会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 9. 发明授权
    • Plasma etching installation
    • 等离子刻蚀安装
    • US06531031B1
    • 2003-03-11
    • US09623734
    • 2000-11-22
    • Volker BeckerFranz LaermerAndrea SchilpThomas Beck
    • Volker BeckerFranz LaermerAndrea SchilpThomas Beck
    • H01L2100
    • H01J37/321
    • A plasma processing system for etching a substrate using a highly dense plasma in a reactor. An ICP coil having a first coil end and a second coil end generating a high-frequency electromagnetic alternating field in the reactor which acts on a reactive gas and, as an inductively coupled plasma source, produces the highly dense plasma from reactive particles and ions. The two coil ends each communicate via a feed point with a high-frequency infeed, which applies in each case a high-frequency a.c. voltage of the same frequency to the first coil end and to the second coil end (21, 21′). The two high-frequency a.c. voltages applied at the two coil ends are connected to a symmetrical, capacitive network via a &lgr;2 -delay line linking the first feed point and the second feed point and are, at least nearly in phase opposition to one another, and have at least nearly the same amplitudes.
    • 一种用于在反应器中使用高密度等离子体蚀刻衬底的等离子体处理系统。 具有第一线圈端和第二线圈端的ICP线圈,其在反应器中产生作用于反应气体的高频电磁交变场,并且作为电感耦合等离子体源,从反应性粒子和离子产生高密度等离子体。 两个线圈端各自通过馈电点与高频电源进行通信,每种情况都适用于高频电源。 相同频率的电压到第一线圈端和第二线圈端(21,21')。 两个高频a.c. 施加在两个线圈端处的电压通过连接第一馈电点和第二馈电点的lambd2 - 线路连接到对称的电容网络,并且至少几乎相互相反地并且具有至少接近于 相同的幅度。
    • 10. 发明授权
    • Method of anisotropically etching silicon
    • 各向异性蚀刻硅的方法
    • US5501893A
    • 1996-03-26
    • US284490
    • 1994-08-05
    • Franz LaermerAndrea Schilp
    • Franz LaermerAndrea Schilp
    • H01L21/302B81C1/00H01L21/3065H01L21/308C25F3/12B44C1/22
    • H01L21/3085B81C1/00619H01L21/3065H01L21/30655B81C2201/0112Y10T428/24521
    • A method of anisotropic plasma etching of silicon to provide laterally defined recess structures therein through an etching mask employing a plasma, the method including anisotropic plasma etching in an etching step a surface of the silicon by contact with a reactive etching gas to removed material from the surface of the silicon and provide exposed surfaces; polymerizing in a polymerizing step at least one polymer former contained in the plasma onto the surface of the silicon during which the surfaces that were exposed in a preceding etching step are covered by a polymer layer thereby forming a temporary etching stop; and alternatingly repeating the etching step and the polymerizing step. The method provides a high mask selectivity simultaneous with a very high anisotropy of the etched structures.
    • PCT No.PCT / DE93 / 01129 Sec。 371日期:1994年8月5日 102(e)日期1994年8月5日PCT提交1993年11月27日PCT公布。 出版物WO94 / 14187 日期:1994年6月23日。一种通过使用等离子体的蚀刻掩模在其中提供横向限定的凹陷结构的硅的各向异性等离子体蚀刻的方法,所述方法包括在蚀刻步骤中的各向异性等离子体蚀刻,所述硅的表面通过与反应性 蚀刻气体以从硅表面去除材料并提供暴露的表面; 在聚合步骤中将包含在等离子体中的至少一种聚合物前体聚合到硅的表面上,在该表面处,在前面的蚀刻步骤中暴露的表面被聚合物层覆盖,从而形成临时蚀刻停止; 并交替重复蚀刻步骤和聚合步骤。 该方法与蚀刻结构的非常高的各向异性同时提供高掩模选择性。