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    • 5. 发明授权
    • Packaging structure of image sensor and method for packaging the same
    • 图像传感器的包装结构及其包装方法
    • US06737720B2
    • 2004-05-18
    • US09768845
    • 2001-01-23
    • Mon Nan HoHsiu Wen TuChing Shui ChengLi Huan ChenJoe LiuJichen WuWen Chuan Chen
    • Mon Nan HoHsiu Wen TuChing Shui ChengLi Huan ChenJoe LiuJichen WuWen Chuan Chen
    • H01L310203
    • H01L27/14618H01L2224/48091H01L2924/00014
    • A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.
    • 图像传感器的封装结构包括基板,图像感测芯片,多个布线和透明层。 基板包括多个金属片,用于密封金属片的胶,第一表面和第二表面。 金属片经由第一表面和第二表面暴露于外部,以分别形成第一触点和第二触点。 图像感测芯片安装在基板上。 多个接合焊盘形成在图像感测芯片上。 多个布线将图像感测芯片上的接合焊盘电连接到衬底的第一表面的第一触点,以将图像感​​测芯片电连接到衬底。 透明层设置在图像感测芯片的上方。 因此,可以形成由塑料材料制成的图像传感器的包装结构,从而简化包装过程并降低制造成本。
    • 9. 发明授权
    • Package structure of an image sensor and packaging
    • 图像传感器和包装的封装结构
    • US06646316B2
    • 2003-11-11
    • US09770049
    • 2001-01-24
    • Jichen WuHsiu Wen TuKuo Feng PengC. H. ChenWen Chuan Chen
    • Jichen WuHsiu Wen TuKuo Feng PengC. H. ChenWen Chuan Chen
    • H01L310203
    • H01L31/0203H01L2224/48091H01L2224/48227H01L2924/00014
    • A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board. The image sensing chip receives image signals via the transparent layer, transforms the image signals into electrical signals, and transmits the electrical signals from the flexible circuit board to the printed circuit board.
    • 图像传感器的封装结构的特征在于,通过倒装芯片接合将图像感测芯片直接封装在柔性电路板上。 图像传感器的封装结构包括图像感测芯片,柔性电路板和透明层。 在图像感测芯片上形成多个电路。 每个电路由接合焊盘形成。 柔性电路板具有上表面和下表面。 信号输入端子分别形成在下表面和对应于图像感测芯片的每个接合焊盘的位置处,用于电连接到图像感测芯片的相应接合焊盘。 信号输入端子分别电连接到信号输出端子,用于电连接到印刷电路板。 透明层用于覆盖柔性电路板的上表面。 图像感测芯片通过透明层接收图像信号,将图像信号转换为电信号,并将电信号从柔性电路板传输到印刷电路板。
    • 10. 发明授权
    • Miniaturized image sensor
    • 小型化图像传感器
    • US06696738B1
    • 2004-02-24
    • US10293036
    • 2002-11-12
    • Hsiu Wen TuKuo-Tai Tseng
    • Hsiu Wen TuKuo-Tai Tseng
    • H01L310232
    • H01L31/0203H01L27/14618H01L2924/0002H01L2924/00
    • An image sensor includes a substrate, a frame layer, a photosensitive chip and a transparent layer. The substrate is composed of spaced metal sheets. Each metal sheet includes a first board, a second board and a third board connecting the first and second boards, which are located at different heights. The frame layer has an upper surface and a lower surface. The frame layer covers and seals the metal sheets while exposes bottom surfaces of the second boards. The frame layer is formed with a chamber. Bottom surfaces of the first boards are exposed through the chamber, and a transparent region communicating with the chamber is formed on the upper surface of the frame layer. The photosensitive chip formed with bonding pads is disposed within the chamber. The bonding pads contact the bottom surfaces of the first boards. The transparent layer is mounted on the frame layer.
    • 图像传感器包括基板,框架层,感光芯片和透明层。 基板由间隔开的金属板构成。 每个金属片包括位于不同高度的第一板,第二板和连接第一板和第二板的第三板。 框架层具有上表面和下表面。 框架层覆盖并密封金属板,同时暴露第二板的底表面。 框架层形成有室。 第一板的下表面通过室暴露,并且在框架层的上表面上形成与室连通的透明区域。 形成有接合焊盘的感光芯片设置在室内。 接合焊盘接触第一板的底表面。 透明层安装在框架层上。