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1. 发明申请

US20060006310A1 Image sensor package structure 审中-公开
标题翻译：图像传感器封装结构
公开(公告)号：US20060006310A1
公开(公告)日：2006-01-12
申请号：US10887578
申请日：2004-07-08
申请人： Abnet Chen , Pierre Liu , Tony Wang , Chung Hsin , Figo Hsieh , Jian Lu
发明人： Abnet Chen , Pierre Liu , Tony Wang , Chung Hsin , Figo Hsieh , Jian Lu
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An image sensor package structure with plastic substrate includes a substrate, a frame layer, a photosensitive chip, wires and transparent layer. The substrate is formed with a plurality of via hole, and the each via hole is arranged at the periphery of the substrate, then an interval is formed between the periphery of the substrate and the via holes, a conductive material being filled into the each via hole. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip arranged within the cavity and is mounted on the substrate. Each wire is electrically connected the photosensitive chip to the substrate. The transparent layer covered over the frame layer to cover the photosensitive chip.
摘要翻译：具有塑料基板的图像传感器封装结构包括基板，框架层，感光芯片，导线和透明层。基板形成有多个通孔，并且每个通孔布置在基板的周边，然后在基板的周边和通孔之间形成间隔，将导电材料填充到每个通孔中孔。框架层布置在基板的上表面上以与基板一起形成空腔。感光芯片布置在腔内并安装在基板上。每根导线将感光芯片电连接到基板上。透明层被覆盖在框架层上以覆盖光敏芯片。

2. 发明申请

US20060011811A1 Image sensor package 失效
标题翻译：图像传感器封装
公开(公告)号：US20060011811A1
公开(公告)日：2006-01-19
申请号：US10923908
申请日：2004-08-21
申请人： Chung Hsin , Tony Wang , Figo Hsieh , Chin Chou
发明人： Chung Hsin , Tony Wang , Figo Hsieh , Chin Chou
IPC分类号： H01L27/00
CPC分类号： H01L27/14625 , H01L27/14618 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
摘要： An image sensor module structure includes a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The photosensitive chip is mounted on the upper surface of the substrate, and is electrically connected to the first electrodes of the substrate. The lens holder has an upper end face, a lower upper face, and an opening penetrating through the lens holder. The upper end of the opening is formed with an internal thread, and the lower end of the opening is formed with a breach. The lens holder is adhered on the upper surface of the substrate by glue, therefore, the photosensitive chip is located within the opening of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.
摘要翻译：图像传感器模块结构包括基板，感光芯片，透镜保持架和镜筒。基板具有形成有第一电极的上表面和形成有第二电极的下表面。感光芯片安装在基板的上表面上，并与基板的第一电极电连接。透镜保持具有上端面，下表面和穿透透镜保持器的开口。开口的上端形成有内螺纹，开口的下端形成有破裂。透镜架通过胶粘在基板的上表面上，因此感光芯片位于透镜架的开口内。透镜镜筒具有上端面，下端面和螺纹连接到透镜保持架的内螺纹的外螺纹。

3. 发明申请

US20060008939A1 Image sensor package 审中-公开
标题翻译：图像传感器封装
公开(公告)号：US20060008939A1
公开(公告)日：2006-01-12
申请号：US10887577
申请日：2004-07-08
申请人： Abnet Chen , Tony Wang , Chung Hsin , Figo Hsieh
发明人： Abnet Chen , Tony Wang , Chung Hsin , Figo Hsieh
IPC分类号： H01L21/00
CPC分类号： H01L31/0203 , H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An image sensor package includes a substrate, a frame layer, a photosensitive chip, wires, and transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed, wherein the each first electrode is curved. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip is arranged within the cavity and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrode of the substrate. The transparent layer is covered over the frame layer to cover the photosensitive chip.
摘要翻译：图像传感器封装包括基板，框架层，感光芯片，布线和透明层。基板具有形成第一电极的上表面和形成第二电极的下表面，其中每个第一电极是弯曲的。框架层布置在基板的上表面上以与基板一起形成空腔。感光芯片布置在空腔内并安装在基板的上表面上。多个导线将感光芯片电连接到基板的第一电极。透明层被覆盖在框架层上以覆盖感光芯片。

4. 发明申请

US20050099659A1 Image sensor module 审中-公开
标题翻译：图像传感器模块
公开(公告)号：US20050099659A1
公开(公告)日：2005-05-12
申请号：US10705380
申请日：2003-11-10
申请人： Jichen Wu , Figo Hsieh
发明人： Jichen Wu , Figo Hsieh
IPC分类号： H01L23/02 , H01L31/0203 , H01L31/0232 , H04N1/024
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/1462 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： An image sensor module includes a substrate, a photosensitive chip, a lens holder and a lens barrel. The substrate has a upper surface and a lower surface. The photosensitive chip is arranged at the upper surface of the substrate, and electrically connected the substrate by a plurality of wires. The lens holder is formed with a penetrated hole at a central thereof, an internal thread being formed on the inner wall of the penetrate hole, the lens holder being mounted on the upper surface of the first substrate to encapsulate the photosensitive chip. The lens barrel is arranged within the penetrate hole of the lens holder and is formed with an external thread, which is screwed to the internal thread of the lens holder.
摘要翻译：图像传感器模块包括基板，感光芯片，透镜保持架和镜筒。基板具有上表面和下表面。感光芯片布置在基板的上表面，并且通过多条电线将基板电连接。透镜架在其中心处形成有穿透孔，内螺纹形成在穿透孔的内壁上，透镜架安装在第一基板的上表面以封装感光芯片。透镜筒布置在透镜保持器的穿透孔内并且形成有外螺纹，螺纹连接到透镜保持器的内螺纹。

5. 发明申请

US20050099531A1 Multiple chips image sensor package 有权
标题翻译：多芯片图像传感器封装
公开(公告)号：US20050099531A1
公开(公告)日：2005-05-12
申请号：US10705379
申请日：2003-11-10
申请人： Jichen Wu , Figo Hsieh
发明人： Jichen Wu , Figo Hsieh
IPC分类号： H04N5/225 , H01L27/00
CPC分类号： H01L27/14634 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H04N5/2253 , H04N5/2254 , H01L2924/00014
摘要： A multiple chips image sensor module includes a first substrate; a photosensitive chip is arranged at the upper surface of the substrate; a lens holder is mounted on the upper surface of the first substrate to encapsulate the photosensitive chip; a lens barrel is arranged within the lens holder and is formed with a chamber and an opening communicating the chamber; an aspheric and transparent layer placed within the chamber; a second substrate is mounted on the first substrate and is electrically connected the first substrate; and a chip located on the second surface of the second substrate.
摘要翻译：多芯片图像传感器模块包括第一基板; 感光芯片设置在基板的上表面; 透镜架安装在第一基板的上表面上以封装感光芯片; 透镜镜筒布置在透镜保持器内并且形成有腔室和连通腔室的开口; 置于室内的非球面和透明层; 第二基板安装在第一基板上并与第一基板电连接; 以及位于所述第二基板的第二表面上的芯片。

6. 发明授权

US07511261B2 Image sensor module structure with lens holder having vertical inner and outer sidewalls 失效
标题翻译：图像传感器模块结构，透镜架具有垂直的内侧壁和外侧壁
公开(公告)号：US07511261B2
公开(公告)日：2009-03-31
申请号：US10923908
申请日：2004-08-21
申请人： Chung Hsien Hsin , Tony Wang , Figo Hsieh , Chin Hai Chou
发明人： Chung Hsien Hsin , Tony Wang , Figo Hsieh , Chin Hai Chou
IPC分类号： H01L23/00
CPC分类号： H01L27/14625 , H01L27/14618 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
摘要： An image sensor module structure includes a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The chip is mounted on the upper surface, and is electrically connected to the first electrodes. The lens holder has an upper end face, a lower end face, and an opening penetrating through the lens holder. The upper end portion of the opening is formed with an internal thread, and the lower end portion of the opening is formed with a breach. The lens holder is adhered on the upper surface by glue. The photosensitive chip is located within the opening of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.
摘要翻译：图像传感器模块结构包括基板，感光芯片，透镜保持架和镜筒。基板具有形成有第一电极的上表面和形成有第二电极的下表面。芯片安装在上表面上，并与第一电极电连接。透镜架具有上端面，下端面以及穿透透镜保持架的开口。开口的上端部形成有内螺纹，开口部的下端部形成有突出部。透镜架通过胶粘在上表面。感光芯片位于透镜架的开口内。透镜镜筒具有上端面，下端面和螺纹连接到透镜保持架的内螺纹的外螺纹。

7. 发明授权

US07064404B1 Image sensor structure 有权
标题翻译：图像传感器结构
公开(公告)号：US07064404B1
公开(公告)日：2006-06-20
申请号：US11052990
申请日：2005-02-07
申请人： Chung Hsien Hsin , Tony Wang , Worrell Tsai , Figo Hsieh , Wei Chang , Jun Jie Yen
发明人： Chung Hsien Hsin , Tony Wang , Worrell Tsai , Figo Hsieh , Wei Chang , Jun Jie Yen
IPC分类号： H01L31/0203
CPC分类号： H01L31/0203 , H01L23/10 , H01L24/48 , H01L24/49 , H01L24/73 , H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/16195 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An image sensor structure includes a substrate, four posts, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The four posts are arranged on the four angle of the upper surface of the substrate individually. The photosensitive chip is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrodes of the substrate. The glue layer is surrounded to the periphery of the upper surface of the substrate for surrounding the photosensitive chip, and covered the part of the wires. The transparent layer is arranged onto the four posts and the glue layer to cover the photosensitive chip.
摘要翻译：图像传感器结构包括基板，四个柱，感光芯片，多个导线，胶层和透明层。基板具有形成有第一电极的上表面和形成有第二电极的下表面。四个柱分别布置在基板的上表面的四个角度上。感光芯片安装在基板的上表面上。多个导线将感光芯片电连接到基板的第一电极。胶层被包围在基片的上表面周围，用于包围感光芯片，并覆盖电线的一部分。透明层布置在四个柱和胶层上以覆盖感光芯片。

8. 发明授权

US06870208B1 Image sensor module 失效
标题翻译：图像传感器模块
公开(公告)号：US06870208B1
公开(公告)日：2005-03-22
申请号：US10671038
申请日：2003-09-24
申请人： Irving You , Jichen Wu , Hsiu Wen Tu , Jason Chang , Figo Hsieh
发明人： Irving You , Jichen Wu , Hsiu Wen Tu , Jason Chang , Figo Hsieh
IPC分类号： H01L21/336 , H01L27/146 , H01L31/0203 , H01L31/062
CPC分类号： H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening. The lens barrel has a top surface, a bottom surface opposed to the top surface and a transparent region, a external thread formed between the top surface and the bottom surface, the lens barrel being arranged within the chamber of the frame layer, the external thread being screwed on the internal thread of the chamber.
摘要翻译：图像传感器模块包括基板，框架层，感光芯片，透明层和镜筒。基板具有以矩阵形式布置的多个引线框架，以形成形成有开口的上表面和形成有从开口穿入的空腔的下表面。框架层与衬底一体地形成，并且布置在衬底的上表面的周边以与衬底一起限定腔室，内腔形成在腔室的内壁上。感光芯片安装在基板的腔内，并以倒装芯片的方式电耦合每个引线框架。透明层被覆盖在基板的上表面上以覆盖开口。镜筒具有顶表面，与顶表面相对的底表面和透明区域，形成在顶表面和底表面之间的外螺纹，镜筒设置在框架层的腔室内，外螺纹被拧在腔室的内螺纹上。

9. 发明授权

US07345360B2 Multiple chips image sensor package 有权
标题翻译：多芯片图像传感器封装
公开(公告)号：US07345360B2
公开(公告)日：2008-03-18
申请号：US10705379
申请日：2003-11-10
申请人： Jichen Wu , Figo Hsieh
发明人： Jichen Wu , Figo Hsieh
IPC分类号： H01L23/06
CPC分类号： H01L27/14634 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H04N5/2253 , H04N5/2254 , H01L2924/00014
摘要： A multi-chip image sensor module includes a first substrate; a photosensitive chip arranged on an upper surface of the first substrate; a lens holder mounted on the upper surface of the first substrate to encapsulate the photosensitive chip; a lens barrel arranged within the lens holder and formed with a chamber and an opening communicating with the chamber; an aspheric lens and a transparent layer placed within the chamber; a second substrate mounted on the first substrate and electrically connected to the first substrate; and a lower chip located on a second surface of the second substrate.
摘要翻译：多芯片图像传感器模块包括第一基板; 设置在所述第一基板的上表面上的感光芯片; 安装在所述第一基板的上表面上以封装所述感光芯片的透镜架; 透镜筒，布置在所述透镜保持器内并且形成有室和与所述室连通的开口; 非球面透镜和置于室内的透明层; 安装在所述第一基板上并电连接到所述第一基板的第二基板; 以及位于所述第二基板的第二表面上的下芯片。

10. 发明授权

US07196322B1 Image sensor package 有权
标题翻译：图像传感器封装
公开(公告)号：US07196322B1
公开(公告)日：2007-03-27
申请号：US10961649
申请日：2004-10-08
申请人： Chung Hsien Hsin , Figo Hsieh , Wei Chang
发明人： Chung Hsien Hsin , Figo Hsieh , Wei Chang
IPC分类号： H01L23/00
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An image sensor module includes a substrate, frame layer, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface, and a lower surface on which second electrodes are formed. The frame layer is arranged on the upper surface of the substrate, a cavity formed between the frame layer and substrate. The photosensitive chip is mounted on the upper surface of the substrate and located within the cavity. The lens holder has an upper end face, a lower upper face, and an opening penetrating through the lens holder from the upper end face to the lower end face, the upper end of the opening is formed with an internal thread and the lower end of the opening is formed with a breach, so that the internal diameter of the upper end of the opening is smaller than the lower end of the opening, the lens holder is adhered on the upper surface of the substrate by glue, therefore, the frame layer is located within the breach of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread is screwed to the internal thread of the lens holder.
摘要翻译：图像传感器模块包括基板，框架层，感光芯片，透镜保持架和镜筒。基板具有上表面和形成有第二电极的下表面。框架层布置在基板的上表面上，在框架层和基板之间形成空腔。感光芯片安装在基板的上表面上并位于空腔内。透镜架具有上端面，下下表面和从上端面向下端面贯穿透镜保持架的开口，开口的上端形成有内螺纹，下端开口形成有裂缝，使得开口的上端的内径小于开口的下端，透镜保持器通过胶粘在基板的上表面上，因此，框架层位于透镜架的突破之内。镜筒具有上端面，下端面，外螺纹与透镜保持架的内螺纹螺纹连接。

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