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1. 发明专利

JP2010260955A Resin composition, production method of resin composition, and prepreg and laminate each using the same 审中-公开
标题翻译：树脂组合物，树脂组合物的生产方法，以及使用它们的PREPREG和层压板
公开(公告)号：JP2010260955A
公开(公告)日：2010-11-18
申请号：JP2009112750
申请日：2009-05-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKAHASHI YOSHIHIRO , KAMIGATA YASUO , MIYATAKE MASATO , UCHIMURA RYOICHI
IPC分类号： C08L101/00 , C08J5/24 , C08K3/36 , C08K9/00
摘要： PROBLEM TO BE SOLVED: To provide a resin composition having good drillability, low heat expansibility, and excellent heat resistance and suited for semiconductor packages and printed wiring boards and to provide a prepreg and a laminate each using the same.
SOLUTION: What are provided are a resin composition comprising a thermosetting resin, a silica filler, and a core/shell resin particles having a primary particle diameter of 0.01-1 μm, wherein the secondary particle diameter of the core/shell resin particles is 0.01-1 μm and a method for producing a resin composition comprising the step of dispersing a silica filler in an organic solvent under agitation to prepare a silica filler dispersion, the step of adding core/shell resin particles to the silica filler dispersion and dispersing the particles in the dispersion under agitation till the secondary particle diameter of the core/shell resin particles reaches 0.01-1 μm, and the step of further adding a thermosetting resin to the resultant dispersion under agitation.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有良好的可钻性，低热膨胀性和优异的耐热性并且适用于半导体封装和印刷线路板的树脂组合物，并提供使用该树脂组合物的预浸料和层压材料。解决方案：提供一种包含热固性树脂，二氧化硅填料和一次粒径为0.01-1μm的核/壳树脂颗粒的树脂组合物，其中芯/壳树脂的二次粒径颗粒为0.01-1μm的树脂组合物的制造方法和包括在搅拌下将二氧化硅填料分散在有机溶剂中以制备二氧化硅填料分散体的步骤的方法，将核/壳树脂颗粒添加到二氧化硅填料分散体中的步骤和在搅拌下将颗粒分散在分散体中直到核/壳树脂颗粒的二次粒径达到0.01-1μm，并且在搅拌下向所得分散体中进一步加入热固性树脂的步骤。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2007146095A Resin composition, prepreg, and laminated board and printed circuit board produced by using the same 有权
标题翻译：树脂组合物，PREPREG和层压板以及使用其制造的印刷电路板
公开(公告)号：JP2007146095A
公开(公告)日：2007-06-14
申请号：JP2005372674
申请日：2005-12-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , MURAI AKIRA , SUGAWARA IKUO , SHIMAOKA SHINJI
IPC分类号： C08L101/00 , C08J5/24 , C08K3/22 , C08K3/36 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition giving a metal-clad laminated board having excellent heat-resistance, peeling strength, etc.
SOLUTION: The resin composition contains an inorganic filler and a thermosetting resin as essential components. The inorganic filler comprises aluminum hydroxide having an average particle diameter of 1.0-5.0μm, containing ≤0.2 mass% particles of ≤0.5μm diameter, having a BET specific surface area of ≤1.5 m
2 /g and containing ≤20 ppm of coarse particles having particle diameter of ≥45μm. The invention further provides a prepreg, and a laminated board and a printed circuit board produced by using the composition, etc.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种赋予覆盖层叠板的耐热性，剥离强度等优异的树脂组合物。解决方案：树脂组合物含有无机填料和热固性树脂作为必要成分。无机填料包括平均粒径为1.0-5.0μm的氢氧化铝，其含有≤0.2质量％的直径≤0.5μm的颗粒，其BET比表面积为≤1.5m2 / SP / g，含有≤20ppm的粒径≥45μm的粗粒子。本发明还提供一种预浸料，以及通过使用该组合物等制成的层压板和印刷电路板。（C）2007，JPO＆INPIT

3. 发明专利

JP2005247889A Thermosetting resin composition, prepreg, and laminate using the same 审中-公开
标题翻译：热固性树脂组合物，PREPREG和使用它的层压板
公开(公告)号：JP2005247889A
公开(公告)日：2005-09-15
申请号：JP2004056058
申请日：2004-03-01
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SUGAWARA IKUO , IKEDA KENICHI , KATO AKIRA , OSE MASAHISA , SHIMAOKA SHINJI , SUGANO TOMOYOSHI , FUKUDA TOMIO , KOBAYASHI KAZUHITO , MIYATAKE MASATO
IPC分类号： C08J5/24 , B32B15/08 , B32B15/092 , C08K3/22 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a thermosetting resin composition flame-retarded without using any halogen-containing flame retardant, excellent in heat resistance, and coping with an environmental problem, to provide a prepreg, and to provide a laminate using the prepreg.
SOLUTION: The thermosetting resin composition is one comprising (a) an epoxy resin, (b) a curing agent, and (c) highly heat-resistant aluminum hydroxide having a 1% weight loss temperature of 250°C or higher, wherein 50 to 200 pts.wt. highly heat-resistant aluminum hydroxide (c) is present per 100 pts.wt. organic resin solids of the thermosetting resin composition.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种阻燃型热固性树脂组合物，不使用任何含卤素阻燃剂，耐热性优异并且能够应对环境问题，提供预浸料，并提供使用预浸料。解决方案：热固性树脂组合物是包含（a）环氧树脂，（b）固化剂和（c）具有1％重量损失温度为250℃或更高的高耐热氢氧化铝的组合物，其中50〜200重量份每100重量份存在高耐热氢氧化铝（c）热固性树脂组合物的有机树脂固体。版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2010159427A Resin composition, prepreg, laminate and printed wiring board using the same 有权
标题翻译：树脂组合物，PREPREG，层压板和印刷线路板
公开(公告)号：JP2010159427A
公开(公告)日：2010-07-22
申请号：JP2010066892
申请日：2010-03-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , FUKUDA TOMIO , TAKANO MARE , KOBAYASHI KAZUHITO
IPC分类号： C08L63/00 , C08G59/40 , C08J5/24 , C08K3/22 , C08L83/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which contains a highly dispersed inorganic filler such as a metal hydrate, has high heat resistance, does not contain a halogen, and has flame retardancy, and to provide a laminate and a printed wiring board each using the same. SOLUTION: This resin composition is characterized by containing (A) an epoxy resin, (B) a curing agent, (C) a metal hydrate, (D) a silicone polymer having phenyl groups in the siloxane skeleton and having two or more functional groups at least one terminal, as essential components, wherein the content of the component (C) is 50 to 150 wt.% based on the total amount of the components (A) and (B). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：待解决的问题：为了提供一种包含高度分散的无机填料如金属水合物的树脂组合物，具有高耐热性，不含卤素并具有阻燃性，并且提供层压体和印刷接线板各使用相同。解决方案：该树脂组合物的特征在于含有（A）环氧树脂，（B）固化剂，（C）金属水合物，（D）在硅氧烷骨架中具有苯基的硅氧烷聚合物，并具有两个或更多官能团至少一个末端作为必需成分，其中组分（C）的含量相对于组分（A）和（B）的总量为50至150重量％。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009235401A Resin composition for prepreg, prepreg, laminate, and printed-wiring board 有权
标题翻译： PREPREG，PREPREG，层压板和印刷线路板的树脂组合物
公开(公告)号：JP2009235401A
公开(公告)日：2009-10-15
申请号：JP2009051022
申请日：2009-03-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KAMIGATA YASUO , TAKAHASHI YOSHIHIRO , FUJIMOTO DAISUKE , AKASHI TAKEAKI , ARATA MICHITOSHI
IPC分类号： C08J5/24 , B32B15/08 , C08K9/00 , C08L63/00 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for a prepreg having an excellent processability in producing a printed-wiring board, capable of imparting a good high modulus and a low coefficient of thermal expansion on the produced printed-wiring board, and to provide a prepreg, a laminate and a printed-wiring board using the resin composition for the prepreg. SOLUTION: Provided is the resin composition for the prepreg comprising inorganic fillers compounded to a resin component, wherein at least one kind of the inorganic fillers consists of porous silica particles whole or part of which are covered with an inorganic compound or an organic compound. Provided is the prepreg consists of a substrate and a resin composition which is impregnated in the substrate and dried, wherein the resin composition is the resin composition for the prepreg. Provided is the laminate which comprises the prepreg as the material for the laminate and obtained by molding under heating and pressure. Provided is the printed-wiring board which comprises the laminate and a circuit formed on at least a part of the laminate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决问题：为了提供一种能够在制造的印刷电路板上赋予良好的高模量和低的热膨胀系数的在制造印刷电路板方面具有优异加工性能的预浸料树脂组合物，并提供使用该预浸料坯用树脂组合物的预浸料坯，层压板和印刷布线板。解决方案：提供了包含与树脂组分混合的无机填料的预浸料坯的树脂组合物，其中至少一种无机填料由全部或部分被无机化合物或有机物覆盖的多孔二氧化硅颗粒组成复合。提供的是，预浸料由基材和浸渍在基材中而干燥的树脂组合物组成，其中树脂组合物是预浸料的树脂组合物。提供了包含预浸料作为层压材料并通过在加热和加压下成型获得的层压材料。提供了包括层压体的印刷电路板和形成在层压体的至少一部分上的电路。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2006131749A Resin composition, prepreg, laminate and printed wiring board using the same 有权
标题翻译：树脂组合物，PREPREG，层压板和印刷线路板
公开(公告)号：JP2006131749A
公开(公告)日：2006-05-25
申请号：JP2004322176
申请日：2004-11-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , FUKUDA TOMIO , TAKANO MARE , KOBAYASHI KAZUHITO
IPC分类号： C08L63/00 , B32B15/092 , C08J5/24 , C08K3/20 , C08L83/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which contains a highly dispersed inorganic filler such as a metal hydroxide, has high heat resistance, does not contain a halogen, and has flame retardancy, and to provide a laminate and a printed wiring board each using the same. SOLUTION: This resin composition is characterized by containing (A) an epoxy resin, (B) a curing agent, (C) a metal hydroxide, (D) a silicone polymer having phenyl groups in the siloxane skeleton and having two or more functional groups at at least one terminal, as essential components, wherein the content of the component (C) is 50 to 150 wt.% based on the total amount of the components (A) and (B). COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供含有高度分散的无机填料如金属氢氧化物的树脂组合物，具有高耐热性，不含卤素并且具有阻燃性，并且提供层压体和印刷接线板各使用相同。该树脂组合物的特征在于含有（A）环氧树脂，（B）固化剂，（C）金属氢氧化物，（D）在硅氧烷骨架中具有苯基的硅氧烷聚合物，其具有两个或至少一个末端的更多官能团作为必要组分，其中组分（C）的含量相对于组分（A）和（B）的总量为50至150重量％。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005036242A Flame retardant resin composition, and prepreg, laminate, metal-clad laminate, printed wiring board and multilayer printed wiring board using the same 有权
标题翻译：阻燃树脂组合物和PREPREG，层压板，金属层压板，印刷线路板和多层印刷线路板
公开(公告)号：JP2005036242A
公开(公告)日：2005-02-10
申请号：JP2004295821
申请日：2004-10-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , FUKUDA TOMIO , MIYATAKE MASATO
IPC分类号： C08J5/24 , B32B15/08 , C08K3/22 , C08K9/06 , C08L83/04 , C08L101/00 , H05K1/03
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a prepreg, a laminate, a copper-clad laminate, a printed wiring board, a multilayer printed wiring board and the like which express excellent flame retardance without requiring a bromine-containing material and realize high heat resistance. SOLUTION: The flame-retardant resin composition contains a silicone polymer, a metal hydrate and a resin material as the essential constituents, wherein the metal hydrate accounts for at least 20 wt.% of the total solids of the composition. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种表现出优异的阻燃性而不需要含溴材料的预浸料，层压材料，覆铜层压板，印刷线路板，多层印刷线路板等，并实现高耐热性。解决方案：阻燃树脂组合物含有硅氧烷聚合物，金属水合物和树脂材料作为必需组分，其中金属水合物占组合物总固体的至少20重量％。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2012021098A Thermosetting resin composition, prepreg using the same, and laminate using the prepreg 有权
标题翻译：热固性树脂组合物，使用相同的PREPREG和使用PREPREG的层压板
公开(公告)号：JP2012021098A
公开(公告)日：2012-02-02
申请号：JP2010160982
申请日：2010-07-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , KOTAKE TOMOHIKO , NAGAI SHUNSUKE , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08G59/50 , C08J5/24 , C08K3/00 , C08L63/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition excellent in adhesiveness, heat resistance, moisture resistance, flame retardancy, dielectric property and the like, and particularly having a characteristic such that the warpage amount of the substrate thereof when heated is extremely small; and to provide a prepreg using the composition and also a laminate using the prepreg.SOLUTION: The thermosetting resin composition contains a setting agent (A) having the N-substituted maleimide groups and acidic substituent, produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amino compound (b) having the acidic substituent represented by general formula (I), and a bisphenol F type phenol novolac epoxy resin (B) (wherein Rs are each independently hydroxyl being an acidic substituent, carboxyl or sulfonic acid; Rs are each independently 1-5C aliphatic hydrocarbon or halogen; and x is an integer of 1 to 5, y is an integer of 0 to 4 and x+y=5). The invention further provides a prepreg using the composition and a laminate using the prepreg.
摘要翻译：要解决的问题：提供粘合性，耐热性，耐湿性，阻燃性，介电性等优异的树脂组合物，特别是具有使其加热时的基材的翘曲量极其特性的特性小; 并提供使用该组合物的预浸料，以及使用该预浸料的层压体。解决方案：热固性树脂组合物含有具有N-取代的马来酰亚胺基和酸性取代基的固化剂（A），其通过使一分子中具有至少两个N-取代的马来酰亚胺基团的马来酰亚胺化合物（a）与一具有由通式（I）表示的酸性取代基的氨基化合物（b）和双酚F型酚醛清漆环氧树脂（B）（其中R 1 作为酸性取代基，羧基或磺酸; R 2各自独立地为1-5C脂族烃或卤素; x为1〜5的整数，y为整数 0〜4，x + y = 5）。本发明还提供使用该组合物的预浸料坯和使用该预浸料的层压材料。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2011157509A Thermosetting insulating resin composition, and prepreg, laminated board, and multilayer printed wiring board using the same 有权
标题翻译：热固性绝缘树脂组合物，以及PREPREG，层压板和多层印刷线路板
公开(公告)号：JP2011157509A
公开(公告)日：2011-08-18
申请号：JP2010021457
申请日：2010-02-02
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KOTAKE TOMOHIKO , MIYATAKE MASATO , TSUCHIKAWA SHINJI , TAKANEZAWA SHIN , MURAI AKIRA
IPC分类号： C08L79/08 , C08G73/10 , C08J5/24 , C08K3/12 , C08K5/18 , C08K5/3445 , C08K5/3492 , C08K7/18 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which has good resin setting properties, that is to say, does not require a high temperature and long time treatment when a prepreg is laminated, and is good in curability and storage stability of varnish and the prepreg and excellent in chemical resistance, heat resistance, adhesion, and low warpage, and to provide the prepreg, a laminated board and a multilayer printed wiring board, each using the composition.
SOLUTION: The thermosetting resin composition contains: (A) a resin composition having an unsaturated maleimide group which is produced by reacting a maleimide compound (a) having at least two N-substituted maleimide groups in one molecule with an amine compound (b) having at least two primary amino groups in one molecule in an organic solvent; a thermosetting resin (B) ; and a specific modified imidazole compound (C). Further, there are also provided the prepreg, the laminated board, and the multilayer printed wiring board obtained by using the composition.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有良好树脂固化性的树脂组合物，也就是说，当预浸料层压时不需要高温和长时间处理，并且具有良好的固化性和储存稳定性清漆和预浸料，耐化学性，耐热性，粘附性和低翘曲性，并且提供预浸料，层压板和多层印刷线路板，各自使用该组合物。解决方案：热固性树脂组合物含有：（A）具有不饱和马来酰亚胺基团的树脂组合物，其通过使一分子中具有至少两个N-取代马来酰亚胺基团的马来酰亚胺化合物（a）与胺化合物 b）在一个分子中在有机溶剂中具有至少两个伯氨基; 热固性树脂（B）; 和特定的改性咪唑化合物（C）。此外，还提供了通过使用该组合物获得的预浸料，层压板和多层印刷布线板。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2011084430A Highly heat resistant aluminum hydroxide particle, preparation method therefor, resin composition containing the same and printed circuit board using the resin composition 有权
标题翻译：高耐热铝氢氧化物颗粒，其制备方法，含有其的树脂组合物和使用树脂组合物的印刷电路板
公开(公告)号：JP2011084430A
公开(公告)日：2011-04-28
申请号：JP2009238287
申请日：2009-10-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KAMIGATA YASUO , TAKAHASHI YOSHIHIRO , MIYATAKE MASATO , UCHIMURA RYOICHI
IPC分类号： C01F7/02 , B32B15/08 , B32B27/18 , C01F7/44 , C08K3/22 , C08L101/00
摘要： PROBLEM TO BE SOLVED: To provide a preparation method for a highly heat resistant aluminum hydroxide particle having heat resistance and flame retardancy suitable to be used for a substrate for a printed circuit board and the like which has characteristics adaptable to lead free soldering. SOLUTION: In the highly heat resistance aluminum hydroxide particle, at least gibbsite type aluminum and boehmite type aluminum hydroxide are present in one aluminum hydroxide particle. The specific surface area by the BET method is 2.0-50.0 m 2 /g, while the amount of dehydration is 31.5-34.0 mass% and the temperature of starting heat decomposition is higher than 260°C. The method is for the preparation of the particle. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有耐热性和阻燃性的耐热氢氧化铝颗粒的制备方法，其适用于具有适合于无铅焊接的特性的印刷电路板等的基板。解决方案：在高耐热氢氧化铝颗粒中，在一种氢氧化铝颗粒中存在至少三水铝矿型铝和勃姆石型氢氧化铝。通过BET法的比表面积为2.0〜50.0m 2 / SP / g，脱水量为31.5〜34.0质量％，起始热分解温度高于260℃。该方法用于制备颗粒。版权所有（C）2011，JPO＆INPIT

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