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1. 发明申请

WO1980000352A1 PROCESS FOR PRODUCING GRAPHITE-CONTAINING ALUMINUM ALLOY 审中-公开
标题翻译：生产含石墨的铝合金的方法
公开(公告)号：WO1980000352A1
公开(公告)日：1980-03-06
申请号：PCT/JP1979000211
申请日：1979-08-09
申请人： HITACHI CHEM CO LTD , HITACHI LTD , KOMURO K , SOENO K , OHSAWA M , SUWA M
发明人： HITACHI CHEM CO LTD , HITACHI LTD
IPC分类号： C22C01/02
CPC分类号： C22C32/0084 , C22C1/026 , C22C1/1036 , Y10T428/12486
摘要： A process for producing graphite-containing aluminum alloy by introducing graphite particles into a molten aluminum. Graphite particles are prevented from floating on the molten aluminum upon being introduced thereinto, by adding titanium, chromium, zirconium, nickel, vanadium, cobalt, manganese, niobium, or phosphorus to the molten aluminum to disperse therein prior to the introduction of graphite particles. The alloy is suited for use as dry frictional members of bearings or the like.

2. 发明专利

JP2013030503A Organic electronics material, ink composition, organic thin film and method for manufacturing the same, organic electronics element, organic electroluminescent element, display element, illumination apparatus, and display device 有权
标题翻译：有机电子材料，墨水组合物，有机薄膜及其制造方法，有机电子元件，有机电致发光元件，显示元件，照明装置和显示装置
公开(公告)号：JP2013030503A
公开(公告)日：2013-02-07
申请号：JP2011163435
申请日：2011-07-26
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ISHIZUKA KENICHI , FUNYU SHIGEAKI , ASANO NAOKI
IPC分类号： H01L51/50 , H01L51/05 , H01L51/30 , H05B33/02
摘要： PROBLEM TO BE SOLVED: To provide an organic electronics material which can stably and easily form a thin film or can easily increase the number of layers of an organic thin film layer, and is useful for enhancing productivity of an organic electronics element, in particular, a polymer organic EL element.SOLUTION: An organic electronics material includes at least one ionic compound represented by a general formula (1b). In the general formula (1b), Y represents a divalent linking group including a carbon atom or a sulfur atom, R represents an electron withdrawing group (which may further have a substituent or a hetero atom in the structure), and Lrepresents a monovalent cation.
摘要翻译：要解决的问题：为了提供可以稳定且容易地形成薄膜或可以容易地增加有机薄膜层的层数的有机电子材料，并且可用于提高有机电子元件的生产率，特别是聚合物有机EL元件。解决方案：有机电子材料包括由通式（1b）表示的至少一种离子化合物。在通式（1b）中，Y表示包含碳原子或硫原子的二价连接基团，R表示吸电子基团（其结构中也可以具有取代基或杂原子），L + 表示一价阳离子。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2013026522A Manufacturing method of p-type diffusion layer and manufacturing method of solar cell element 有权
标题翻译： P型扩散层的制造方法及太阳能电池元件的制造方法
公开(公告)号：JP2013026522A
公开(公告)日：2013-02-04
申请号：JP2011161316
申请日：2011-07-22
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： SATO TETSUYA , YOSHIDA MASATO , NOJIRI TAKESHI , MACHII YOICHI , IWAMURO MITSUNORI , ODA AKIHIRO , ADACHI SHUICHIRO
IPC分类号： H01L21/225 , H01L31/04
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a p-type diffusion layer and a manufacturing method of a solar cell element, capable of suppressing warpage of a substrate and generating little residue derived from a dispersion medium in a manufacturing process of a solar cell element using a silicon substrate.SOLUTION: A p-type diffusion layer is formed on a silicon substrate by using a p-type diffusion layer forming composition containing dispersion media and glass powders containing acceptor elements and ultrasonic cleaning is carried out.
摘要翻译：要解决的问题：提供一种形成p型扩散层的方法和太阳能电池元件的制造方法，其能够抑制基板的翘曲并在制造过程中产生从分散介质衍生的少量残留物使用硅衬底的太阳能电池元件。解决方案：通过使用含有分散介质的p型扩散层形成组合物和含有受体元素的玻璃粉末和超声波清洗，在硅衬底上形成p型扩散层。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013026471A P-type diffusion layer formation composition, manufacturing method of p-type diffusion layer, and manufacturing method of solar cell element 审中-公开
标题翻译： P型扩散层形成组合物，P型扩散层的制造方法和太阳能电池元件的制造方法
公开(公告)号：JP2013026471A
公开(公告)日：2013-02-04
申请号：JP2011160295
申请日：2011-07-21
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： ADACHI SHUICHIRO , YOSHIDA MASATO , NOJIRI TAKESHI , MACHII YOICHI , IWAMURO MITSUNORI , ODA AKIHIRO , SATO TETSUYA
IPC分类号： H01L21/225 , H01L21/316 , H01L31/04
CPC分类号： Y02E10/547
摘要： PROBLEM TO BE SOLVED: To provide a p-type diffusion layer formation composition, a manufacturing method of a p-type diffusion layer, and a manufacturing method of a solar cell element capable of forming a p-type diffusion layer without causing an internal stress and a warpage in a silicon substrate in a manufacturing step of a solar cell element using the silicon element and obtaining a sufficient ohmic contact even if the step is simplified.SOLUTION: A p-type diffusion layer formation composition contains a glass powder including an acceptor element and a dispersion medium. A p-type diffusion layer and a solar cell element having this p-type diffusion layer are manufactured by coating this p-type diffusion layer formation composition on a semiconductor substrate and performing thermal diffusion treatment.
摘要翻译：要解决的问题：提供p型扩散层形成组合物，p型扩散层的制造方法以及能够形成p型扩散层的太阳能电池元件的制造方法，而不会引起在使用硅元件的太阳能电池元件的制造步骤中的硅衬底中的内部应力和翘曲，并且即使该步骤简化，也获得足够的欧姆接触。解决方案：p型扩散层形成组合物含有包含受体元素和分散介质的玻璃粉末。通过在p型扩散层形成组合物上涂覆半导体衬底并进行热扩散处理，制造具有p型扩散层的p型扩散层和太阳能电池元件。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2013026404A Semiconductor device and manufacturing method of the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2013026404A
公开(公告)日：2013-02-04
申请号：JP2011159181
申请日：2011-07-20
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TANAKA TOSHIAKI , EBIHARA MASAHIKO
IPC分类号： H01L23/12
CPC分类号： H01L2224/13
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device having a high degree of freedom in arranging an external electrode in a semiconductor device called as a wafer level chip size package (CSP) having a stress relaxing function and to provide a manufacturing method of the same.SOLUTION: The semiconductor device 1 comprises: an insulating resin layer 20; a re-wiring layer 13; an insulating re-wiring protective layer 21; a conductive post 18; an external electrode 17; and a covering resin layer 22. The insulating resin layer 20 includes: a first opening part 31 which opens in a lamination direction Y and opens on a first electrode 30; and a planer surface 51 in the peripheral of the opening of the first opening part 31. The re-wiring layer 13 includes a first connecting part 13c and a second connecting part 36 extending on the planer surface 51. One end part of the conductive post 18 is electrically connected to the first electrode 30 and the other end part of the conductive post 18 is electrically connected to the first connecting part 13c. An inner diameter D2 of a second opening part 32 is larger than an inner diameter D1 of the first opening part 31. The covering resin layer 22 covers the conductive post 18.
摘要翻译：要解决的问题：提供一种半导体器件，其具有在被称为具有应力松弛功能的晶片级芯片尺寸封装（CSP）的半导体器件中布置外部电极的高自由度，并提供制造方法一样的。解决方案：半导体器件1包括：绝缘树脂层20; 再布线层13; 绝缘重新布线保护层21; 导电柱18; 外部电极17; 覆盖树脂层22.绝缘树脂层20包括：第一开口部31，其沿层叠方向Y开口并在第一电极30上开口; 以及在第一开口部31的开口周边的平面51.再布线层13包括在平面51上延伸的第一连接部13c和第二连接部36.导电柱的一端部 18电连接到第一电极30，并且导电柱18的另一端部电连接到第一连接部13c。第二开口部32的内径D2大于第一开口部31的内径D1。覆盖树脂层22覆盖导电柱18.版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2013016763A Semiconductor element mounting member and semiconductor device 审中-公开
标题翻译：半导体元件安装组件和半导体器件
公开(公告)号：JP2013016763A
公开(公告)日：2013-01-24
申请号：JP2011150499
申请日：2011-07-06
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAOYUKI SUSUMU , INADA TEIICHI
IPC分类号： H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor element mounting member and a semiconductor device which are excellent in thermal conductivity and connection reliability, and capable of thinning to a higher degree.SOLUTION: A semiconductor element mounting member has a conductive metal layer pattern 14 and an insulation part 15 on a carrier substrate. The metal layer pattern is covered by the insulation part at least on a peripheral edge so as to have an exposed part in a portion of the metal layer pattern. The metal layer pattern has a cross sectional shape such that an outermost peripheral part of the metal layer pattern protrudes from a part where the metal layer pattern and the carrier substrate are in contact with each other to the insulation part side when viewed from the side of the metal layer pattern of the member. The insulation part is colored.
摘要翻译：要解决的问题：提供一种导热性和连接可靠性优异并能够更薄化的半导体元件安装部件和半导体器件。解决方案：半导体元件安装部件在载体基板上具有导电金属层图案14和绝缘部15。金属层图案至少在周边边缘被绝缘部件覆盖，以便在金属层图案的一部分中具有暴露部分。金属层图案具有横截面形状，使得金属层图案的最外周部分从金属层图案和载体基板彼此接触的部分突出到绝缘部分侧，当从构件的金属层图案。绝缘部分是有色的。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013016759A Semiconductor element mounting substrate and semiconductor device 审中-公开
标题翻译：半导体元件安装基板和半导体器件
公开(公告)号：JP2013016759A
公开(公告)日：2013-01-24
申请号：JP2011150494
申请日：2011-07-06
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAOYUKI SUSUMU , INADA TEIICHI
IPC分类号： H01L23/12 , H01L23/48 , H01L33/62
CPC分类号： H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor element mounting substrate and a semiconductor device excellent in thermal conductivity and connection reliability and capable of thinning to a higher degree.SOLUTION: A semiconductor element mounting substrate 20 has a semiconductor element mounting member 10 including conductive metal layer patterns 13, 14 and an insulation part 15 on a carrier substrate composed of a detachable base material 11 and an adhesive layer 12, and a reflector 18 on the member 10. The metal layer patterns 13, 14 are covered by the insulation part 15 at least on peripheral edges so as to have exposed parts in portions of the metal layer patterns 13, 14, respectively. The metal layer patterns 13, 14 each has a cross sectional shape such that an outermost peripheral part of each of the metal layer patterns 13, 14 protrudes from a part where the metal layer patterns 13, 14 and the carrier substrate are in contact with each other to the insulation part 15 side when viewed from the side of the metal layer patterns 13, 14 of the member 10. The reflector 18 is arranged in such a manner as not to cover the exposed parts of the metal layer patterns 13, 14.
摘要翻译：要解决的问题：提供一种半导体元件安装基板和具有优异的导热性和连接可靠性并能够更高程度地变薄的半导体器件。解决方案：半导体元件安装基板20具有包括导电金属层图案13,14和绝缘部15的半导体元件安装部件10，该载体基板由可拆卸的基材11和粘接层12构成，反射器18.金属层图案13,14至少在外围边缘被绝缘部分15覆盖，以分别在金属层图案13,14的部分中具有暴露部分。金属层图案13,14各自具有横截面形状，使得每个金属层图案13,14的最外周部分从金属层图案13,14和载体基板与每个金属层图案13,14接触的部分突出从构件10的金属层图案13,14的侧面观察绝缘部15侧的另一方。反射体18以不覆盖金属层图案13,14的露出部的方式配置。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2013016754A Semiconductor element mounting member, semiconductor element mounted substrate and semiconductor device 审中-公开
标题翻译：半导体元件安装部件，半导体元件安装基板和半导体器件
公开(公告)号：JP2013016754A
公开(公告)日：2013-01-24
申请号：JP2011150489
申请日：2011-07-06
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAOYUKI SUSUMU , INADA TEIICHI
IPC分类号： H01L23/12 , H01L21/56 , H01L23/08 , H01L33/60 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device, especially a semiconductor device on which an LED semiconductor element is mounted, which is excellent in thermal conductivity and connection reliability, and capable of thinning to a higher degree.SOLUTION: A semiconductor element mounting member has a conductive metal layer pattern and an insulation part on a carrier substrate. The metal layer pattern is covered by the insulation part at least on a peripheral edge so as to have an exposed part in a portion of the metal layer pattern. The metal layer pattern has a cross sectional shape such that an outermost peripheral part of the metal layer pattern protrudes from a part where the metal layer pattern and the carrier substrate are in contact with each other to the insulation part side when viewed from the side of the metal layer pattern of the member.
摘要翻译：要解决的问题：提供一种半导体器件，特别是其上安装有LED半导体元件的半导体器件，其导热性和连接可靠性优异，并且能够更高程度地变薄。解决方案：半导体元件安装构件在载体基板上具有导电金属层图案和绝缘部分。金属层图案至少在周边边缘被绝缘部件覆盖，以便在金属层图案的一部分中具有暴露部分。金属层图案具有横截面形状，使得金属层图案的最外周部分从金属层图案和载体基板彼此接触的部分突出到绝缘部分侧，当从构件的金属层图案。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2013016647A Heat conduction sheet and heat radiating device 有权
标题翻译：热传导片和热辐射器件
公开(公告)号：JP2013016647A
公开(公告)日：2013-01-24
申请号：JP2011148474
申请日：2011-07-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： YOSHIKAWA TORU , YAMAMOTO REI , YAJIMA TOMOAKI , YUI MOTOAKI
IPC分类号： H01L23/36 , C08J5/18 , C08K3/04 , C08K3/38 , C08K7/00 , C08L23/20 , C08L25/08
摘要： PROBLEM TO BE SOLVED: To provide a heat conduction sheet that is capable of bringing a heating member and a heat dissipation member into thermal contact with each other at a low thermal resistance and is excellent in heat resistance, moisture resistance and peeling removability, and to provide a heat radiating device that has high heat dissipation capability and is capable of facilitating removal of the heat conduction sheet when the heating member and the heat dissipation member are removed for repair.SOLUTION: A heat conduction sheet includes: styrene-isobutene copolymer (A); at least one type of inorganic particles (B) selected from a group consisting of graphite particles and hexagonal crystal boron nitride particles; and polyisobutene (C). A heat radiating device is constructed by layering a heating element, the heat conduction sheet and a radiator in this order.
摘要翻译：要解决的问题：提供一种能够使加热部件和散热部件以低热阻相互热接触的导热片，并且耐热性，耐湿性和剥离除去性优异并且提供一种具有高散热能力的散热装置，并且当去除加热构件和散热构件以进行修理时能够便于去除导热片。解决方案：导热片包括：苯乙烯 - 异丁烯共聚物（A）; 至少一种选自石墨颗粒和六方晶氮化硼颗粒的无机颗粒（B）; 和聚异丁烯（C）。散热装置通过依次层叠加热元件，导热片和散热器构成。版权所有（C）2013，JPO＆INPIT

10. 发明专利

JP2013008908A Manufacturing method of circuit board 有权
标题翻译：电路板制造方法
公开(公告)号：JP2013008908A
公开(公告)日：2013-01-10
申请号：JP2011141721
申请日：2011-06-27
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： NAMATAME KAZUHIKO , SAKURAI TAKEHISA , TSUBOMATSU YOSHIAKI
IPC分类号： H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of reducing dropping off of a solder resist and highly accurately improving a yield and reliability even when non-contact pattern exposure is applied to an unexposed solder resist.SOLUTION: A manufacturing method of a circuit board having a circuit pattern 3 covered by a solder resist pattern 20 comprises the steps of: forming an unexposed solder resist 12 on the circuit pattern 3; forming a pattern-exposed solder resist by performing contact pattern exposure and non-contact pattern exposure for the unexposed solder resist 12; and forming the target solder resist pattern 20 by developing the pattern-exposed solder resist.
摘要翻译：要解决的问题：提供一种能够减少阻焊剂脱落的电路板的制造方法，即使对未曝光的阻焊剂进行非接触图案曝光也能高精度地提高成品率和可靠性。解决方案：具有由阻焊剂图案20覆盖的电路图案3的电路板的制造方法包括以下步骤：在电路图案3上形成未曝光的阻焊层12; 通过对未曝光的阻焊剂12进行接触图案曝光和非接触图案曝光来形成图案曝光的阻焊剂; 并通过显影图案曝光的阻焊剂形成目标阻焊图案20。版权所有（C）2013，JPO＆INPIT

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