881B2 Stacked structure of an image sensor and method for manufacturing the same 有权
标题翻译：图像传感器的堆叠结构及其制造方法
公开(公告)号：US06521881B2
公开(公告)日：2003-02-18
申请号：US09836160
申请日：2001-04-16
申请人： Hsiu Wen Tu , Wen Chuan Chen , Mon Nan Ho , Li Huan Chen , Jichen Wu , Meng Ru Tsai
发明人： Hsiu Wen Tu , Wen Chuan Chen , Mon Nan Ho , Li Huan Chen , Jichen Wu , Meng Ru Tsai
IPC分类号： H01L2700
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
摘要： A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.
摘要翻译：图像传感器的堆叠结构包括基板，集成电路，封装层，图像感测芯片和透明层。集成电路形成在基板上并电连接到基板。封装层覆盖集成电路。将图像感测芯片放置在封装层上，以形成具有集成电路的堆叠结构，并与基板电连接。透明层设置在用于图像感测芯片的图像感测芯片上方以经由透明层接收图像信号。根据该结构，可以容易地整合图像感测芯片和集成电路。

4. 发明授权

US06737720B2 Packaging structure of image sensor and method for packaging the same 失效
标题翻译：图像传感器的包装结构及其包装方法
公开(公告)号：US06737720B2
公开(公告)日：2004-05-18
申请号：US09768845
申请日：2001-01-23
申请人： Mon Nan Ho , Hsiu Wen Tu , Ching Shui Cheng , Li Huan Chen , Joe Liu , Jichen Wu , Wen Chuan Chen
发明人： Mon Nan Ho , Hsiu Wen Tu , Ching Shui Cheng , Li Huan Chen , Joe Liu , Jichen Wu , Wen Chuan Chen
IPC分类号： H01L310203
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2924/00014
摘要： A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.
摘要翻译：图像传感器的封装结构包括基板，图像感测芯片，多个布线和透明层。基板包括多个金属片，用于密封金属片的胶，第一表面和第二表面。金属片经由第一表面和第二表面暴露于外部，以分别形成第一触点和第二触点。图像感测芯片安装在基板上。多个接合焊盘形成在图像感测芯片上。多个布线将图像感测芯片上的接合焊盘电连接到衬底的第一表面的第一触点，以将图像感测芯片电连接到衬底。透明层设置在图像感测芯片的上方。因此，可以形成由塑料材料制成的图像传感器的包装结构，从而简化包装过程并降低制造成本。

5. 发明授权

US06627983B2 Stacked package structure of image sensor 有权
公开(公告)号：US06627983B2
公开(公告)日：2003-09-30
申请号：US09770083
申请日：2001-01-24
申请人： Hsiu Wen Tu , Wen Chuan Chen , Mon Nan Ho , Li Huan Chen , Nai Hua Yeh , Yen Cheng Huang , Yung Sheng Chiu , Jichen Wu , Joe Liu , Wu Hsiang Lee
发明人： Hsiu Wen Tu , Wen Chuan Chen , Mon Nan Ho , Li Huan Chen , Nai Hua Yeh , Yen Cheng Huang , Yung Sheng Chiu , Jichen Wu , Joe Liu , Wu Hsiang Lee
IPC分类号： H01L2302
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2924/15311 , H01L2924/00014
摘要： A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

6. 发明授权

US06590269B1 Package structure for a photosensitive chip 有权
标题翻译：感光芯片的封装结构
公开(公告)号：US06590269B1
公开(公告)日：2003-07-08
申请号：US10114201
申请日：2002-04-01
申请人： Jason Chuang , Allis Chen , Jachson Hsieh , Hsiu Wen Tu , Meng Ru Tsai , Mon Nan Ho , Fu Yung Huang , Yung Sheng Chiu , Jichen Wu , Chih Cheng Hsu
发明人： Jason Chuang , Allis Chen , Jachson Hsieh , Hsiu Wen Tu , Meng Ru Tsai , Mon Nan Ho , Fu Yung Huang , Yung Sheng Chiu , Jichen Wu , Chih Cheng Hsu
IPC分类号： H01L310203
CPC分类号： H01L31/0203 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.
摘要翻译：用于感光芯片的封装结构包括具有上表面和下表面的基片和具有第一表面和第二表面的框架层。框架层通过注射成型形成在基板上，第一表面接触上表面。在基板和框架层之间形成空腔。第二表面形成有凹部，其中形成有具有适当高度的多个凸起。框架层通过注射成型直接形成在基板上。封装结构还包括布置在空腔内的感光芯片，用于将基板连接到感光芯片的多根导线以及搁置在凹陷内的凸起上的透明层。因此，可以提高收率并且可以促进制造过程。

7. 发明授权

US06559539B2 Stacked package structure of image sensor 有权
标题翻译：图像传感器的堆叠封装结构
公开(公告)号：US06559539B2
公开(公告)日：2003-05-06
申请号：US09770084
申请日：2001-01-24
申请人： Hsiu Wen Tu , Wen Chuan Chen , Mon Nan Ho , Li Huan Chen , Nai Hua Yeh , Yen Cheng Huang , Yung Sheng Chiu , Jichen Wu
发明人： Hsiu Wen Tu , Wen Chuan Chen , Mon Nan Ho , Li Huan Chen , Nai Hua Yeh , Yen Cheng Huang , Yung Sheng Chiu , Jichen Wu
IPC分类号： H01L2334
CPC分类号： H01L25/0657 , H01L31/0203 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2225/0651 , H01L2225/06517 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15321 , H01L2924/16195 , H01L2924/1627 , H01L2924/00 , H01L2224/0401
摘要： A stacked package structure of an image sensor used for electrically connecting to a printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over the image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transmitted to the substrate. Thus, the image sensing chip of the image sensing product and integrated circuit can be integrally packaged.
摘要翻译：用于电连接到印刷电路板的图像传感器的堆叠封装结构包括基板，图像感测芯片，集成电路和透明层。基板具有第一表面和第二表面。第一表面由信号输入端子形成。第二表面形成有用于电连接到印刷电路板的信号输入端子和信号输出端子。图像感测芯片安装在基板的第一表面上并且电连接到基板的信号输入端子。集成电路布置在基板的第二表面上并且电连接到基板的信号输入端子。透明层覆盖图像感测芯片，其可以经由透明层接收图像信号，并将图像信号转换成要传输到基板的电信号。因此，图像感测产品和集成电路的图像感测芯片可以被整体封装。

8. 发明授权

US06696738B1 Miniaturized image sensor 失效
标题翻译：小型化图像传感器
公开(公告)号：US06696738B1
公开(公告)日：2004-02-24
申请号：US10293036
申请日：2002-11-12
申请人： Hsiu Wen Tu , Kuo-Tai Tseng
发明人： Hsiu Wen Tu , Kuo-Tai Tseng
IPC分类号： H01L310232
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2924/0002 , H01L2924/00
摘要： An image sensor includes a substrate, a frame layer, a photosensitive chip and a transparent layer. The substrate is composed of spaced metal sheets. Each metal sheet includes a first board, a second board and a third board connecting the first and second boards, which are located at different heights. The frame layer has an upper surface and a lower surface. The frame layer covers and seals the metal sheets while exposes bottom surfaces of the second boards. The frame layer is formed with a chamber. Bottom surfaces of the first boards are exposed through the chamber, and a transparent region communicating with the chamber is formed on the upper surface of the frame layer. The photosensitive chip formed with bonding pads is disposed within the chamber. The bonding pads contact the bottom surfaces of the first boards. The transparent layer is mounted on the frame layer.
摘要翻译：图像传感器包括基板，框架层，感光芯片和透明层。基板由间隔开的金属板构成。每个金属片包括位于不同高度的第一板，第二板和连接第一板和第二板的第三板。框架层具有上表面和下表面。框架层覆盖并密封金属板，同时暴露第二板的底表面。框架层形成有室。第一板的下表面通过室暴露，并且在框架层的上表面上形成与室连通的透明区域。形成有接合焊盘的感光芯片设置在室内。接合焊盘接触第一板的底表面。透明层安装在框架层上。

9. 发明申请

US20080067334A1 Image sensor package structure and method for manufacturing the same 审中-公开
标题翻译：图像传感器封装结构及其制造方法
公开(公告)号：US20080067334A1
公开(公告)日：2008-03-20
申请号：US11986227
申请日：2007-11-19
申请人： Jason Chuang , Mon Nan Ho , Hsiu Wen Tu , Chen Pin Peng , Chung Hsien Hsin , Wei Chang
发明人： Jason Chuang , Mon Nan Ho , Hsiu Wen Tu , Chen Pin Peng , Chung Hsien Hsin , Wei Chang
IPC分类号： H01J5/02 , H01L21/64
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.
摘要翻译：图像传感器封装结构包括基板，芯片，多根导线和框架层。基板具有形成有第一电极的上表面和形成有与第一电极电连接的第二电极的下表面。芯片具有传感器区域和位于芯片的传感器区域侧的多个接合焊盘，并且安装在基板的上表面上。多个导线将芯片的焊盘电连接到基板的第一电极。框架层插入透明层，并且布置在基板的上表面上以覆盖芯片。

10. 发明授权

US06565008B2 Module card and a method for manufacturing the same 失效
标题翻译：模块卡及其制造方法
公开(公告)号：US06565008B2
公开(公告)日：2003-05-20
申请号：US10018072
申请日：2001-12-04
申请人： Mon Nan Ho , Hsiu Wen Tu , Kuo Feng Feng , Yung Sheng Chiu , Joe Liu , Nai Hua Yeh , Wen Chuan Chen , Allis Chen
发明人： Mon Nan Ho , Hsiu Wen Tu , Kuo Feng Feng , Yung Sheng Chiu , Joe Liu , Nai Hua Yeh , Wen Chuan Chen , Allis Chen
IPC分类号： G06K1906
CPC分类号： H01L23/49855 , H01L2224/48091 , H01L2924/00014
摘要： A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.
摘要翻译：模块卡的制造方法包括以下步骤：提供具有金手指的基板; 在基板上安装芯片以电连接到金手指; 以及在芯片上形成用于形成模块卡的填充层。模块卡包括：基板; 芯片安装在基板的表面上; 一个金手指在电路板上并与芯片电连接; 以及形成在芯片上用于覆盖芯片的填充层。

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