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1. 发明申请

US20060082986A1 Housing for memory card 审中-公开
标题翻译：存储卡外壳
公开(公告)号：US20060082986A1
公开(公告)日：2006-04-20
申请号：US10963498
申请日：2004-10-14
申请人： Chi Chen , Chen Chuan , Kuo-Feng Peng , Chia Chang
发明人： Chi Chen , Chen Chuan , Kuo-Feng Peng , Chia Chang
IPC分类号： H05K7/14
CPC分类号： H05K5/026
摘要： A memory card includes a base plate on which IC chips are connected and a housing is mounted to the base plate. The housing has at least one recess defined in an underside of the housing and sealed by a top which is in flush with the outside of the housing. At leas tone of the IC chips is accommodated in the recess.
摘要翻译：存储卡包括连接有IC芯片的基板，并且壳体安装到基板。壳体具有限定在壳体的下侧中的至少一个凹部，并通过与壳体的外部齐平的顶部密封。 IC芯片的leas色调容纳在凹槽中。

2. 发明申请

US20050093119A1 Window type case for memory card 审中-公开
标题翻译：存储卡的窗口型案例
公开(公告)号：US20050093119A1
公开(公告)日：2005-05-05
申请号：US10698711
申请日：2003-10-31
申请人： Wen Chen , Kuo-Feng Peng , Chia Chang , Chi Chen
发明人： Wen Chen , Kuo-Feng Peng , Chia Chang , Chi Chen
IPC分类号： G06K19/077 , G11C5/00 , H01L23/02 , H01L23/24 , H01L23/538
CPC分类号： H01L23/24 , G06K19/07745 , H01L23/5388 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A memory card includes a base plate on which IC chips are connected and a case is mounted to the base plate. At least one window is defined through the case so that at least one of the IC chips is accommodated in the window. A seal plate is attached on the case and seals the at least one window.
摘要翻译：存储卡包括其上连接有IC芯片的基板，并且壳体安装到基板。通过该壳体限定至少一个窗口，使得IC芯片中的至少一个容纳在窗口中。密封板附接在壳体上并密封至少一个窗口。

3. 发明授权

US06441496B1 Structure of stacked integrated circuits 失效
标题翻译：堆叠集成电路的结构
公开(公告)号：US06441496B1
公开(公告)日：2002-08-27
申请号：US09768987
申请日：2001-01-23
申请人： Wen Chuan Chen , Kuo Feng Peng , Jichen Wu , Chia Jung Chang
发明人： Wen Chuan Chen , Kuo Feng Peng , Jichen Wu , Chia Jung Chang
IPC分类号： H01L23495
CPC分类号： H01L24/29 , H01L24/32 , H01L24/83 , H01L25/0657 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83139 , H01L2224/8319 , H01L2224/8385 , H01L2225/0651 , H01L2225/06575 , H01L2924/01033 , H01L2924/01075 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/00014
摘要： The structure of stacked integrated circuits includes a substrate, a lower integrated circuit, a plurality of wirings, an adhesive layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals. The lower integrated circuit has a first surface and a second surface. The first surface is adhered to the first surface of the substrate while the second surface is formed with a plurality of bonding pads. The wirings have first ends and second ends. The first ends are electrically connected to the bonding pads of the lower integrated circuit while the second ends are electrically connected to the signal input terminals of the substrate. The adhesive layer is coated on the second surface of the lower integrated circuit and includes adhesive agent and filling elements. The upper integrated circuit is stacked above the second surface of the lower integrated circuit with the adhesive layer inserted between the upper and lower integrated circuit. The lower integrated circuit is adhered to the upper integrated circuit by the adhesive agent. A predetermined gap is formed between the lower and upper integrated circuit by the filling elements. According to this structure, the wirings located under the lower integrated circuit are free from being pressed and damaged by the upper integrated circuit when stacking a plurality of integrated circuits. Thus, the stacking processes can be facilitated and the manufacturing costs can also be lowered.
摘要翻译：堆叠集成电路的结构包括基板，下部集成电路，多个布线，粘合层和上部集成电路。衬底具有形成有信号输入端的第一表面和形成有信号输出端的第二表面。下集成电路具有第一表面和第二表面。第一表面粘附到基板的第一表面，而第二表面形成有多个接合焊盘。布线具有第一端和第二端。第一端电连接到下集成电路的接合焊盘，而第二端电连接到衬底的信号输入端。粘合剂层涂覆在下部集成电路的第二表面上并且包括粘合剂和填充元件。上集成电路堆叠在下集成电路的第二表面上方，粘合层插入在上下集成电路之间。下集成电路通过粘合剂粘附到上集成电路。通过填充元件在下集成电路和上集成电路之间形成预定的间隙。根据该结构，当堆叠多个集成电路时，位于下部集成电路下方的配线不受上部集成电路的压制和损坏。因此，可以促进堆叠处理，并且还可以降低制造成本。

4. 发明申请

US20060090334A1 Processes for packing memory cards by single mold 审中-公开
标题翻译：通过单模包装存储卡的过程
公开(公告)号：US20060090334A1
公开(公告)日：2006-05-04
申请号：US10976752
申请日：2004-11-01
申请人： Chi Chen , Chen Chuan , Kuo-Feng Peng , Chia Chang
发明人： Chi Chen , Chen Chuan , Kuo-Feng Peng , Chia Chang
IPC分类号： H01L23/48
CPC分类号： H05K3/284 , H01L21/56 , H01L21/565 , H01L25/0652 , H01L2224/48227 , H01L2924/14 , H05K1/117 , H05K3/0052 , H05K2201/10159 , Y10T29/49171 , Y10T29/49176
摘要： Processes for packing -memory cards includes a step of preparing a base circuit board; a step of disposing passing members on the base circuit; a step of installing chips on each of the passive members; a step of using a single mold to glue or mold the chips on the passive members so as to form a plurality of circuit areas; a step of cutting the circuit areas from the base circuit board to be circuit pieces, and a step of installing each of the circuit pieces into casings respectively to obtain memory cards. The processes require only a single mold so as to reduce the expense of the mold and is suitable for mass production.
摘要翻译：用于打包内存卡的过程包括准备基本电路板的步骤; 将通过构件设置在基座电路上的步骤; 在每个被动构件上安装芯片的步骤; 使用单个模具将芯片胶合或模制在被动构件上以形成多个电路区域的步骤; 将基板电路板的电路区域切断为电路片的步骤，以及将各电路片分别安装到壳体中以获得存储卡的步骤。该方法仅需要一个模具，以便降低模具的费用，并且适合于批量生产。

5. 发明申请

US20060083044A1 MMC memory card with TSOP package 审中-公开
标题翻译： MMC存储卡采用TSOP封装
公开(公告)号：US20060083044A1
公开(公告)日：2006-04-20
申请号：US10963523
申请日：2004-10-14
申请人： Chi Chen , Wen Chen , Kuo-Feng Peng , Chia Chang
发明人： Chi Chen , Wen Chen , Kuo-Feng Peng , Chia Chang
IPC分类号： G11C5/02
CPC分类号： G06K19/07 , G06K19/07732 , H01L2924/16152 , H01L2924/16153 , H01L2924/16195 , H01L2924/19105
摘要： The MMC memory card with TSOP package includes a circuit board with a plurality of passive elements and ICs installed thereon and a plastic housing is covered over and enclosing the circuit board to form a memory card structure. At least one flash memory of the ICs is used with a TSOP package and the housing has a space to position the TSOP type flash memory such that said TSOP type flash memory is assembled with the housing and the total thickness of the assembly meets the requirement of the standard specification.
摘要翻译：具有TSOP封装的MMC存储卡包括具有安装在其上的多个无源元件和IC的电路板，并且塑料外壳被覆盖并包围电路板以形成存储卡结构。 IC的至少一个闪存与TSOP封装一起使用，并且外壳具有用于定位TSOP型闪存的空间，使得所述TSOP型闪存与外壳组装，并且组件的总厚度满足标准规格。

6. 发明授权

US06646316B2 Package structure of an image sensor and packaging 有权
标题翻译：图像传感器和包装的封装结构
公开(公告)号：US06646316B2
公开(公告)日：2003-11-11
申请号：US09770049
申请日：2001-01-24
申请人： Jichen Wu , Hsiu Wen Tu , Kuo Feng Peng , C. H. Chen , Wen Chuan Chen
发明人： Jichen Wu , Hsiu Wen Tu , Kuo Feng Peng , C. H. Chen , Wen Chuan Chen
IPC分类号： H01L310203
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board. The image sensing chip receives image signals via the transparent layer, transforms the image signals into electrical signals, and transmits the electrical signals from the flexible circuit board to the printed circuit board.
摘要翻译：图像传感器的封装结构的特征在于，通过倒装芯片接合将图像感测芯片直接封装在柔性电路板上。图像传感器的封装结构包括图像感测芯片，柔性电路板和透明层。在图像感测芯片上形成多个电路。每个电路由接合焊盘形成。柔性电路板具有上表面和下表面。信号输入端子分别形成在下表面和对应于图像感测芯片的每个接合焊盘的位置处，用于电连接到图像感测芯片的相应接合焊盘。信号输入端子分别电连接到信号输出端子，用于电连接到印刷电路板。透明层用于覆盖柔性电路板的上表面。图像感测芯片通过透明层接收图像信号，将图像信号转换为电信号，并将电信号从柔性电路板传输到印刷电路板。

7. 发明授权

US06489572B2 Substrate structure for an integrated circuit package and method for manufacturing the same 失效
标题翻译：集成电路封装的基板结构及其制造方法
公开(公告)号：US06489572B2
公开(公告)日：2002-12-03
申请号：US09768981
申请日：2001-01-23
申请人： Mon Nan Ho , Chih-Hong Chen , Yen Cheng Huang , Li Huan Chen , Kuo Feng Peng , Jichen Wu , Allis Chen , Wen Chuan Chen
发明人： Mon Nan Ho , Chih-Hong Chen , Yen Cheng Huang , Li Huan Chen , Kuo Feng Peng , Jichen Wu , Allis Chen , Wen Chuan Chen
IPC分类号： H05K103
CPC分类号： H01L23/49861 , H01L2224/48091 , H01L2224/48465 , Y10T29/49128 , Y10T29/49158 , Y10T29/4916 , Y10T156/109 , H01L2924/00014 , H01L2924/00
摘要： A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained. A method for manufacturing the substrate is also disclosed.
摘要翻译：一种用于集成电路封装的衬底结构。基板电连接到电路板和集成电路。基板包括多个金属片和胶。金属板彼此相对布置。每个金属片包括第一表面和第二表面。胶被用于密封多个金属片以形成基底。金属板的第一表面和第二表面暴露于胶的外部，以形成用于电连接到集成电路的多个信号输入端子和用于电连接到电路板的多个信号输出端子。因此，金属片的信号输出端子可以平滑地电连接到电路板。此外，可以缩短集成电路和电路板之间的信号传输距离，从而可以获得更好的信号传输效果。还公开了一种用于制造衬底的方法。

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